Dual Array memory.
    41.
    发明公开
    Dual Array memory. 失效
    双存储阵列。

    公开(公告)号:EP0206784A2

    公开(公告)日:1986-12-30

    申请号:EP86304774

    申请日:1986-06-20

    IPC分类号: G11C7/00 G06F12/04 G11C11/00

    CPC分类号: G11C11/005

    摘要: A high access speed memory for the internal storage of data and the addressable input/output transfer of data thereto, the memory comprising means for the dynamic storage of data, means for the static storage of data, and means for transferring data between the dynamic storage means and the static storage means. The intimate interfacing of the static and dynamic memories provides a high access speed pathway to the dynamically stored data while impacting minimally on sense amplification timing and the use of a redundant dynamic memory scheme.

    Integrated combined dynamic RAM and ROS
    42.
    发明公开
    Integrated combined dynamic RAM and ROS 失效
    集成的组合动态RAM和ROS

    公开(公告)号:EP0099473A3

    公开(公告)日:1986-11-20

    申请号:EP83105927

    申请日:1983-06-16

    IPC分类号: G11C11/24 G11C17/00

    摘要: A combined read-only storage (ROS) and read/write random access memory (RAM) integrated circuit memory cell is disclosed. In a first cell embodiment, a ROS FET device (ROS,) and a RAM FET device (RAM 1 ) are connected in common to a bit sensing line (BL2) connected to a sense amplifier which senses if the ROS FET device has discharged the bit sensing line (BL2) indicating that a gate is present on the ROS FET device. A write driver circuit (32) is also connected to the bit sensing line (BL2), for providing current through the RAM FET device to the charge storage element for writing a one or a zero therein. In a second cell embodiment, a combined two-bit read-only storage and one-bit read/write random access memory integrated circuit cell is disclosed. The bit sensing line is shared by two ROS FET devices and one RAM FET device. In a third cell embodiment of the invention, a single binary bit is stored for read-only storage and a single binary bit is stored for read/write random access memory storage. The charge storage element shares a common node with the ROS FET device and the RAM FET device and the sense amplifier is connected to the opposite side of the RAM FET device.

    Read-only/read-write memory
    44.
    发明公开
    Read-only/read-write memory 失效
    只读/读写存储器

    公开(公告)号:EP0057784A3

    公开(公告)日:1984-09-05

    申请号:EP81304889

    申请日:1981-10-20

    发明人: Tuan, Hsing Ti

    IPC分类号: G11C17/00 G11C11/24

    摘要: The disclosed memory includes a semiconductor substrate having dopant atoms of a first conducivity type, a plurality of charge storage regions in the substrate, a conductive means over the charge storage regions, dopant atoms of a second conductivity type opposite to the first conductivity type disposed in a subset of the charge storage regions, and a means for selectively applying first and second voltages to the conductive means. With the first voltage applied to the conductive means, the memory operates in a read-only mode where data in the storage regions is fixed and is represented by the presence or absence of the second conductivity type dopant atoms; and with the second voltage applied, the memory operates as a read-write memory where data in the storage regions is variable and is independent of the presence or absence of the second conductivity type dopant atoms.

    METHOD AND APPARATUS FOR COMPLETELY HIDING REFRESH OPERATIONS IN A DRAM DEVICE USING MULTIPLE CLOCK DIVISION

    公开(公告)号:EP1384231B1

    公开(公告)日:2018-11-14

    申请号:EP02766659.3

    申请日:2002-04-26

    IPC分类号: G11C5/00

    摘要: A method and apparatus for handling the refresh of a DRAM array or other memory array requiring periodic refresh operations so that the refresh does not require explicit control signaling nor handshake communication between the memory array and an external accessing client. The method and apparatus handles external accesses and refresh operations such that the refresh operations do not interfere with the external accesses under any conditions. As a result, an SRAM compatible device can be built from DRAM or 1-Transistor cells. A clock division scheme is implemented to allow N external accesses and one refresh operation to be performed during N consecutive clock cycles.

    SERIAL DEVICE EMULATOR USING TWO MEMORY LEVELS WITH DYNAMIC AND CONFIGURABLE RESPONSE

    公开(公告)号:EP3374874A1

    公开(公告)日:2018-09-19

    申请号:EP16865153.7

    申请日:2016-11-11

    申请人: Total Phase, Inc.

    IPC分类号: G06F13/00

    摘要: A digital logic device is disclosed that includes registers, SRAM, DRAM, and a processor configured to store in the registers an initial portion of a first response data to a command, and store in the SRAM the first response data. The processor is further configured to store in a lookup table the memory location and size of the first response data in the SRAM, store in the DRAM additional response data, and store in the lookup table the memory location and size of the additional response data in the DRAM. The processor is configured to receive the command from a host device, retrieve the first response data from the registers or the SRAM, and send the first response data to the host. If the command includes additional response data, the processor is configured to concurrently retrieve the additional response data from DRAM and send the additional response data to the host.

    HIGH PERFORMANCE NON-VOLATILE MEMORY MODULE
    49.
    发明公开
    HIGH PERFORMANCE NON-VOLATILE MEMORY MODULE 审中-公开
    高性能的非易失性存储模块

    公开(公告)号:EP3268864A2

    公开(公告)日:2018-01-17

    申请号:EP16762610.0

    申请日:2016-03-11

    申请人: Rambus Inc.

    IPC分类号: G06F12/02 G06F12/06 G06F13/16

    CPC分类号: G11C5/063 G11C5/04 G11C11/005

    摘要: Memory controllers, devices, modules, systems and associated methods are disclosed. In one embodiment, a memory module includes a pin interface for coupling to a memory controller via a bus. The module includes at least two non-volatile memory devices, and a buffer disposed between the pin interface and the at least two non-volatile memory devices. The buffer receives non-volatile memory access commands from the memory controller that are interleaved with DRAM memory module access commands.