POLYFUNCTIONAL POLYMER AND METHOD FOR PRODUCING SAME

    公开(公告)号:EP3351568A1

    公开(公告)日:2018-07-25

    申请号:EP16846093.9

    申请日:2016-07-15

    IPC分类号: C08F8/30

    摘要: The present invention is a method for producing a polyfunctional polymer that contains a structural unit having a urethane bond and a polymerizable unsaturated bond in a side chain, and is characterised by including a reaction process in which a polymer (P) containing a structural unit (a) having a hydroxy group in a side chain and a monomer (M) having an isocyanate group and a polymerizable unsaturated bond are reacted in the presence of a bismuth carboxylate.

    FILM FOR MANUFACTURING SEMICONDUCTOR PARTS
    24.
    发明公开
    FILM FOR MANUFACTURING SEMICONDUCTOR PARTS 审中-公开
    用于制造半导体部件的电影

    公开(公告)号:EP3316280A1

    公开(公告)日:2018-05-02

    申请号:EP16817719.4

    申请日:2016-06-14

    发明人: HAYASHISHITA Eiji

    摘要: The present invention provides a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. That is, a film 1 for manufacturing a semiconductor part includes a base layer 11, and an adhesive layer 12 disposed on one surface side of the base layer 11, wherein the ratio R E (= E'(160)/E'(-40)) of the elastic modulus of E'(160) of the base layer 11 at 160°C to the elastic modulus of E'(-40) of the base layer 11 at -40°C is such that R E ≥ 0.01, and the elastic modulus E'(-40) is 10 MPa or more and less than 1000 MPa. The present method includes a step of bonding the adhesive layer 12 to a back surface of the semiconductor wafer having circuits formed thereon, a step of separating the semiconductor wafer into segments to obtain semiconductor parts, and a pickup step of separating the semiconductor parts from the adhesive layer 12, and includes a step of evaluating the semiconductor wafer or the semiconductor parts prior to the pickup step.

    摘要翻译: 本发明提供一种用于制造半导体部件的膜,其中可以共同执行伴随着温度变化的评估步骤,分段步骤和拾取步骤,用于制造半导体部件的方法,半导体部件以及评估 方法。 即,用于制造半导体部件的膜1包括基底层11和设置在基底层11的一个表面侧上的粘合剂层12,其中比率RE(= E'(160)/ E'( - 40 ))为160℃时的基材层11的E'(160)的弹性模量与-40℃下的基材层11的E'( - 40)的弹性模量的关系,RE≥0.01, 弹性模量E'( - 40)为10MPa以上且小于1000MPa。 本方法包括以下步骤:将粘合剂层12粘合到其上形成有电路的半导体晶片的背面;将半导体晶片分割成段以获得半导体部件的步骤;以及拾取步骤,将半导体部件从 并且包括在拾取步骤之前评估半导体晶片或半导体部件的步骤。

    GAS BARRIER POLYMER, GAS BARRIER FILM, AND GAS BARRIER LAMINATE
    25.
    发明公开
    GAS BARRIER POLYMER, GAS BARRIER FILM, AND GAS BARRIER LAMINATE 审中-公开
    气体屏障聚合物,气体屏障膜和气体屏障层压板

    公开(公告)号:EP3228654A1

    公开(公告)日:2017-10-11

    申请号:EP15865243.8

    申请日:2015-11-13

    IPC分类号: C08G81/02 B32B9/00 B32B27/30

    摘要: A gas barrier polymer of the present invention is formed by heating a mixture including a polycarboxylic acid and a polyamine compound, in which, in an infrared absorption spectrum of the gas barrier polymer, when a total peak area in a range of an absorption band of equal to or more than 1493 cm -1 and equal to or less than 1780 cm -1 is A, and a total peak area in a range of an absorption band of equal to or more than 1598 cm -1 and equal to or less than 1690 cm -1 is B, an area ratio of an amide bond indicated by B/A is 0.370 or more.

    摘要翻译: 本发明的阻气性聚合物是通过加热包含多元羧酸和多胺化合物的混合物而形成的,其中,在气体阻绝聚合物的红外吸收光谱中,当吸收带范围内的总峰面积 等于或大于1493cm -1并且等于或小于1780cm -1为A,并且在1598cm -1以上且小于等于1598cm -1的吸收带的范围内的总峰面积 1690cm -1为B时,由B / A表示的酰胺键的面积比为0.370以上。