公开(公告)号：EP3533073A1

公开(公告)日：2019-09-04

申请号：EP17791384.5

申请日：2017-10-27

申请人： Höganäs AB (publ)

发明人： AF EKSTRÖM, Fredrik

IPC分类号： H01F17/04 ,  H01F27/29 ,  H01F41/10 ,  H01F27/02 ,  H01F41/00

公开(公告)号：EP2469595B1

公开(公告)日：2019-07-31

申请号：EP11192789.3

申请日：2011-12-09

申请人： Analog Devices, Inc.

发明人： O'Donnell, Alan ,  Iriarte, Santiago ,  Murphy, Mark J ,  Lyden, Colin ,  Casey, Gary ,  English, Eoin Edward

IPC分类号： H01L25/16 ,  B81B7/00 ,  G01N27/22 ,  G01N27/414 ,  H01F17/04 ,  H01L21/82 ,  H01L23/367 ,  H01L23/38 ,  H01L23/473 ,  H01L23/48 ,  H01L23/58 ,  H01L23/00 ,  H01L27/06 ,  H01L49/02 ,  H01L31/054 ,  H01L31/056 ,  H01L35/30 ,  H02S40/38

公开(公告)号：EP3297005B1

公开(公告)日：2019-07-17

申请号：EP17187051.2

申请日：2017-08-21

申请人： Sumida Corporation

发明人： TAHARA, Yoshiyuki ,  TANAKA, Teruaki ,  NAKAMURA, Akihiko ,  YAMADA, Satoru ,  KAWARAI, Mitsugu

IPC分类号： H01F17/04 ,  H01F27/29 ,  H01F41/02 ,  H01F41/10

公开(公告)号：EP3462468A1

公开(公告)日：2019-04-03

申请号：EP18000764.3

申请日：2018-09-26

申请人： Karl Storz Imaging, Inc.

发明人： Sanandajifar, Joseph

IPC分类号： H01F27/28 ,  H01F27/26 ,  H01F17/04 ,  A61B1/005

摘要： A transformer (10) includes a substrate (12) having an input and an output, the input being connectable to one section of a medical electrical device, the output being connectable to another section of the medical electrical device. An input ground system and an output ground system, which is electrically isolated from the input ground system, provide continuous return paths for an input signal and an output signal, respectively. The transformer (10) includes a primary winding (60) electrically connected to the input, a secondary winding (70) electrically connected to the output, and a core (30) transferring data from the primary winding (60) to the secondary winding (70) using magnetic field coupling. A middle portion of the primary winding (60) and a middle portion of the secondary winding (70) wrap around the core (30) and are twisted together. Other portions of the primary winding (60) are twisted with one another, while other portions of the secondary winding (70) are twisted with one another.

公开(公告)号：EP3460812A1

公开(公告)日：2019-03-27

申请号：EP17799608.9

申请日：2017-05-15

申请人： Moda-Innochips Co., Ltd.

发明人： KIM, Gyeong Tae ,  LEE, Myung Ho ,  SEO, Tae Geun ,  HA, Heon Guk ,  HAN, Jae Ho

IPC分类号： H01F17/00 ,  H01F17/04 ,  H01F27/29 ,  H01F27/34 ,  H01G4/40 ,  H01G2/14

摘要： The present disclosure discloses a circuit protection device including a first magnetic layer in which a plurality of magnetic sheets are laminated and of which at least a portion of one surface is exposed, a second magnetic layer in which a plurality of magnetic sheets are laminated and of which at least a portion of one surface is exposed, and a nonmagnetic layer in which a plurality of nonmagnetic sheets are laminated and which is disposed between the first and second magnetic layers. A noise filter part including a plurality of coil patterns is disposed in the nonmagnetic layer.

公开(公告)号：EP3401934A1

公开(公告)日：2018-11-14

申请号：EP18162868.6

申请日：2018-03-20

申请人： Sumida Corporation

发明人： KAJIYAMA, Tomohiro

IPC分类号： H01F3/10 ,  H01F3/14 ,  H01F17/04 ,  H01F37/00

CPC分类号： H01F27/24 ,  H01F3/10 ,  H01F3/14 ,  H01F17/045 ,  H01F27/2823 ,  H01F37/00 ,  H01F2003/106 ,  H01F2017/046 ,  H01F2017/048

摘要： A coil component including: a first magnetic core including a columnar portion; a second magnetic core having a facing surface which faces one end surface of the columnar portion; a magnetic-gap layer which is constituted by a non-magnetic material, which is arranged between the facing surface and the one end surface, and which forms a magnetic gap between the facing surface and the one end surface; a coil through which the columnar portion is inserted; and a magnetic molded-body which is constituted by a magnetic material and which covers the first magnetic core and the coil, wherein when watching along the axial center direction of the columnar portion, the magnetic-gap layer protrudes to the periphery of the columnar portion.

公开(公告)号：EP3364431A3

公开(公告)日：2018-10-31

申请号：EP17207999.8

申请日：2017-12-18

申请人： Sumida Corporation

发明人： YAMAGUCHI, Takayuki ,  UCHIBORI, Toshio

IPC分类号： H01F27/22 ,  H01F27/28 ,  H01F37/00 ,  H01F17/04

CPC分类号： H01F41/061 ,  H01F27/06 ,  H01F27/22 ,  H01F27/2823 ,  H01F27/2847 ,  H01F27/42 ,  H01F37/00 ,  H01F2017/046

摘要： An art includes a core part 10 provided with central leg parts 13A, 13B and right and left leg parts 11A, 11B, 12A, 12B arranged on both sides of the central leg parts 13A, 13B; a coil part 20 formed by winding a conducting wire around a circumference of the central leg parts 13A, 13B; and a heat transfer sheet 30 for dissipating heat in the coil part 20 to outside, in which the coil part 20 is configured in such a manner that a rectangular wire is wound around the circumference of the central leg parts by edgewise winding and a circumference of the coil part 20 wound therearound is abutted on the heat transfer sheet 30.

公开(公告)号：EP3371827A1

公开(公告)日：2018-09-12

申请号：EP16797704.0

申请日：2016-11-08

申请人： Qualcomm Incorporated

发明人： VELEZ, Mario Francisco ,  MUDAKATTE, Niranjan Sunil ,  YUN, Changhan Hobie ,  KIM, Daeik Daniel ,  BERDY, David Francis ,  KIM, Jonghae ,  MA, Yunfei ,  ZUO, Chengjie

IPC分类号： H01L23/522 ,  H01F17/04 ,  H01L23/64

CPC分类号： H01F27/2823 ,  H01F27/022 ,  H01F27/2828 ,  H01F27/29 ,  H01F38/14 ,  H01F41/06 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3157 ,  H01L23/5227 ,  H01L23/645 ,  H01L24/06 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L28/00 ,  H01L28/10 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/08265 ,  H01L2224/16227 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/4813 ,  H01L2224/73257 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/19042 ,  H01L2924/19104 ,  H04B5/0037 ,  H04B5/0081 ,  H01L2224/05599 ,  H01L2924/20751 ,  H01L2224/85399

摘要： An inductor with multiple loops and semiconductor devices with such an inductor integrated thereon are proposed. In an aspect, the semiconductor device may include a die on a substrate, an inductor on the die in which the inductor comprises a wire with multiple non-planar loops above the die. In another aspect, the semiconductor device may include a plurality of posts on a die on a substrate, and an inductor on the die. The inductor may include a wire looped around the plurality of posts such that the inductor includes multiple non-planar loops.

公开(公告)号：EP3346476A1

公开(公告)日：2018-07-11

申请号：EP16899255.0

申请日：2016-11-23

申请人： Huawei Technologies Co., Ltd.

发明人： YANG, Heqian ,  ZHU, Yongfa ,  LUO, Xiaolong

IPC分类号： H01F17/00 ,  H01F17/04 ,  H01F27/30 ,  H02M3/155

CPC分类号： H01F27/24 ,  H01F3/14 ,  H01F17/00 ,  H01F17/04 ,  H01F27/245 ,  H01F27/2804 ,  H01F27/30 ,  H01F27/306 ,  H01F27/38 ,  H01F41/0206 ,  H02M3/155

摘要： A thin film inductor is disclosed. The thin film inductor includes a thin film magnetic core (110). The thin film magnetic core includes a plurality of magnetic cylinders, a first end portion (120), and a second end portion (130). The plurality of magnetic cylinders are all rod-shaped and are separated from each other. One end of each magnetic cylinder is in contact with the first end portion (120), and the other end thereof is in contact with the second end portion (130). The plurality of magnetic cylinders include at least two winding magnetic cylinders (140) and one non-winding magnetic cylinder (150), and the non-winding magnetic cylinder (150) is located on one side of the at least two winding magnetic cylinders (140). Alternatively, the plurality of magnetic cylinders include at least two winding magnetic cylinders (140) and two non-winding magnetic cylinders (150), and the at least two winding magnetic cylinders (140) are located between the two non-winding magnetic cylinders (150). The thin film magnetic core (110) includes at least one magnetic thin film (101). In each magnetic thin film (101), at least one type-1 gap (170) is provided in an area located at the first end portion (120) and the second end portion (130) and located between two adjacent winding magnetic cylinders (140). A length direction of the type-1 gap (170) is parallel to a direction of hard magnetization of the magnetic thin film (101). The magnetic thin films (101) are laminated and overlap each other. A sum of widths of all type-1 gaps (170) in each magnetic thin film (101) is the same.

公开(公告)号：EP3196900A4

公开(公告)日：2018-06-20

申请号：EP15839164

申请日：2015-04-27

申请人： MODA INNOCHIPS CO LTD

发明人： PARK IN KIL ,  KIM GYEONG TAE ,  CHO SEUNG HUN ,  JUNG JUN HO ,  NAM KI JOUNG ,  LEE JUNG GYU

IPC分类号： H01F17/00 ,  H01F17/04 ,  H01F27/22 ,  H01F27/29

CPC分类号： H01F27/292 ,  B22F1/0062 ,  B22F1/02 ,  B22F3/02 ,  B22F2301/35 ,  B22F2302/25 ,  B22F2302/45 ,  B29C43/02 ,  B29C65/002 ,  B29L2031/34 ,  C08K3/04 ,  C08K3/08 ,  C08K3/22 ,  C08K3/28 ,  C08K2003/0856 ,  C08K2003/222 ,  C08K2003/282 ,  C08K2201/001 ,  C08K2201/01 ,  C09K5/14 ,  C23C18/1637 ,  C23C18/1653 ,  C25D7/123 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/008 ,  H01F27/22 ,  H01F27/255 ,  H01F27/2804 ,  H01F27/29 ,  H01F27/324 ,  H01F27/34 ,  H01F41/0233 ,  H01F41/041 ,  H01F41/10 ,  H01F2017/048 ,  H01F2027/2809 ,  H05K1/181 ,  H05K2201/1003

摘要： Provided are a power inductor including a body, a base disposed in the body, a coil disposed on the base, a first external electrode connected to the coil, the first external electrode being disposed on a side surface of the body, and a second external electrode connected to the first external electrode, the second external electrode being disposed on a bottom surface of the body and a method for manufacturing the same.