摘要:
The present invention relates to a deformation sensor comprising a structure in which an ion-conductive polymer layer is sandwiched between soft electrodes, wherein non-uniform ion distribution is generated in the ion-conductive polymer layer by deformation, thereby generating a potential difference between the electrodes.
摘要:
A method for manufacturing an encapsulating material sheet for a solar battery of the invention includes a step of producing an additive-containing pellet by soaking an additive A into a pellet including a polyolefin-based resin as a main component, a step of injecting the additive-containing pellet into a cylinder (103) from a supply opening (101) in an extrusion molder (100), and melting and kneading a resin composition including the polyolefin-based resin and the additive A in the cylinder (103), and a step of molding by extrusion the resin composition from a die (109) in the extrusion molder (100) into a sheet shape.
摘要:
The present invention is a method for producing a polyfunctional polymer that contains a structural unit having a urethane bond and a polymerizable unsaturated bond in a side chain, and is characterised by including a reaction process in which a polymer (P) containing a structural unit (a) having a hydroxy group in a side chain and a monomer (M) having an isocyanate group and a polymerizable unsaturated bond are reacted in the presence of a bismuth carboxylate.
摘要:
The present invention provides a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. That is, a film 1 for manufacturing a semiconductor part includes a base layer 11, and an adhesive layer 12 disposed on one surface side of the base layer 11, wherein the ratio R E (= E'(160)/E'(-40)) of the elastic modulus of E'(160) of the base layer 11 at 160°C to the elastic modulus of E'(-40) of the base layer 11 at -40°C is such that R E ≥ 0.01, and the elastic modulus E'(-40) is 10 MPa or more and less than 1000 MPa. The present method includes a step of bonding the adhesive layer 12 to a back surface of the semiconductor wafer having circuits formed thereon, a step of separating the semiconductor wafer into segments to obtain semiconductor parts, and a pickup step of separating the semiconductor parts from the adhesive layer 12, and includes a step of evaluating the semiconductor wafer or the semiconductor parts prior to the pickup step.
摘要:
A gas barrier polymer of the present invention is formed by heating a mixture including a polycarboxylic acid and a polyamine compound, in which, in an infrared absorption spectrum of the gas barrier polymer, when a total peak area in a range of an absorption band of equal to or more than 1493 cm -1 and equal to or less than 1780 cm -1 is A, and a total peak area in a range of an absorption band of equal to or more than 1598 cm -1 and equal to or less than 1690 cm -1 is B, an area ratio of an amide bond indicated by B/A is 0.370 or more.
摘要:
An adhesive film of the present invention includes a base material layer and a self-peeling adhesive layer laminated therein. The base material layer has a thermal contraction percentage in a direction of flow (thermal contraction percentage in an MD direction) and a thermal contraction percentage in an orthogonal direction with respect to the direction of flow (thermal contraction percentage in a TD direction) that satisfy the following conditions: (1) after heating at 150°C for 30 minutes, 0.4 ‰¤ | thermal contraction percentage in MD direction / thermal contraction percentage in TD direction| ‰¤ 2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction ‰¤ 2%, and (2) after heating at 200°C for 10 minutes, 0.4 ‰¤ | thermal contraction percentage in MD direction / thermal contraction percentage in TD direction| ‰¤ 2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction ‰¥ 3%.
摘要:
The laminate according to the invention is comprised of a base material (A), a silicon-containing layer (B) and a polymer layer (C) obtained from an organic acid metallic salt having a polymerizable group. The silicon-containing layer (B) and the polymer layer (C) are sequentially laminated over at least one surface of the base material (A), the silicon-containing layer (B) includes a high nitrogen concentration region comprised of silicon atoms and nitrogen atoms, silicon atoms and nitrogen atoms and oxygen atoms, or silicon atoms and nitrogen atoms and oxygen atoms and carbon atoms. The high nitrogen concentration region is formed by irradiating energy ray onto a polysilazane film formed over the base material (A) under an oxygen concentration equal to or lower than 5% and/or a relative humidity at room temperature (23°C) equal to or lower than 30% so as to denature at least a part of the film.
摘要:
The laminate according to the invention is comprised of a base material (A), a silicon-containing layer (B) and a polymer layer (C) obtained from an organic acid metallic salt having a polymerizable group. The silicon-containing layer (B) and the polymer layer (C) are sequentially laminated over at least one surface of the base material (A), the silicon-containing layer (B) includes a high nitrogen concentration region comprised of silicon atoms and nitrogen atoms, silicon atoms and nitrogen atoms and oxygen atoms, or silicon atoms and nitrogen atoms and oxygen atoms and carbon atoms. The high nitrogen concentration region is formed by irradiating energy ray onto a polysilazane film formed over the base material (A) under an oxygen concentration equal to or lower than 5% and/or a relative humidity at room temperature (23°C) equal to or lower than 30% so as to denature at least a part of the film.