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    Para-aromatic polyamide porous film
    12.
    发明公开
    Para-aromatic polyamide porous film 失效
    Poröser电影aus para-aromatischen Polyamid

    公开(公告)号：EP0757071A2

    公开(公告)日：1997-02-05

    申请号：EP96111605.0

    申请日：1996-07-18

    申请人： SUMITOMO CHEMICAL COMPANY, LIMITED

    发明人： Takahashi, Tsutomu ,  Tateno, Tatsuo ,  Tsujimoto, Yoshifumu

    IPC分类号： C08J9/28 ,  C08J5/18 ,  C08J3/09 ,  H01M2/16

    CPC分类号： C08J9/26 ,  C08J5/18 ,  C08J9/28 ,  C08J2201/0542 ,  C08J2377/10 ,  H01M2/162 ,  H01M2/1653 ,  Y10T428/31725

    摘要： A para-oriented aromatic polyamide porous film, which comprises fibrils having a diameter of not more than 1 µm and which has such a structure that the fibrils are planary arranged in the form of a network or nonwoven fabric and laminated in the form of a layer, wherein the thermal linear expansion coefficient at 200 to 300°C of the film is within ±50 x 10 -6 /°C and a percentage of vacant spaces is from 30 to 95% and a battery separator using the porous film are described. Furthermore, a process for producing the porous film is described, which comprises the following steps (a) to (c):

    (a) forming a film-like material from a solution containing 1 to 10% by weight of a para-oriented aromatic polyamide having an inherent viscosity of 1.0 to 2.8 dl/g and 1 to 10% by weight of a chloride of an alkali metal or an alkali earth metal in a polar amide solvent or a polar urea solvent;
    (b) maintaining the film-like material at a temperature of not less than 20°C or not more than -5°C to deposit the para-oriented aromatic polyamide; and
    (c) immersing the film-like material obtained in step (b) in an aqueous solution or an alcoholic solution to elute the solvent and chloride of the alkali metal or alkali earth metal, followed by drying to obtain the para-oriented aromatic polyamide porous film.

    It is to provide a para-aramid porous film having uniformity and fine vacant spaces, which can not be accomplished by a nonwoven fabric, a process for producing the same and a battery separator produced by using the para-aramid porous film, by making use of characteristics of a para-aramid (e.g. high heat resistance, high rigidity, high strength, etc.).

    摘要翻译： 对位取向的芳族聚酰胺多孔膜，其包含直径不大于1μm的原纤维，并且具有这样的结构，使得原纤维以网状或非织造织物的形式平面布置，并以 层，其中膜的200〜300℃的热线膨胀系数在+/- 50×10 -6 /℃以内，空位的百分比为30〜95％，电池隔板使用 描述多孔膜。 此外，描述了一种制备多孔膜的方法，其包括以下步骤（a）至（c）：（a）从含有1至10重量％的对位芳族化合物的溶液形成膜状材料 在极性酰胺溶剂或极性脲溶剂中，特性粘度为1.0〜2.8dl / g的聚酰胺和1〜10重量％的碱金属或碱土金属的氯化物; （b）将膜状材料保持在不低于20℃或不高于-5℃的温度下沉积对位芳族聚酰胺; 和（c）将步骤（b）中获得的薄膜状材料浸渍在水溶液或醇溶液中以洗脱碱金属或碱土金属的溶剂和氯化物，然后干燥，得到对位芳族聚酰胺 多孔膜。 本发明提供一种具有均匀性和微细空间的对位芳族聚酰胺多孔膜，其不能通过使用无机织物，其制造方法和通过使用对位芳族聚酰胺多孔膜制备的电池隔膜来实现 （例如高耐热性，高刚性，高强度等）。

    Prepreg, process for producing the same and printed circuit substrate using the same
    15.
    发明公开
    Prepreg, process for producing the same and printed circuit substrate using the same 失效
    预浸料，制备过程和印刷电路板基板及其用途

    公开(公告)号：EP0768334A2

    公开(公告)日：1997-04-16

    申请号：EP96116329.2

    申请日：1996-10-11

    申请人： SUMITOMO CHEMICAL COMPANY LIMITED

    发明人： Takahashi, Tsutomu ,  Tsujimoto, Yoshifumi ,  Kumada, Hiroaki ,  Sato, Hiroyuki

    IPC分类号： C08J5/24 ,  C08J5/04 ,  H05K1/03

    CPC分类号： B32B15/14 ,  B32B5/022 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/026 ,  B32B2457/08 ,  C08J5/04 ,  C08J5/24 ,  H05K1/0366 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10S428/901 ,  Y10S428/902 ,  Y10S428/91 ,  Y10T428/24917 ,  Y10T428/24993 ,  Y10T428/24994 ,  Y10T428/249944 ,  Y10T428/249953 ,  Y10T428/249955 ,  Y10T428/2907 ,  Y10T428/2938 ,  Y10T428/2969 ,  Y10T428/2971 ,  Y10T428/30 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31725 ,  Y10T442/2008 ,  Y10T442/2893 ,  Y10T442/2902

    摘要： The present invention provides a lightweight prepreg having uniform formation, low linear thermal expansion coefficient and good mechanical strength, comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin, the porous para-oriented aromatic polyamide film being impregnated with the thermoplastic resin and/or the thermosetting resin, a process for producing the same, and a printed circuit substrate/board using the same.
    A process for producing for producing a prepreg comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin, the porous para-oriented aromatic polyamide film being impregnated with the thermoplastic resin and/or thermosetting resin, which comprises the following steps (a) to (d):

    step (a) of forming a film-like material from a solution containing 1 to 10% by weight of a para-oriented aromatic polyamide having an inherent viscosity of 1.0 to 2.8 dl/g and 1 to 10% by weight of a chloride of an alkaline metal or an alkaline earth metal in a polar amide solvent or a polar urea solvent;
    step (b) of maintaining the film-like material at a temperature of not less than 20°C or not more than -5°C to deposit the para-oriented aromatic polyamide from the film-like material;
    step (c) of immersing the film-like material obtained in the step (b) in an aqueous solution or an alcoholic solution to elute the solvent and the chloride of the alkaline metal or alkaline earth metal, followed by drying to obtain a para-aramid porous film; and
    step (d) of impregnating the porous film obtained in the step (c) as a substrate with the thermoplastic resin and/or thermosetting resin to produce a prepreg.

    摘要翻译： 本发明提供具有均匀形成，低线性热膨胀系数和良好的机械强度，包括多孔对位取向芳香族聚酰胺薄膜和热塑性树脂和/或热固性树脂，该多孔对位取向芳香族聚酰胺薄膜感轻质预浸渍体 浸渍有热塑性树脂和/或热固性树脂，其制造方法，以及使用其的印刷电路基板/电路板。 一种生产用于生产预浸料，其包括多孔对位取向芳香族聚酰胺薄膜和热塑性树脂和/或热固性树脂，处理该多孔对位取向的芳族聚酰胺薄膜中浸渍有热塑性树脂和/或热固性树脂，该方法包括 以下步骤（a）至（d）：工序（a）形成由（重量）具有以1.0固有粘度的对位取向芳香族聚酰胺的含有1至10％的溶液的薄膜状材料制成，以2.8升/克 和1〜10％（重量）的碱金属或碱土金属的氯化物在极性酰胺系溶剂或极性尿素溶剂; 步骤（b）在不低于20℃的温度或不膜状材料的保持超过-5℃来沉积从薄膜状材料的对位取向芳香族聚酰胺; 在浸渍步骤（b）中得到的薄膜状材料以wässrige溶液或在醇溶液中进行干燥以获得一个对位，以洗脱溶剂和碱金属或碱土金属的氯化物，随后的步骤（c） 芳族聚酰胺多孔膜; 和浸渍的步骤（d）的多孔膜得到的在步骤（c）为与热塑性树脂和/或热固性树脂以生产的预浸料的基片。