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公开(公告)号：EP2907588A3
公开(公告)日：2015-12-16
申请号：EP14178357.1
申请日：2014-07-24
IPC分类号： B06B1/02
CPC分类号： H04R23/00 , B06B1/0292 , B06B1/0685 , G10K11/002 , H04R2201/003
摘要： An electro-acoustic transducer includes a conductive substrate provided with at least one cell and at least one electrode, and a pad substrate disposed corresponding to the conductive substrate and provided with at least one pad corresponding to the electrode, in which at least one of the electrode and the pad includes an electric pattern for electric connection and at least one dummy pattern that is provided around the electric pattern to be separated the electric pattern.
摘要翻译： 一种电声换能器包括：导电衬底，其设置有至少一个单元和至少一个电极;以及衬垫衬底，其对应于所述导电衬底而设置并且设置有与所述电极相对应的至少一个衬垫，其中至少一个 电极，并且所述垫包括用于电连接的电图案和至少一个虚设图案，所述虚设图案围绕所述电图案设置以与所述电图案分离。
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2.发明授权Silicon-on-insulator substrate, its fabrication method and MEMS floating structure formed therein 有权硅绝缘体上基板，其制备在其中形成的过程和MEMS谐振结构
公开(公告)号：EP1650158B1
公开(公告)日：2008-02-27
申请号：EP05022281.9
申请日：2005-10-12
发明人： Chung, Seok-whan , Choi, Hyung
IPC分类号： B81B3/00
CPC分类号： B81C1/00579 , B81C2201/0132
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公开(公告)号：EP1555665A3
公开(公告)日：2006-12-27
申请号：EP05000585.9
申请日：2005-01-13
发明人： Kim, Yong-sung , Chung, Seok-whan , You, Jae-ho , Choi, Hyung , Hwang, Woong-lin
CPC分类号： G11B7/1362 , G11B7/123 , G11B7/22 , H01L2224/81 , H01S5/02248 , H01S5/02292
摘要： A micro optical bench structure and a method of manufacturing a micro optical bench structure are provided. The micro optical bench structure including: a lower substrate (40); an upper substrate (44) which is bonded to the lower substrate, and has a through-hole (h) for exposing the lower substrate; and a first optical device which is installed at the lower substrate, and units relating to the first optical device.
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4.发明公开
公开(公告)号：EP1434031A2
公开(公告)日：2004-06-30
申请号：EP03258036.7
申请日：2003-12-19
CPC分类号： G01C19/5762 , B81B3/0059 , B81B2201/0242 , B81B2203/051 , B81B2203/053
摘要： A vertical MEMS gyroscope operated by horizontal driving includes a substrate, a support layer fixed on an upper surface of an area of the substrate, a driving structure floating above the substrate and having a portion fixed to the upper surface of the support layer and another portion in parallel with the fixed portion, the driving structure having a predetermined area capable of vibrating in a predetermined direction parallel to the substrate, a detection structure fixed to the driving structure on a same plane as the driving structure, and having a predetermined area capable of vibrating in a vertical direction with respect to the substrate, a cap wafer bonded with the substrate positioned above the driving structure and the detection structure, and a fixed vertical displacement detection electrode formed at a predetermined location of an underside of the cap wafer, for detecting displacement of the detection structure in the vertical direction.
摘要翻译： 通过水平驱动操作的垂直MEMS陀螺仪包括：基板，固定在基板区域的上表面上的支撑层，浮动在基板上方的驱动结构，并且具有固定到支撑层上表面的部分和另一部分 与固定部分平行地，驱动结构具有能够在平行于基板的预定方向上振动的预定区域，在与驱动结构相同的平面上固定到驱动结构的检测结构，并且具有能够 相对于基板在垂直方向上振动，与位于驱动结构上方的基板接合的盖晶片和检测结构，以及形成在盖晶片的下侧的预定位置处的固定垂直位移检测电极，用于检测 检测结构在垂直方向的位移。
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5.发明公开Capacitive micromachined ultrasonic transducer and method of fabricating the same 审中-公开电容微加工超声换能器和方法其制备
公开(公告)号：EP2881182A3
公开(公告)日：2015-12-16
申请号：EP14178360.5
申请日：2014-07-24
IPC分类号： B06B1/02
CPC分类号： H04R1/00 , B06B1/0292 , H01L21/0237 , H01L21/3043 , H01L21/768 , H01L23/481 , H01L2924/0002 , H04R19/005 , H01L2924/00
摘要： A capacitive micromachined ultrasonic transducer includes a device substrate including a first trench confining a plurality of first parts corresponding to a plurality of elements and a second trench confining a second part separated from the plurality of first parts, a supporting unit provided on the device substrate for confining a plurality of cavities corresponding to each of the plurality of elements, a membrane provided on the supporting unit to cover the plurality of cavities, an upper electrode provided on the membrane and electrically connected to the second part in the second trench through a via hole passing through the membrane and the supporting unit, and a through-silicon via (TSV) substrate provided on a lower surface of the device substrate, and including a plurality of first via metals connected to the plurality of first parts and a second via metal connected to the second part.
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公开(公告)号：EP2475189A3
公开(公告)日：2014-10-22
申请号：EP12150195.1
申请日：2012-01-04
CPC分类号： H04R3/04 , H04R1/24 , H04R17/00 , H04R2201/003
摘要： An acoustic transducer includes a first driving unit group including at least one electrode and a second driving unit group including at least one electrode. The first driving unit group is driven at a first phase, and the second driving unit group is driven at a second phase that is different from the first phase.
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公开(公告)号：EP1411025B1
公开(公告)日：2007-09-19
申请号：EP03256418.9
申请日：2003-10-10
发明人： Shong, Ci-moo , Chung, Seok-whan , Kang, Seok-jin , Lee, Moon-chul , Jung, Kyu-dong , Kim, Jong-seok , Jun, Chan-bong , Hong, Seog-woo , Kang, Jung-ho
CPC分类号： B81B7/0006 , H01L21/76877 , H01L23/5226 , H01L2924/0002 , H01L2924/00
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8.发明公开Wiring apparatus , protecting cap for device package using the same, and a method for manufacturing them 审中-公开Verdrahtungsvorrichtung，SchutzkappefürGehäusefürBauelemente undzugehörigeHerstellungsmethode
公开(公告)号：EP1650797A2
公开(公告)日：2006-04-26
申请号：EP05019681.5
申请日：2005-09-09
发明人： Chung, Seok-whan , Lee, Moon-chul , Kim, Woon-bae
IPC分类号： H01L23/045 , H01L23/498
CPC分类号： H05K1/115 , H01L23/04 , H01L23/49827 , H01L2924/0002 , H05K1/0306 , H05K2201/0179 , H05K2201/068 , H05K2201/09563 , H05K2201/09581 , Y10T428/24917 , Y10T428/24926 , H01L2924/00
摘要： A wiring apparatus including a substrate, a via-hole penetrating the substrate, a buffer layer formed on an inner surface of the via-hole, and a plating layer filling filing the via hole inside of the buffer layer. When the wiring apparatus is applied to a protecting cap for device package, a difference in thermal expansion coefficient generated between the substrate and the plating layer can be compensated, thereby preventing damage to the packaging substrate even upon application of thermal impact. Methods for fabricating the wiring apparatus and a protecting cap for a device package using the above wiring processes are also disclosed.
摘要翻译： 一种布线装置，包括基板，穿透基板的通孔，形成在通孔的内表面上的缓冲层以及填充缓冲层内部的通孔的镀层。 当将布线装置应用于装置封装的保护帽时，可以补偿在基板和镀层之间产生的热膨胀系数的差异，从而即使在施加热冲击时也防止对包装基板的损坏。 还公开了使用上述布线方法制造布线装置的方法和用于装置封装的保护帽。
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公开(公告)号：EP1411025A2
公开(公告)日：2004-04-21
申请号：EP03256418.9
申请日：2003-10-10
发明人： Shong, Ci-moo , Chung, Seok-whan , Kang, Seok-jin , Lee, Moon-chul , Jung, Kyu-dong , Kim, Jong-seok , Jun, Chan-bong , Hong, Seog-woo , Kang, Jung-ho
CPC分类号： B81B7/0006 , H01L21/76877 , H01L23/5226 , H01L2924/0002 , H01L2924/00
摘要： A metal wiring method for an undercut in a MEMS packaging process includes disposing a MEMS element on a silicon substrate, welding a glass wafer to an upper portion of the silicon substrate having the MEMS element disposed thereon, the glass wafer having a hole formed therein for connecting a metal wiring, depositing a thin metal film for the metal wiring in the hole, and ion-milling the deposited thin metal film. By the ion-milling, the method is capable of connecting a metal wiring to a via hole having an undercut.
摘要翻译： 在MEMS封装工艺中用于底切的金属布线方法包括：将MEMS元件设置在硅衬底上，将玻璃晶片焊接到其上设置有MEMS元件的硅衬底的上部，所述玻璃晶片具有形成在其中的孔，用于 连接金属布线，在该孔中沉积用于金属布线的薄金属膜，以及离子铣削沉积的薄金属膜。 通过离子铣削，该方法能够将金属布线连接到具有底切的通孔。
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公开(公告)号：EP2907588A2
公开(公告)日：2015-08-19
申请号：EP14178357.1
申请日：2014-07-24
IPC分类号： B06B1/02
CPC分类号： H04R23/00 , B06B1/0292 , B06B1/0685 , G10K11/002 , H04R2201/003
摘要： An electro-acoustic transducer includes a conductive substrate provided with at least one cell and at least one electrode, and a pad substrate disposed corresponding to the conductive substrate and provided with at least one pad corresponding to the electrode, in which at least one of the electrode and the pad includes an electric pattern for electric connection and at least one dummy pattern that is provided around the electric pattern to be separated the electric pattern.
摘要翻译： 电声换能器包括设置有至少一个电池和至少一个电极的导电衬底以及与导电衬底相对设置并且设置有至少一个对应于电极的焊盘的焊盘衬底，其中，至少一个电极 电极和焊盘包括用于电连接的电图案和设置在电图案周围以分离电图案的至少一个虚设图案。
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