摘要:
A chip scale surface-mountable packaging method for electronic and micro-electro mechanical system (MEMS) devices is provided. The chip scale surface-mountable packaging method includes: (a) forming an interconnection and sealing pattern as a deep trench in one surface of a conductive cover substrate using semiconductor fabricating and micromachining techniques; (b) filling the trench as the pattern of the cover substrate with an insulating material such as glass or ceramic, and planarizing the surface of the cover to form a bonding pattern; (c) accurately aligning the cover substrate with a device substrate, in which electronic or MEMS devices are integrated, and bonding the cover substrate and the device substrate; (d) polishing the other surface of the cover substrate and forming an electrode pattern thereon; and (e) dicing the sealed and interconnected substrates to form a complete chip scale package. Thus, both sealing of the electronic or MEMS devices and their interconnection with external devices can be achieved at a wafer level.
摘要:
A rotary gyroscope (10) includes a base plate (1), an intermediate structure (3), including a driven element (33) floating over the base plate as supported by a driving supporter (34) radially extending therefrom, the driven element (33) performing an oscillating motion (63) with respect to a first axis (Z), which is vertical to a center plane thereof, a driving electrode (35) driving the driven element (33), and a sensing element (31) disposed in the driven element (33) and connected to the driven element (33) by a sensing connector (32) to oscillate together with the driven element (33) and concurrently to perform a sensing motion (62) with respect to a third axis (Y), which is vertical to the first axis (Z) and any second axis (X), which is parallel to a center plane, due to a Coriolis force when an angular velocity (61) is inputted from the second axis (X), and a cover (4) covering the intermediate structure (3) and having a sensing electrode (41) to detect the sensing motion (62) of the sensing element (31).
摘要:
A vertical MEMS gyroscope operated by horizontal driving includes a substrate, a support layer fixed on an upper surface of an area of the substrate, a driving structure floating above the substrate and having a portion fixed to the upper surface of the support layer and another portion in parallel with the fixed portion, the driving structure having a predetermined area capable of vibrating in a predetermined direction parallel to the substrate, a detection structure fixed to the driving structure on a same plane as the driving structure, and having a predetermined area capable of vibrating in a vertical direction with respect to the substrate, a cap wafer bonded with the substrate positioned above the driving structure and the detection structure, and a fixed vertical displacement detection electrode formed at a predetermined location of an underside of the cap wafer, for detecting displacement of the detection structure in the vertical direction.
摘要:
A micro-electro mechanical system (MEMS) switch having a single anchor is provided. The MEMS switch includes a substrate (60); grounding lines installed on the substrate to be distant away from each other; signal transmission lines (44, 46) positioned at predetermined intervals between the grounding lines; an anchor (48) placed between the signal transmission lines; a driving electrode (54) that encircles the anchor while not being in contact with the anchor, the signal transmission lines and the grounding lines; and a moving plate (50) that is positioned on the driving electrode (54) to be overlapped with portions of the signal transmission lines (44, 46), and connected to the anchor (48) elastically.
摘要:
A metal wiring method for an undercut in a MEMS packaging process includes disposing a MEMS element on a silicon substrate, welding a glass wafer to an upper portion of the silicon substrate having the MEMS element disposed thereon, the glass wafer having a hole formed therein for connecting a metal wiring, depositing a thin metal film for the metal wiring in the hole, and ion-milling the deposited thin metal film. By the ion-milling, the method is capable of connecting a metal wiring to a via hole having an undercut.
摘要:
Provided is a two-axis scanner. The two-axis scanner includes: a base; a stage disposed on the base; and a stage actuator that is disposed between the base and the stage and moves the stage along two axes. The stage actuator includes: a first stationary part having a predetermined shape; a horizontally movable frame surrounding the first stationary part, wherein a first horizontal deformable torsion spring is disposed between the first stationary part and the horizontally movable frame; a horizontal driver actuating the horizontally movable frame in a horizontal scanning direction; an auxiliary frame surrounding the horizontally movable frame, wherein a first vertical deformable torsion spring is disposed between the horizontally movable frame and the auxiliary frame; a vertically movable frame surrounding the auxiliary frame, wherein a second horizontal deformable torsion spring is disposed between the auxiliary frame and the vertically movable frame; a second stationary part at both sides of the vertically movable frame in a first direction, wherein a second vertical deformable torsion spring is disposed between the vertically movable frame and the second stationary part; and a vertical driver vertically actuating the vertically movable frame. The stage is disposed on the auxiliary frame.
摘要:
Provided is a two-axis scanner. The two-axis scanner includes: a base; a stage disposed on the base; and a stage actuator that is disposed between the base and the stage and moves the stage along two axes. The stage actuator includes: a first stationary part having a predetermined shape; a horizontally movable frame surrounding the first stationary part, wherein a first horizontal deformable torsion spring is disposed between the first stationary part and the horizontally movable frame; a horizontal driver actuating the horizontally movable frame in a horizontal scanning direction; an auxiliary frame surrounding the horizontally movable frame, wherein a first vertical deformable torsion spring is disposed between the horizontally movable frame and the auxiliary frame; a vertically movable frame surrounding the auxiliary frame, wherein a second horizontal deformable torsion spring is disposed between the auxiliary frame and the vertically movable frame; a second stationary part at both sides of the vertically movable frame in a first direction, wherein a second vertical deformable torsion spring is disposed between the vertically movable frame and the second stationary part; and a vertical driver vertically actuating the vertically movable frame. The stage is disposed on the auxiliary frame.