摘要:
The present invention relates to a process for preparing a linear carbosiloxane polymer, which comprises subjecting at least one thoroughly purified cyclic carbosiloxane monomer to ring opening polymerization in the presence of an acidic or basic catalyst and at least one silanol-functional compound.
摘要:
It is intended to obtain organopolysiloxane capable of forming a cured product having a good balance among properties, i.e., hardness, gas barrier, thermal yellowing resistance, light resistance, heat and cold shock resistance, and adhesion to a base material. The present invention provides organopolysiloxane comprising one or more unsaturated bond-containing group(s) in one molecule and having constitutional units F1, M1, and T in any combination of (i) F1 and M1, (ii) F1 and T, and (iii) F1, M1, and T: F1: M1: T : €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ (R 1 SiO 3/2 ) c €ƒ€ƒ€ƒ€ƒ€ƒ(3) wherein R 1 represents any selected from the group consisting of a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 10 carbon atoms, a substituted or unsubstituted aryl group, and a substituted or unsubstituted aralkyl group; R 2 represents an unsaturated bond-containing group having 2 to 10 carbon atoms; X represents a divalent hydrocarbon group having 2 to 10 carbon atoms; Y represents a divalent hydrocarbon group having 2 to 10 carbon atoms; and a, b, and c each independently represent an integer of 1 or larger, wherein F1 represents a unit constituting cyclic organopolysiloxane.
摘要翻译:它的目的是获得能够形成具有场所之间的良好平衡的固化产物的有机聚硅氧烷,即,硬度,阻气性,抗热黄变性,耐光性,耐热性和冷休克,和粘附在基材上。 本发明提供的有机聚硅氧烷在一个分子中包含一个或多个不饱和键的基团(S)和具有(i)中F1和M1的任何组合的结构单元F1,M1,和T,(ⅱ)F1和T,和( ⅲ)F1,M1,和T:F1:M1:T:ƒ€€€ƒƒƒ€€€ƒƒƒ€€ƒ(R 1的SiO 3/2)C€€ƒƒƒ€€€ƒƒ (3)worin,R 1 darstellt任何选自具有1至10个碳原子的substituiertem奥德unsubstituiertem烷基中选择的,具有3至10个碳原子,substituiertem奥德unsubstituiertem芳基和substituiertem一个substituiertem奥德unsubstituiertem环烷基 unsubstituiertem或芳烷基; R 2具有2至10个碳原子的含不饱和键的基团的darstellt; X表示具有2-10个碳原子的二价烃基; Y表示具有2-10个碳原子的二价烃基; 且a,b和c各自独立地表示上的1或更大的整数,worin F1 darstellt构成环状有机聚硅氧烷的单元。
摘要:
To provide a silicone resin-based thermosetting resin composition that can obtain a hardened material having a high refractive index and a good heat resistance. A solution is a liquid organosilicon compound represented by general formula (1) as described below: (1) wherein, X is each independently a group represented by formula (I), formula (II) or formula (III) as described below, and when the number of the group represented by formula (I) per one molecule of the liquid organosilicon compound represented by general formula (1) (or the number of groups per one mean molecule of the compound when the compound is a mixture having a different ratio for the group represented by formula (I), the group represented by formula (II) and the group represented by formula (III) ) is defined as a, the number of the group represented by formula (II) per one molecule thereof is defined as b, and the number of the group represented by formula (III) per one molecule thereof is defined as c, 0 ‰¤ a ‰¤ 3.5, 0 ‰¤ b ‰¤ 3.5, and 0 ‰¤ c ‰¤ 1 are obtained, and also a + b + 2c = 4 is obtained: wherein, R 1 is each independently a group selected from alkyl having 1 to 4 carbons, cyclopentyl and cyclohexyl, R 2 and R 3 are each independently a group selected from alkyl having 1 to 4 carbons, cyclopentyl, cyclohexyl and phenyl, m and n are the number of repetitions of -OSi(R 3 ) 2 -, and a mean value satisfying 1 to 50.
摘要:
System, including methods and compositions, for making and using emulsions that include a silicone oil and a silicone surfactant. The emulsions may include aqueous droplets disposed in a continuous phase that includes a silicone oil and a silicone surfactant. The aqueous droplets may contain an analyte, optionally at partial occupancy, and/or a luminescent (e.g., photoluminescent) reporter. An assay of the analyte may be performed with the droplets. In some cases, signals may be detected from the droplets, and a characteristic of the analyte, such as an analyte level or activity, may be determined based on the signals.
摘要:
The present invention has its object to provide a liquid-form modified product of polyhedral polysiloxane which is excellent in moldability and transparency, and a composition produced using the modified product. In addition, the present invention can provide an easy-to-handle modified product and composition. The present invention provides a modified product of polyhedral polysiloxane which is obtainable by modifying a polyhedral polysiloxane compound (a) with a compound (b), and a composition containing the modified product. The polyhedral polysiloxane compound (a) has an alkenyl group and/or a hydrosilyl group, and the compound (b) has a hydrosilyl group and/or an alkenyl group each capable of hydrosilylation with the component (a).
摘要:
A debondable adhesive composition comprising (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator is provided.
摘要:
The present invention is directed to a wafer processing laminate including a support (3), a temporary adhesive material layer (2) formed on the support (3), and a wafer (1) laminated on the temporary adhesive material layer (2), the wafer (1) having a circuit-forming front surface and a back surface to be processed, wherein the temporary adhesive material layer (2) includes a complex temporary adhesive material layer having a two-layered structure that includes a first temporary adhesive layer composed of a thermoplastic organopolysiloxane polymer layer (A) having a film thickness of less than 100 nm and a second temporary adhesive layer composed of a thermosetting siloxane-modified polymer layer (B), the first temporary adhesive layer (A) being releasably laminated to the front surface of the wafer (1), the second temporary adhesive layer (B) being releasably laminated to the first temporary adhesive layer (B) and the support (3). There can be provided a temporary adhesive material for a wafer processing which can withstand a thermal process at a high temperature exceeding 300°C, and facilitates temporary adhesion and delamination, and further provided a wafer processing laminate capable of increasing productivity of thin wafers.