Vacuum film formation method and laminate obtained by the method
    47.
    发明公开
    Vacuum film formation method and laminate obtained by the method 有权
    Vakuumfilmherstellungsverfahren und damit erhaltenes Laminat

    公开(公告)号:EP2518761A1

    公开(公告)日:2012-10-31

    申请号:EP12165705.0

    申请日:2012-04-26

    Abstract: A method of continuously subjecting an elongated substrate to vacuum film formation is disclosed. The method comprises the steps of: feeding a first substrate from a first roll chamber in a first direction from the first chamber toward a second roll chamber; degassing the first substrate; forming a film of a second material on the first substrate, in a second film formation chamber; and rolling up the first substrate in the second roll chamber, thereby producing the first substrate, and further comprises similar steps to produce a second substrate. In advance of producing the first substrate with the second material film, the first cathode electrode of the first film formation chamber is removed from the first film formation chamber, and, in advance of producing the second substrate with the first material film, the second cathode electrode of the second film formation chamber is removed from the second film formation chamber.

    Abstract translation: 公开了一种连续使细长衬底经受真空成膜的方法。 该方法包括以下步骤:从第一方向将第一辊室从第一室向第二辊室供给; 对第一衬底进行脱气; 在第二成膜室中在第一基板上形成第二材料的膜; 并卷起第二辊室中的第一基板,从而制造第一基板,并且还包括类似的步骤以产生第二基板。 在制造具有第二材料膜的第一基板之前,第一成膜室的第一阴极从第一成膜室移除,并且在用第一材料膜制造第二基板之前,第二阴极 从第二成膜室除去第二成膜室的电极。

Patent Agency Ranking