公开(公告)号：EP0019836A1

公开(公告)日：1980-12-10

申请号：EP80102789.7

申请日：1980-05-20

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Biebl, Hans, Dipl.-Ing. ,  Stockinger, Helmut

IPC: H01R9/09 ,  H05K3/36

CPC classification number: H01R12/526 ,  H05K3/222 ,  H05K3/325 ,  H05K2201/10053 ,  H05K2201/10295 ,  H05K2201/10363 ,  H05K2201/10409 ,  H05K2201/1059

Abstract: Die Umschalteinrichtung zur wahlweisen galvanischen Verbindung von Leiterbahnen einer Leiterplatte (1) besteht aus einem länglichen Isolierstoffplättchen (9) mit einem auf diesem fixierten, den Leiterbahnen der Leiterplatte im Querschnitt entsprechenden Leiterbahnabschnitt (7), dessen Enden (8) kreisringförmig ausgebildet sind und jeweils eine Bohrung (10) umgeben, so daß das Plättchen mit dem Leiterbahnabschnitt auf die Leiterplatte aufgelegt und mittels Schrauben (11) mit selbstschneidendem Gewinde, die durch die Bohrungen gesteckt werden, mit der Leiterplatte verschraubbar ist.

Abstract translation: 1.印刷到印刷板（1）上的电路的单极，多级切换布置，用于在印刷导体（3）的可选择的端部之间，特别是在第一导体端（5a）和 导体端，其可以从多个另外的导体端（3a）中选择，所述另外的导体端（3a）通过可被按压到相应的导体端的切换构件（6）被布置成与第一导体端等距; 其特征在于，导体端部（3a，4a，5a）是环形的，并且印刷基板（1）中的孔（3b，4b）形成在每个导体端的中心; 切换构件（6）由绝缘材料的片状体（9）和印刷在其上的直线导体元件（7）组成，并且优选地具有与导体（3,4,5）相同的横截面尺寸 所述导体的端部（8）为环形，其中心点之间的距离对应于要连接的印刷板（1）上的导体的中心点的均匀距离，以及 在导体元件（7）的两端（8）的中心点形成绝缘材料的片状体（9）的孔（10）。 并且优选具有自攻螺纹的螺钉（11）通过绝缘材料的血小板（9）的孔（10）拧入印刷板（1）的指定的孔（3b，4b）中， 所述切换部件（6）的印刷面朝向所述印刷基板（1）的印刷导体（3,4）和所述印刷基板（1）中的所述孔（3b，4b）的直径小于所述印刷基板 这些螺钉（11）的螺纹以螺钉（11）的螺纹的力锁定容纳规定量。

公开(公告)号：EP3334263A1

公开(公告)日：2018-06-13

申请号：EP17205871.1

申请日：2017-12-07

Applicant: OSRAM GmbH ,  OSRAM S.P.A. - SOCIETA' RIUNITE OSRAM EDISON CLERICI

Inventor： BOBBO, Simon ,  MICHIELAN, Valerio ,  VOLPATO, Luca

IPC: H05K13/00 ,  H05K1/02 ,  H05B33/08

CPC classification number: H05B33/083 ,  H05B33/0803 ,  H05K1/029 ,  H05K1/11 ,  H05K1/181 ,  H05K3/222 ,  H05K13/00 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2203/0228 ,  H05K2203/173 ,  H05K2203/175

Abstract: There is described a printed circuit board for implementing lighting modules. The printed circuit board includes metallic zones including:
- a first (200a), a second (200e) and a third positive terminal (200f),
- a first (200b) and a second (200d) negative terminal, wherein the second negative terminal (200d) is connected to the first negative terminal (200b), and
- electric contacts for the mounting of one or more LEDs (L) and electric traces such that the LEDs (L) are connected in series forming a LED string (22).
Specifically, the printed circuit board comprises selection means (JP1, JP2) implemented with electric traces and metallic contacts adapted to be shortcircuited via links in order to permit all of the following connections:
a) a connection of the LED string (22) between the first positive terminal (200a) and the third positive terminal (200f),
b) a connection of the LED string (22) between the first positive terminal (200a) and the first negative terminal (200b),
c) a connection of the LED string (22) between the second positive terminal (200a) and the third positive terminal (200f), and
d) a connection of the LED string (22) between the second positive terminal (200a) and the first negative terminal (200b).

公开(公告)号：EP2680679B1

公开(公告)日：2018-01-17

申请号：EP13171339.8

申请日：2013-06-11

Applicant: Coriant Oy

Inventor： Holma, Antti ,  Kokko, Peter

IPC: H05K3/22 ,  H05K3/30

CPC classification number: H05K3/303 ,  H05K1/02 ,  H05K3/22 ,  H05K3/222 ,  H05K3/30 ,  H05K3/306 ,  H05K2201/09972 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10363 ,  H05K2201/1059 ,  H05K2201/2018 ,  H05K2203/162 ,  Y10T29/49004 ,  Y10T29/4913

Abstract: A circuit board system comprising mechanical protection of electrical components is presented. The circuit board system comprises a circuit board (101) furnished with electrical components (103-111) and a protection element (102) attached to areas of the circuit board which are free from the electrical components. The protection element has thickness in the direction perpendicular to the circuit board and it is shaped to leave the electrical components unscreened in the direction perpendicular to the circuit board. Thus, the protection element constitutes barriers protecting the electrical components but still allows the electrical components to be accessed from the direction perpendicular to the circuit board for example in a flying probe testing. The body of the protection element can be made of same material as the electrically insulating body of the circuit board. Thus, the thermal expansion coefficient of the protection element can be substantially the same as that of the circuit board.

公开(公告)号：EP3089563A4

公开(公告)日：2016-11-02

申请号：EP14897429

申请日：2014-12-22

Applicant: MITSUBISHI ELECTRIC CORP

Inventor： AOSHIMA TAKUMA

IPC: H05K1/02

CPC classification number: H02K5/225 ,  F24F11/04 ,  F24F11/74 ,  F24F13/1426 ,  F24F2013/1433 ,  H05K1/02 ,  H05K1/0262 ,  H05K1/0269 ,  H05K1/029 ,  H05K1/181 ,  H05K2201/09936 ,  H05K2201/1009 ,  H05K2201/10189 ,  H05K2201/10363 ,  H05K2201/10522 ,  H05K2203/173

Abstract: A printed wiring board (100) includes a primary circuit (101) that receives power supply of a high voltage from a high power source; a pattern for a low voltage circuit (105) that is used when a low voltage component (102) used for a low voltage lower than the high voltage and a power supply terminal block that receives power supply of the low voltage from a low power source (112) are provided; a pattern for a common circuit (104) that is used when a high voltage component (108) used for the high voltage and the low voltage that insulates the pattern for the primary circuit (101) from the pattern for the common circuit (104); a first insulator (106) which insulates the pattern of the primary circuit (101) from the pattern of the common circuit (104); and a second insulator (107) that insulates the pattern for the common circuit (104) from the pattern for the low voltage circuit (105).

公开(公告)号：EP2777094A1

公开(公告)日：2014-09-17

申请号：EP12847319.6

申请日：2012-10-25

Applicant: Rapisarda, Carmen

Inventor： Rapisarda, Carmen

IPC: H01R4/18

CPC classification number: F21V23/06 ,  F21Y2115/10 ,  H01M2/1044 ,  H01M2/20 ,  H01M2220/30 ,  H01R4/2404 ,  H01R4/26 ,  H01R12/592 ,  H01R12/79 ,  H01R13/41 ,  H01R13/506 ,  H01R13/665 ,  H01R25/003 ,  H05K1/184 ,  H05K3/325 ,  H05K5/0026 ,  H05K5/0091 ,  H05K2201/10037 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2201/10393 ,  H05K2203/0173

Abstract: An electrical component with two conductive leads and two conductive wires are held within a housing. Each lead is inserted into a housing hole to make electrical contact with a wire conductor. Multiple additional electrical components (which may or may not be LEOs) can be held in similar housings attached their own pairs of wires. A PCB assembly can be attached to hold one or more such assemblies. A resilient PCB housing holds a PCB by an interference fit while conductive wires are inserted into its wire cavity so that exposed portions of conductive wires make electrical contact with electrical traces of the PCB which is biased by wire insulation. Two conductors can be held by the PCB housing which are forced into electrical contact with the PCB when it is inserted into the resilient PCB housing which then biases such contacts.

公开(公告)号：EP2701474A2

公开(公告)日：2014-02-26

申请号：EP13171349.7

申请日：2013-06-11

Applicant: Tellabs Oy

Inventor： Björklöf, Alf ,  Holma, Antti

IPC: H05K3/30 ,  H01R13/04 ,  H01R43/20

CPC classification number: H01R13/04 ,  H01R43/205 ,  H05K3/222 ,  H05K3/306 ,  H05K2201/09972 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10363 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K2201/2018 ,  H05K2203/162 ,  Y10T29/49004 ,  Y10T29/4913

Abstract: A circuit board system comprising a circuit board (301) comprising a first (321) and a second functional entity (322) galvanically connected by electrically conductive elements comprising a first electrically conductive lining (317) in a hole of a circuit board, a press-fit connection pin (315) providing a friction fit with the first lining, a second lining (318) in another hole of the circuit board, a second press-fit connection pin (316) providing a friction fit with the second lining, and a connection part (302) providing a galvanic connection between the first and second press-fit connection pins, the press-fit connection pins being comprised in a press-fit installable electrical connector element (324) on an edge of the circuit board, said connection part (302) being located between the circuit board (301) the connector element (324); a method for manufacturing said circuit board system comprising testing the first and second functional entity independently before providing a galvanic connection between said functional entities.

Abstract translation: 1。一种电路板系统，包括电路板（301），所述电路板包括通过导电元件电流连接的第一功能实体（321）和第二功能实体（322），所述导电元件包括​​电路板的孔中的第一导电衬里（317） - 配合连接销（315），其提供与第一衬里的摩擦配合， - 电路板的另一个孔中的第二衬里（318）， - 与第二衬里摩擦配合的第二压配连接销（316），以及 在第一和第二压配合连接引脚之间提供电连接的连接部分（302），所述压配连接引脚被包括在电路板的边缘上的压配可安装电连接器元件（324）中，所述 连接部分（302）位于电路板（301）与连接器元件（324）之间; 一种用于制造所述电路板系统的方法，包括在提供所述功能实体之间的电连接之前独立地测试第一和第二功能实体。

公开(公告)号：EP2609791A1

公开(公告)日：2013-07-03

申请号：EP11819246.7

申请日：2011-07-14

Applicant: Cooledge Lighting Inc.

Inventor： TISCHLER, Michael ,  SCHICK, Philippe ,  SHEEN, Calvin Wade ,  JUNGWIRTH, Paul

IPC: H05B37/00 ,  F21K99/00 ,  F21S2/00 ,  H05B37/04

CPC classification number: H05B37/04 ,  H01L25/0753 ,  H01L2924/0002 ,  H05B33/0803 ,  H05B33/0821 ,  H05K1/0292 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2203/173 ,  H01L2924/00

Abstract: In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.

公开(公告)号：EP2109141B1

公开(公告)日：2011-10-12

申请号：EP08168852.5

申请日：2008-11-11

Applicant: MediaTek Inc.

Inventor： Chen, Nan-Jang

IPC: H01L23/66 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K3/222 ,  H01L2924/0002 ,  H05K1/0216 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/10363 ,  H05K2201/10515 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A printed circuit board (500a-d) is disclosed. The printed circuit board comprises a substrate (200) having a top surface (202) and a bottom surface (203). A ground plane (228) is on the bottom surface. A signal trace (212c) is on the top surface along a first direction. At least two isolated power planes (208,210) are on the top surface adjacent to opposite sides of the signal trace, respectively. A conductive connection (330) along a second direction couples to the two power planes, across the signal trace without electrically connecting to the signal trace, wherein the signal trace doesn't directly pass over any split of the ground plane.

公开(公告)号：EP2188013A2

公开(公告)日：2010-05-26

申请号：EP09733999.8

申请日：2009-04-22

Applicant: Medtronic, Inc.

Inventor： ENGMARK, David, B. ,  GROSE, Gary, M. ,  SCHAEFER, Todd, H. ,  CEBALLOS, Thomas, I. ,  RIES, Andrew, J.

IPC: A61N1/375 ,  H05K1/14 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/189 ,  A61N1/375 ,  A61N1/3758 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/053 ,  H05K2201/10083 ,  H05K2201/10363 ,  Y10T29/49126

Abstract: An implantable medical device (IMD) having a hermetic housing formed from a case and a cover each having an exterior surface and an interior surface. An IMD component is mounted to the interior surface of the cover and has an electrical contact. A hybrid circuit is assembled in the case. The IMD component electrical contact is electrically coupled to the to the hybrid circuit assembled in the case.

公开(公告)号：EP1614326B1

公开(公告)日：2009-07-29

申请号：EP04726762.0

申请日：2004-04-09

Applicant: Panasonic Corporation

Inventor： SUENAGA, Haruo ,  MORIYA, Hideaki ,  MORIKAWA, Hisashi ,  SAKAI, Shinichi ,  MIHARA, Makoto ,  SHIROKAWA, Nobuo ,  MATSUKURA, Toyotsubu ,  MATSUDA, Masato

IPC: H05B6/68 ,  H05B6/66 ,  H05K1/02 ,  H01L23/34

CPC classification number: H05B6/666 ,  H01L2924/0002 ,  H05K1/18 ,  H05K2201/10363 ,  H01L2924/00