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18 条记录 (耗时 0.013 秒)

    Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate
    11.
    发明公开
    Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate 审中-公开
    对方法和装置真空安装在衬底上的微机电系统

    公开(公告)号：EP1418154A2

    公开(公告)日：2004-05-12

    申请号：EP03256889.1

    申请日：2003-10-30

    申请人： Samsung Electronics Co., Ltd.

    发明人： Jung, Kyu-dong ,  Choi, Hyung ,  Jun, Chan-bong ,  Kang, Seok-jin ,  Hong, Seog-woo ,  Chung, Seok-whan ,  Lee, Moon-chul ,  Lee, Eun-sung

    IPC分类号： B81C5/00 ,  B81C1/00

    CPC分类号： B81C1/00285

    摘要： A method and apparatus for vacuum-mounting at least one micro electro mechanical system (MEMS) on a substrate includes a gas injecting section for injecting an inert gas into a vacuum chamber; a substrate aligning section for aligning a semiconductor substrate and a cover, the cover having a cavity formed therein and a getter attached to an interior surface of the cavity; a bonding section for bonding the semiconductor substrate and the cover together; and a controlling section for controlling the substrate aligning section to align the semiconductor and the cover, for controlling the gas injecting section to inject the inert gas into the vacuum chamber, and for controlling the bonding section to bond the semiconductor substrate and the cover together after the inert gas is injected.

    摘要翻译： 上的基片用于真空安装至少一个微机电系统的方法和装置（MEMS）包括用于惰性​​气体注入到真空室中注入部的气体; 用于对准半导体衬底和盖对准部一基底，具有空腔形成于其中盖和吸气剂附着于所述空腔的内表面上; 用于粘结半导体衬底和盖一起的接合部分; 以及控制部分，用于控制对准部以对准半导体和盖，用于控制注入部至所述惰性气体注入到真空室中的气体底物，以及用于控制所述接合部分接合所述半导体衬底和盖一起后 该惰性气体被注入。

    Chip scale surface-mountable packaging method for electronic and MEMS devices
    12.
    发明公开
    Chip scale surface-mountable packaging method for electronic and MEMS devices 有权
    ChipgrosseOberflächenmontage-Gehäusungsmethodefürelektronische und MEMS Bauteile

    公开(公告)号：EP1167281A3

    公开(公告)日：2003-03-19

    申请号：EP01305377.2

    申请日：2001-06-21

    申请人： SAMSUNG ELECTRONICS CO. LTD.

    发明人： Kang, Seok-jin

    IPC分类号： B81B7/00 ,  H01L23/053 ,  H01L25/065 ,  B81C1/00 ,  H01L23/31 ,  H01L23/522 ,  H01L23/48 ,  H01L23/492

    CPC分类号： B81B7/0077 ,  H01L21/50 ,  H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/00

    摘要： A chip scale surface-mountable packaging method for electronic and micro-electro mechanical system (MEMS) devices is provided. The chip scale surface-mountable packaging method includes: (a) forming an interconnection and sealing pattern as a deep trench in one surface of a conductive cover substrate using semiconductor fabricating and micromachining techniques; (b) filling the trench as the pattern of the cover substrate with an insulating material such as glass or ceramic, and planarizing the surface of the cover to form a bonding pattern; (c) accurately aligning the cover substrate with a device substrate, in which electronic or MEMS devices are integrated, and bonding the cover substrate and the device substrate; (d) polishing the other surface of the cover substrate and forming an electrode pattern thereon; and (e) dicing the sealed and interconnected substrates to form a complete chip scale package. Thus, both sealing of the electronic or MEMS devices and their interconnection with external devices can be achieved at a wafer level.

    摘要翻译： 提供了一种用于电子和微机电系统（MEMS）器件的芯片级表面贴装封装方法。 芯片级表面贴装封装方法包括：（a）使用半导体制造和微加工技术在导电覆盖基板的一个表面中形成作为深沟槽的互连和密封图案; （b）用诸如玻璃或陶瓷的绝缘材料填充沟槽作为覆盖基板的图案，并且平坦化盖的表面以形成接合图案; （c）将盖基板与其中集成电子或MEMS器件的器件基板精确对准，并且将盖基板和器件基板接合; （d）研磨盖基板的另一表面并在其上形成电极图案; 和（e）将密封和互连的基底切割以形成完整的芯片级封装。 因此，可以在晶片级别实现电子或MEMS器件的密封及其与外部器件的互连。

    Micro-electro mechanical system device and method of forming comb electrodes of the same
    13.
    发明公开
    Micro-electro mechanical system device and method of forming comb electrodes of the same 审中-公开
    一种用于制备梳状电极用于微机电系统和方法

    公开(公告)号：EP1868024A1

    公开(公告)日：2007-12-19

    申请号：EP07100407.1

    申请日：2007-01-11

    申请人： Samsung Electronics Co., Ltd.

    发明人： Chung, Seok-whan ,  Kang, Seok-jin ,  Choi, Hyung ,  Jeong, Hyun-ku

    IPC分类号： G02B26/08 ,  B81C1/00

    CPC分类号： G02B26/0841 ,  B81B3/0086 ,  B81B2203/0136 ,  B81C1/00698

    摘要： Provided are a micro-electro mechanical system (MEMS) device and a method of forming comb electrodes of the MEMS device. The method includes forming a plurality of parallel trenches at regular intervals in one side of a first silicon substrate so as to define alternating first and second regions at different heights on the one side of the first silicon substrate, oxidizing the first silicon substrate in order to form an oxide layer in the first and second regions having different heights, forming a polysilicon layer on the oxide layer to at least fill up the trenches so as to level the oxide layer having different heights, bonding a second silicon substrate directly to a top surface of the polysilicon layer, selectively etching the second silicon substrate and the polysilicon layer using a first mask so as to form upper comb electrodes vertically aligned with the first regions, selectively etching the first silicon substrate using a second mask so as to form lower comb electrodes vertically aligned with the second regions, and removing the oxide layer interposed between the upper comb electrodes and the lower comb electrodes.

    摘要翻译： 本发明提供一种微机电系统（MEMS）装置及形成该MEMS装置的梳状电极的方法。 该方法包括：在第一硅衬底的一侧上形成以一定间隔平行沟槽的多元性以便限定交替在不同高度的第一和第二区域上的第一硅衬底的一侧上，以便氧化第一硅衬底以 在具有第一和第二区域不同的高度，所述氧化物层以至少填满沟槽上形成多晶硅层，以便平具有不同高度的氧化层，直接接合第二硅基板的顶表面的氧化物层的形式 多晶硅层的，选择性地蚀刻第二硅衬底和使用第一掩模的多晶硅层，以便形成上梳状电极与所述第一区域垂直对齐的，选择性地蚀刻，使用第二掩模的第一硅衬底，以便形成较低的梳状电极 与所述第二区域垂直对齐，并去除上梳状电极和之间的氧化物层 下梳状电极。

    Mems gyroscope and fabrication method thereof
    14.
    发明公开
    Mems gyroscope and fabrication method thereof 审中-公开
    MEMS陀螺仪及其制造方法

    公开(公告)号：EP1434031A3

    公开(公告)日：2006-03-08

    申请号：EP03258036.7

    申请日：2003-12-19

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Kang, Seok-jin ,  Lee, Moon-chul ,  Chung, Seok-whan ,  Jung, Kyu-dong ,  Hong,, Seog-woo

    IPC分类号： G01C19/56 ,  G01P9/04

    CPC分类号： G01C19/5762 ,  B81B3/0059 ,  B81B2201/0242 ,  B81B2203/051 ,  B81B2203/053

    摘要： A vertical MEMS gyroscope operated by horizontal driving includes a substrate, a support layer fixed on an upper surface of an area of the substrate, a driving structure floating above the substrate and having a portion fixed to the upper surface of the support layer and another portion in parallel with the fixed portion, the driving structure having a predetermined area capable of vibrating in a predetermined direction parallel to the substrate, a detection structure fixed to the driving structure on a same plane as the driving structure, and having a predetermined area capable of vibrating in a vertical direction with respect to the substrate, a cap wafer bonded with the substrate positioned above the driving structure and the detection structure, and a fixed vertical displacement detection electrode formed at a predetermined location of an underside of the cap wafer, for detecting displacement of the detection structure in the vertical direction.

    High-vacuum packaged microgyroscope and method for manufacturing the same
    18.
    发明公开
    High-vacuum packaged microgyroscope and method for manufacturing the same 有权
    Hochvakuumverpacktes Mikrogyroskop und Verfahren zu seiner Herstellung

    公开(公告)号：EP1096259A1

    公开(公告)日：2001-05-02

    申请号：EP00122364.3

    申请日：2000-10-25

    申请人： Samsung Electronics Co., Ltd.

    发明人： Kang, Seok-jin ,  Ko, Youn-il ,  Kim, Ho-suk

    IPC分类号： G01P15/08 ,  G01C19/56 ,  B81B7/00 ,  G01P1/02 ,  B81C3/00 ,  B81B7/02

    CPC分类号： B81C1/0023 ,  B81B2201/0242 ,  B81C2203/0109 ,  B81C2203/019 ,  G01C19/56 ,  G01P1/023 ,  G01P15/0802

    摘要： A high-vacuum packaged microgyroscope for detecting the inertial angular velocity of an object and a method for manufacturing the same. In the high-vacuum packaged microgyroscope, a substrate with an ASIC circuit for signal processing is mounted onto another substrate including a suspension structure of a microgyroscope in the form of a flip chip. Also, the electrodes of the suspension structure and the ASIC circuit can be exposed to the outside through polysilicon interconnection interposed between double passivation layers. The short interconnection between the suspension structure and the ASIC circuit can reduce the device in size and prevents generation of noise, thereby increasing signal detection sensitivity. In addition, by sealing the two substrates at low temperatures, for example, at 363 to 400°C using co-melting reaction between metal, for example, Au, and Si in a vacuum, the degree of vacuum in the device increases.

    摘要翻译： 用于检测物体的惯性角速度的高真空包装微型陀螺仪及其制造方法。 在高真空封装的微型显微镜中，具有用于信号处理的ASIC电路的基板被安装在另一基板上，该基板包括倒装芯片形式的微陀螺仪的悬架结构。 此外，悬置结构的电极和ASIC电路可以通过夹在双钝化层之间的多晶硅互连而暴露于外部。 悬架结构和ASIC电路之间的短互连可以减小器件的尺寸并防止噪声的产生，从而增加信号检测灵敏度。 此外，通过使用金属例如Au和Si之间的真空中的共熔反应在例如363〜400℃的低温下密封两个基板，器件中的真空度增加。