公开(公告)号：EP2789461B1

公开(公告)日：2016-09-21

申请号：EP13166715.6

申请日：2013-05-06

申请人： Mylan Group

发明人： Nguyen, My T. ,  Dang, Thuong T. ,  Phan, Khai N.

IPC分类号： B41C1/10 ,  G03F7/09 ,  B41N1/08

CPC分类号： B41N1/086 ,  B41C1/1016 ,  B41C2201/06 ,  B41C2201/14 ,  B41N1/083 ,  C09J7/385 ,  C09J2433/00 ,  G03F7/094 ,  Y10T428/1443 ,  Y10T428/1495 ,  Y10T428/269 ,  Y10T428/2804 ,  Y10T428/2891 ,  Y10T428/31605 ,  Y10T428/31609 ,  Y10T428/31692 ,  Y10T442/656

摘要： A laminated lithographic printing plate comprising an adhesive layer that is accessible to and insoluble in (A) oleophilic inks and alkaline or acidic aqueous fountain solutions used during printing with the printing plate, and (B) alkaline or acidic aqueous developers used during development of the printing plate. This adhesive layer is also (I) soluble in an alkaline aqueous processing liquid, when said developers and said fountain solutions are acidic, (II) soluble in an acidic aqueous processing liquid, when said developers and said fountain solutions are alkaline, (III) meltable, or (IV) a dry adhesive compliant layer having a hardness of 60 Shore-A or less. This adhesive layer thus allows delamination of the printing plate.

公开(公告)号：EP2900470B1

公开(公告)日：2016-03-23

申请号：EP13774348.0

申请日：2013-09-27

申请人： Rogers BVBA

发明人： RYNIERS, Filip Paul Karel

IPC分类号： B32B15/08 ,  B32B15/20 ,  B32B27/28

CPC分类号： B32B15/08 ,  B32B15/20 ,  B32B27/285 ,  B32B27/288 ,  B32B37/14 ,  B32B2439/00 ,  Y10T156/10 ,  Y10T428/31678 ,  Y10T442/3415 ,  Y10T442/656

公开(公告)号：EP2860219A4

公开(公告)日：2015-12-09

申请号：EP13804513

申请日：2013-06-06

申请人： MITSUBISHI GAS CHEMICAL CO

发明人： KOBAYASHI HIROAKI ,  SOGAME MASANOBU ,  NOMIZU KENTARO ,  MABUCHI YOSHINORI ,  KATO YOSHIHIRO

IPC分类号： C08L63/00 ,  B32B5/02 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  C08G59/40 ,  C08J5/24 ,  C08K3/14 ,  C08K9/02 ,  H05K1/03 ,  H05K1/05

CPC分类号： H05K1/0366 ,  B32B5/022 ,  B32B5/024 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/304 ,  B32B2307/306 ,  B32B2307/5825 ,  B32B2307/726 ,  B32B2457/08 ,  C08G59/4014 ,  C08J5/24 ,  C08J2363/02 ,  C08J2363/04 ,  C08K3/14 ,  C08K9/02 ,  C08L63/00 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0227 ,  Y10T428/24893 ,  Y10T442/2721 ,  Y10T442/3415 ,  Y10T442/3423 ,  Y10T442/656 ,  C08L79/04

摘要： A resin composition capable of achieving a printed wiring board or the like excellent in heat dissipation properties, water absorption properties, copper foil peel strength, and heat resistance after moisture absorption is provided. A prepreg, a laminate, a metal foil clad laminate, a printed wiring board and the like, which use the resin composition are also provided. The resin composition of the present invention having at least an epoxy resin (A), a cyanate ester compound (B), and an inorganic filler (C), wherein the inorganic filler (C) comprises at least a surface-treated silicon carbide (C-1) of a silicon carbide powder having at least a part of the surface treated with an inorganic oxide.

公开(公告)号：EP2388389A3

公开(公告)日：2015-09-09

申请号：EP11002080.7

申请日：2011-03-14

申请人： Wedi, Stephan

发明人： Wedi, Stephan

IPC分类号： E04F13/04 ,  E04F13/00

CPC分类号： E04F13/002 ,  E04F13/047 ,  Y10T442/10 ,  Y10T442/3333 ,  Y10T442/3415 ,  Y10T442/469 ,  Y10T442/475 ,  Y10T442/648 ,  Y10T442/656

摘要： Die Erfindung betrifft eine dampfisolierende Wandverkleidung (100), umfassend eine als Dampfsperre wirkende Aluminiumfolie (4), die mit einer Putzträgerschicht (3) verbunden ist, dadurch gekennzeichnet, dass die Putzträgerschicht (3) aus einer Faserlage (1), nämlich einer Vlies-, Gewebe-, Gewirke- oder Gelegelage aus hydrophilen Fasern, besteht, die mit einem flexibel ausgehärteten, die Faserlage mit der Aluminiumfolie verbindenden und die Eigenschaft eines Putzmörtels aufweisenden Mörtel (2) gebunden ist.

摘要翻译： 衬里（100）具有铝箔（4），其作为与石膏基层（3）连接的蒸汽阻挡层。 基层具有由选自玻璃纤维，纤维素纤维和/或亲水化合成纤维的亲水纤维制成的纤维层（1），即无纺布，针织织物或稀松布层。纤维层粘合 具有柔性硬化的砂浆（2），其中砂浆将纤维层与箔连接并且具有抹灰砂浆的特征。 箔片在离开基层的一侧被粘合剂层（5）覆盖。

公开(公告)号：EP2770025A4

公开(公告)日：2015-08-26

申请号：EP11874240

申请日：2011-10-18

申请人： SHENGYI TECHNOLOGY CO LTD

发明人： RONG QIANPING ,  HE YUESHAN ,  SU SHIGUO

IPC分类号： C08L63/00 ,  B32B15/08 ,  B32B27/04 ,  C08C19/06 ,  C08G59/34 ,  C08G73/02 ,  C08K3/36 ,  C08K5/00 ,  C08K5/3492 ,  C08K5/357 ,  C08K5/5313 ,  C08K13/02 ,  C08L15/00 ,  C08L47/00 ,  C08L79/02 ,  H05K1/03 ,  H05K3/02

CPC分类号： H05K1/038 ,  B32B5/022 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2457/08 ,  C08C19/06 ,  C08G59/34 ,  C08G73/0233 ,  C08K5/0066 ,  C08K5/5313 ,  C08L15/00 ,  C08L63/00 ,  C08L79/02 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/249921 ,  Y10T442/20 ,  Y10T442/656

公开(公告)号：EP2802710A1

公开(公告)日：2014-11-19

申请号：EP13744849.4

申请日：2013-01-07

申请人： E. I. Du Pont de Nemours and Company

发明人： CONLEY, Jill A. ,  LEVIT, Mikhail R. ,  SIEMIONKO, Roger K.

IPC分类号： D21H13/26 ,  D21H17/02 ,  D21H17/00 ,  D21H21/18 ,  D21H21/34 ,  B32B3/12

CPC分类号： D06N3/12 ,  B32B3/00 ,  B32B3/12 ,  B32B3/28 ,  B32B5/022 ,  B32B5/024 ,  B32B15/14 ,  B32B27/12 ,  B32B2250/40 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2307/3065 ,  D06N3/0006 ,  D06N3/0011 ,  D06N3/0015 ,  D21H13/26 ,  D21H17/02 ,  D21H17/21 ,  D21H17/48 ,  D21H17/52 ,  D21H17/53 ,  D21H17/54 ,  D21H17/72 ,  D21H21/18 ,  D21H21/34 ,  Y10T428/24149 ,  Y10T428/24628 ,  Y10T442/20 ,  Y10T442/277 ,  Y10T442/30 ,  Y10T442/3415 ,  Y10T442/3854 ,  Y10T442/60 ,  Y10T442/643 ,  Y10T442/656 ,  Y10T442/674

摘要： This invention is directed to a structural core comprising a fibrous web and a matrix resin, the matrix resin comprising from 15 to 75 weight percent of the weight of web plus resin, the matrix resin contains a first resin comprising tannin in an amount of 10 to 100 weight percent and a second resin in the event tannin is not present in an amount of 100 weight percent, A preferred second resin is phenolic, benzoxazine, polyester, cyanate ester, bismaleimide, epoxy, polyimide or combination thereof.

公开(公告)号：EP2591476A4

公开(公告)日：2014-11-19

申请号：EP11806379

申请日：2011-07-10

申请人： ADVANCED LOGISTICS DEV LTD

发明人： BLUVBAND ZIGMUND ,  SHKATOV VIKTOR

IPC分类号： H01B5/00 ,  B32B3/10 ,  B32B3/22 ,  B32B3/26 ,  B32B5/26 ,  B32B7/12 ,  B32B15/04 ,  B32B15/14 ,  B32B27/36 ,  B64C3/18 ,  B64C3/20

CPC分类号： B23B3/22 ,  B32B3/18 ,  B32B3/22 ,  B32B5/12 ,  B32B15/14 ,  B32B27/36 ,  B32B2262/02 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2305/08 ,  B32B2305/18 ,  B32B2305/38 ,  B32B2307/54 ,  B32B2309/10 ,  B32B2309/105 ,  B32B2311/00 ,  B32B2457/00 ,  B32B2605/18 ,  B64C3/185 ,  B64C3/20 ,  Y10T428/24091 ,  Y10T428/24752 ,  Y10T428/249921 ,  Y10T428/26 ,  Y10T442/3423 ,  Y10T442/3431 ,  Y10T442/656

摘要： Disclosed is to a composite material, a structural element comprised of the composite material, an airplane wing spar and their methods of production. Some embodiments of the present invention include composite materials comprised of multiple layers of arrays of metallic bodies separated by layers of non-metallic material, wherein the orientation of metallic bodies in some metallic layers is structurally complementing to the orientation of metallic layers in adjacent metallic layers. Other embodiments of the present invention include structural elements, such as an airplane wing spar, comprised of the composite material.

摘要翻译： 本发明公开了一种复合材料，由该复合材料，飞机翼梁和它们的生产方法的一个结构元件。 本发明的一些实施例包括包含由非金属材料的层隔开的金属主体的阵列的多个层的复合材料，worin金属体的取向在一些金属层在结构上被补充到金属层的在相邻金属层中的取向 ， 本发明的其它实施方案包括结构元件，颜色：诸如飞机机翼的翼梁，由该复合材料制成的。

公开(公告)号：EP2355982B1

公开(公告)日：2014-09-03

申请号：EP09771403.4

申请日：2009-12-08

申请人： Innovia Films Limited

发明人： SERVANTE, Alastair, Hugh ,  READ, Simon, James

IPC分类号： B41M5/52 ,  B41M5/00

CPC分类号： C09D175/04 ,  B32B1/02 ,  B41M5/5254 ,  B41M7/0072 ,  B41M2205/24 ,  C09D133/08 ,  C09D175/16 ,  Y10T428/13 ,  Y10T428/1352 ,  Y10T428/1476 ,  Y10T428/24802 ,  Y10T428/24934 ,  Y10T428/249924 ,  Y10T428/28 ,  Y10T428/2839 ,  Y10T428/2848 ,  Y10T428/31551 ,  Y10T428/31554 ,  Y10T428/31573 ,  Y10T428/31587 ,  Y10T428/31591 ,  Y10T428/31598 ,  Y10T428/31605 ,  Y10T428/31609 ,  Y10T428/31667 ,  Y10T428/31678 ,  Y10T428/31692 ,  Y10T428/31699 ,  Y10T428/31703 ,  Y10T428/31855 ,  Y10T428/31895 ,  Y10T428/31906 ,  Y10T428/31909 ,  Y10T428/31913 ,  Y10T428/31924 ,  Y10T428/31928 ,  Y10T428/31935 ,  Y10T428/31938 ,  Y10T428/31993 ,  Y10T442/20 ,  Y10T442/30 ,  Y10T442/3415 ,  Y10T442/3602 ,  Y10T442/378 ,  Y10T442/3886 ,  Y10T442/60 ,  Y10T442/656 ,  Y10T442/659 ,  Y10T442/678

摘要： A primer-less coating composition for facestock comprises: a binder being a water-dispersible polymer; an ethlenically unsaturated compound which is aqueous-dispersible and miscible with or bond with an ink; and a crosslinker, wherein said crosslinker is suitable for binding the coating to the facestock. The coating composition may be applied to a substrate to form a printable film, a printed film in accordance with the invention may be used in a label, for example for use on a container such as a bottle.

公开(公告)号：EP2770025A1

公开(公告)日：2014-08-27

申请号：EP11874240.2

申请日：2011-10-18

申请人： Shengyi Technology Co., Ltd

发明人： RONG, Qianping ,  HE, Yueshan ,  SU, Shiguo

IPC分类号： C08L63/00 ,  C08L47/00 ,  C08K13/02 ,  C08K3/36 ,  C08K5/3492 ,  B32B27/04 ,  B32B15/08 ,  H05K1/03

CPC分类号： H05K1/038 ,  B32B5/022 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2457/08 ,  C08C19/06 ,  C08G59/34 ,  C08G73/0233 ,  C08K5/0066 ,  C08K5/5313 ,  C08L15/00 ,  C08L63/00 ,  C08L79/02 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/249921 ,  Y10T442/20 ,  Y10T442/656

摘要： A halogen-free low-dielectric resin composition, and a prepreg and a copper foil laminate made by using same. The halogen-free low-dielectric resin composition, based on parts by weight of the organic solid content, comprises: 5 to 90 parts by weight of epoxidized polybutadiene resin; 10 to 90 parts by weight of benzoxazine resin; 10 to 90 parts by weight of epoxy resin; 1 to 50 parts by weight of curing agent; 10 to 50 parts by weight of organic fire retardant; 0.01 to 1 part by weight of curing catalyst; 0.1 to 10 parts by weight of initiator; and 10 to 100 parts by weight of packing. The halogen-free low-dielectric resin composition of the present invention uses the epoxidized polybutadiene resin, so as to not only solve the defect of the polybutadiene but also maintain the advantages on the dielectric property and flexibility, thereby improving the adhesive force thereof with the copper foil. The prepreg and the copper foil laminate that are used for the printed circuit board and made by using the resin composition have the desirable dielectric property, desirable heat resistance, and a high glass-transition temperature, and can satisfy the requirements of high-frequency electronic signal transmission and high-speed information processing in the industry of printed circuit board copper foil plate.

公开(公告)号：EP2318204B1

公开(公告)日：2013-10-02

申请号：EP09791775.1

申请日：2009-08-21

申请人： E. I. du Pont de Nemours and Company

发明人： KEHRLE, Rainer ,  KLETT, Yves ,  LEVIT, Mikhail, R. ,  LENGWILER, Olivier

IPC分类号： B31D3/00 ,  D21H13/26

CPC分类号： D21H13/26 ,  D21H17/48 ,  D21H25/14 ,  Y10T442/20 ,  Y10T442/2902 ,  Y10T442/60 ,  Y10T442/656 ,  Y10T442/674