摘要:
The present invention presents a selector device for a memory array, and a method for forming the selector device. The selector device comprises a first electrode layer embedded in an oxide; a second electrode layer arranged above the first electrode layer and separated from the first electrode layer by the oxide; and a semiconductor material forming a semiconductor layer on the top surface of the second electrode layer, and extending through the second electrode layer and the oxide onto the top surface of the first electrode layer, wherein the semiconductor material contacts the first electrode layer and the second electrode layer. The selector device helps to solve the sneak path problem in the memory array it is inserted into.
摘要:
Provided are a thin-film transistor and method for manufacturing same, and a display panel. During an annealing process, an aluminum layer (21) is combined with oxygen ions in an amorphous oxide semiconductor layer (24) to form an Al 2 O 3 layer; the amorphous oxide semiconductor layer (24) losing oxygen ions causes defects to increase and a doping region on the semiconductor layer to form, that is, forming a source electrode contact region and a drain electrode contact region; at the same time, the amorphous oxide semiconductor layer (24) is blocked by an anti-oxidation layer, forming a trench region of the semiconductor layer. Hence, the manufacturing process is simplified, production efficiency is improved, and production costs are reduced.
摘要:
The invention concerns a substrate (1) embrittled by a zone of microcavities (4') delimiting a thin layer (5) with a surface (2) of the substrate (1), the microcavities (4') being entirely or partly empty of gaseous species. The invention also concerns a method for making such a substrate.
摘要:
Disclosed is a boride material for electronic elements, which is represented by a chemical formula of A 1-x E x B₁₂ (where A is Zr of Hf, E is Sc or Y, and 0.1 ≦ x ≦ 0.9) and the crystal system of which is a cubic one at a temperature not lower than its phase transition temperature and is a hexagonal one at a temperature not higher than its phase transition temperature. The boride material is prepared by mixing oxide powders or sulfate powders of the constitutive elements A and E and a boron powder followed by shaping the powder mixture and then sintering the shaped body.
摘要:
A reduced pressure epitaxial deposition method is disclosed to maximize performance and leakage limited yield of devices formed in the epitaxial layer. The method includes specified prebake and deposition conditions designed to minimize arsenic (buried subcollector) and boron (buried isolation) autodoping effects when pressures below one atmosphere are selected in accordance with the subcollector-to-isolation area ratio.
摘要:
The present invention relates to a process for the production of membranes of submicrometric thickness and rolls of Ga 2 O 3 comprising the steps of: a) implanting ions in a monocrystal semiconductor of Ga 2 O 3 , with a cleavage plane parallel to the surface, at a temperature below 500°C, making an ion beam to strike, along a non-parallel direction to the referred cleavage plane, with an energy in the range of 10-4000 keV, a flux in the range of 1×10 12 -1×10 14 ions/cm 2 .s and a fluence in the range of 1×10 13 -1×10 16 ions/cm 2 , forming at least one roll; b) subjecting the at least one roll formed in step a) to a thermal treatment at a temperature equal to or greater than 500°C.
摘要:
A semiconductor film, a sheet like object, and a semiconductor device are provided that have inhibited semiconductor properties, particularly leakage current, and excellent withstand voltage and heat dissipation. A crystalline semiconductor film or a sheet like object includes a corundum structured oxide semiconductor as a major component, wherein the film has a film thickness of 1 µm or more. Particularly, the semiconductor film or the object includes a semiconductor component of oxide of one or more selected from gallium, indium, and aluminum as a major component. A semiconductor device has a semiconductor structure including the semiconductor film or the object.