公开(公告)号：EP2205316A1

公开(公告)日：2010-07-14

申请号：EP08832054.4

申请日：2008-09-10

Applicant: MEDTRONIC, INC.

Inventor： IYER, Rajesh V. ,  MILTICH, Thomas P.

IPC: A61N1/375 ,  B23K35/02 ,  H05K3/34 ,  H01L21/48 ,  H01G4/35 ,  H01G4/236 ,  H01G2/10 ,  H01G4/224 ,  B23K1/00

CPC classification number: A61N1/3754 ,  B23K1/0016 ,  B23K35/02 ,  B23K35/0233 ,  B23K35/0244 ,  B23K2201/36 ,  H01G4/224 ,  H01G4/236 ,  H01G4/35 ,  H05K3/3447 ,  H05K3/3478 ,  Y10T29/435

Abstract: A solder joint between a capacitive element and a ferrule of a filtered feedthrough assembly for an implantable medical device is formed from a solder pre-form mounted on a portion of an external surface of the capacitive element, which portion of the external surface may be overlaid with a layer including a noble metal. Another solder joint may be formed between the capacitive member and each feedthrough pin; and, for an assembly including a plurality of feedthrough pins, each of the other solder joints may be formed from a solder pre-form mounted onto the external surface of the capacitive element by inserting each pin through a corresponding ring of a plurality of rings connected together to form the solder pre-form.

公开(公告)号：EP2070109A4

公开(公告)日：2010-04-14

申请号：EP07873520

申请日：2007-10-05

Applicant: FLIPCHIP INTERNAT L L C

Inventor： CURTIS ANTHONY ,  BURGESS GUY F ,  JOHNSON MICHAEL ,  TESSIER TED ,  YU YUAN

IPC: B23K35/26 ,  H01L23/485

CPC classification number: H01L24/10 ,  B23K35/262 ,  B23K2201/36 ,  C22C13/00 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3463 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

公开(公告)号：EP2058080A4

公开(公告)日：2009-11-04

申请号：EP07806868

申请日：2007-09-06

Applicant: MITSUBISHI HEAVY IND LTD ,  NAT INST OF ADVANCED IND SCIEN

Inventor： GOTO TAKAYUKI ,  UTSUMI JUN ,  IDE KENSUKE ,  TAKAGI HIDEKI ,  FUNAYAMA MASAHIRO

IPC: B23K20/00 ,  B23K17/00 ,  B23K20/14 ,  B23K20/24 ,  B23K101/40 ,  C23C14/34 ,  H01L21/02

CPC classification number: H01L21/2007 ,  B23K20/02 ,  B23K20/16 ,  B23K20/24 ,  B23K2201/36 ,  C23C14/16 ,  C23C14/3464 ,  C23C14/46

公开(公告)号：EP1944116A4

公开(公告)日：2009-05-13

申请号：EP06756591

申请日：2006-05-25

Applicant: TSUSHIMA EIKI

Inventor： TSUSHIMA EIKI

IPC: B23K20/00 ,  B23K20/02 ,  B23K20/04 ,  B30B11/02 ,  B32B15/01 ,  H01L23/373

CPC classification number: H01L23/3735 ,  B23K20/02 ,  B23K20/04 ,  B23K2201/18 ,  B23K2201/36 ,  B23K2203/08 ,  B23K2203/12 ,  B23K2203/18 ,  B32B15/01 ,  B32B15/018 ,  H01L2924/0002 ,  Y10T428/12632 ,  Y10T428/12778 ,  Y10T428/12806 ,  Y10T428/12903 ,  H01L2924/00

Abstract: Recently, there is a tendency to increase semiconductor device power. A material used for a heat sink substrate for semiconductor apparatus should have a small thermal expansion coefficient and a high thermal conductivity. A cladding material comprises a first material layer (10) and a second material layer (16), which are alternately stacked. The second material has a smaller thermal expansion coefficient than that of the first material and a lower thermal conductivity than that of the first material. At least five layers consisting of the first material layers and the second material layers are stacked.

公开(公告)号：EP1731251A4

公开(公告)日：2009-05-06

申请号：EP05719340

申请日：2005-02-21

Applicant: PANASONIC CORP

Inventor： YONEMORI SHIGEKI ,  YAMADA YUKITOSHI ,  AKAISHI MITSUNORI ,  HIROTA YUKINORI ,  NAITO TSUTOMU ,  MIYATA MITUO

IPC: B23K9/12 ,  B23K9/10 ,  B23K9/133

CPC classification number: B23K9/1336 ,  B23K9/10 ,  B23K9/124 ,  B23K2201/36

Abstract: In a case of stopping a motor (3) when welding is completed, the motor can be stopped, not depending on the length of a control line, by arranging a first motor stopping means (5a) or a second motor stopping means (5b) in a supplying means (2).

公开(公告)号：EP1578559B1

公开(公告)日：2009-03-18

申请号：EP03788702.3

申请日：2003-09-17

Applicant: EBARA CORPORATION

Inventor： NAGASAWA, Hiroshi ,  KAGOSHIMA, Kaori ,  OGURE, Naoaki ,  HIROSE, Masayoshi ,  CHIKAMORI, Yusuke

IPC: B23K35/02 ,  B22F7/06 ,  B22F1/00

CPC classification number: B22F1/0022 ,  B22F1/0059 ,  B22F1/0062 ,  B22F7/064 ,  B22F2998/00 ,  B22F2999/00 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3612 ,  B23K2201/36 ,  B82Y30/00 ,  C09J5/06 ,  C09J11/04 ,  C09J2400/163 ,  H01L23/4828 ,  H01L24/81 ,  H01L2224/11332 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29339 ,  H01L2224/2949 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/8184 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/351 ,  H05K3/321 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2203/1572 ,  B22F1/0018 ,  H01L2924/00

Abstract: There is provided a bonding material and a bonding method which enable lead-free bonding that can replace high-temperature soldering. The bonding material of the present invention comprises a dispersion in an organic solvent of composite metallic nano-particles having such a structure that a metal core of a metal particle having an average particle diameter of not more than 100 nm. The bonding material can be advantageously used in a stepwise bonding process containing at least two bonding steps.

公开(公告)号：EP1685920A4

公开(公告)日：2008-12-10

申请号：EP04799712

申请日：2004-11-10

Applicant: ARAI CORP

Inventor： SATO KAZUO

IPC: B23K26/00 ,  B23K26/06 ,  B23K26/36 ,  B32B27/00 ,  G06K1/12

CPC classification number: G06K1/126 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/0665 ,  B23K26/361 ,  B23K2201/18 ,  B23K2201/34 ,  B23K2201/36 ,  B41M5/267

Abstract: A laser beam is irradiated on a workpiece (W) to transform a portion of the inside of the workpiece, the portion being at a focal point of the laser beam, thus putting a dot in each predetermined area. A laser marking device has acquiring means (10, 20), coordinate setting means (30), and laser marking means (40). The acquiring means (10, 20) acquire, as information on a dot, at least two-dimensional position information of an exposed section of a workpiece (W) and density information of the dot. The coordinate setting means (30) calculates, for each dot according to the density information, dot depth information showing the distance from the surface of the workpiece (W) to the dot in the thickness direction of the workpiece (W), and the coordinate setting means (30) sets three-dimensional coordinates for each dot based on positions specified by the dot depth information and the two-dimensional position information. The laser marking means (40) performs marking with the three-dimensional coordinates as a laser beam focal point.

公开(公告)号：EP1080491B1

公开(公告)日：2008-08-06

申请号：EP99953402.7

申请日：1999-04-07

Applicant: ROBERT BOSCH GMBH

Inventor： WILDNER, Ingolf

IPC: H01L21/603 ,  H01L21/607 ,  B23K20/00

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K2201/36 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48997 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01032 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01R43/0207 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/532 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: The invention relates to a method for producing an electrical connection between a first contact surface and a second contact surface, whereby a contact wire is arranged between the contact surfaces using a wire bonding device by contacting the contact wire to the first contact surface and then guiding it towards the second contact surface to contact the latter and subsequently separating it using the wire bonding device. According to the invention, after the contact wire (20) has been separated from the second contact surface (14) using the wire bonding device (28), the contact point (24) is fitted with an additional contact protection element (34') using the contact wire (20).

公开(公告)号：EP1880792A3

公开(公告)日：2008-07-23

申请号：EP07005524.9

申请日：2007-03-17

Applicant: Dr. Ing. h.c. F. Porsche Aktiengesellschaft

Inventor： Schiebel, Dieter ,  Paul, Joachim

IPC: B23K31/02

CPC classification number: B62D25/00 ,  B23K2201/36 ,  B62D27/02 ,  H01R4/4809 ,  H01R4/64

Abstract: Die vorliegende Erfindung bezieht sich auf eine Anordnung (1) zur elektrischen Verbindung eines ersten Bauteils (3) einer Fahrzeugkarosserie aus einem ersten elektrisch leitenden Werkstoff und eines zweiten Bauteils (4) der Fahrzeugkarosserie aus einem zweiten, sich von dem ersten Werkstoff unterscheidenden elektrisch leitenden Werkstoff mit einem Verbindungselement (2), welches einen ersten Verbindungsabschnitt (17) aus dem ersten Werkstoff und einen zweiten Verbindungsabschnitt (18) aus dem zweiten Werkstoff aufweist, und welches derart verformbar ausgebildet ist, dass der erste Verbindungsabschnitt (17) für eine feste Anbindung an dem ersten Bauteil (3) mit demselben und der zweite Verbindungsabschnitt (18) für eine feste Anbindung an dem zweiten Bauteil (4) mit demselben in Anlage bringbar ist.

公开(公告)号：EP1883491A1

公开(公告)日：2008-02-06

申请号：EP06742270.9

申请日：2006-04-26

Applicant: Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH

Inventor： MITTLER, Bodo ,  SCHMIDT-LEHMANN, Thomas

IPC: B23K26/24 ,  B23K26/32 ,  B23K33/00 ,  H05B41/02 ,  H01R33/06 ,  B23K101/34 ,  B23K101/36 ,  B23K103/04

CPC classification number: B23K26/244 ,  B23K26/32 ,  B23K33/00 ,  B23K2201/34 ,  B23K2201/36 ,  B23K2203/04 ,  B23K2203/08 ,  B23K2203/50

Abstract: The invention relates to a first component which comprises a weld projection (8), especially for laser welding, having an indent (10) that is disposed in a first component (4) and that can be welded together with at least one second component (6). The invention is characterized in that the weld projection (8) has a projection (14) and can be brought into contact with the second component (6) via said projection. The invention also relates to a shielding housing (1) comprising such a weld projection (8) for a lamp base.