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51.发明公开
公开(公告)号：EP2823084A1
公开(公告)日：2015-01-14
申请号：EP13710864.3
申请日：2013-03-21
发明人： TEWS, Dirk , MICHALIK, Fabian , GIL IBÀNEZ, Belen , BRANDT, Lutz , HSIEH, Meng Che , ZHIMING, Liu
IPC分类号： C23C18/20
CPC分类号： C23C18/24 , C23C18/1641 , C23C18/1653 , C23C18/1675 , C23C18/2006 , C23C18/22 , C23C18/28 , C23C18/285 , C23C18/30 , C23C18/36 , C23C18/38 , C23C18/40 , C23C18/405 , C25D3/18 , C25D3/38 , C25D5/022 , C25D5/54 , C25D5/56
摘要： The present invention relates to novel processes for metallization of dielectric substrate surfaces applying organosilane compositions followed by oxidative treatment. The method results in metal plated surfaces exhibiting high adhesion between the substrate and the plated metal while at the same time leaves the smooth substrate surface intact.
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公开(公告)号：EP2201161B1
公开(公告)日：2015-01-14
申请号：EP08828191.0
申请日：2008-08-27
CPC分类号： C25D11/38 , C25D3/06 , C25D3/10 , C25D5/14 , C25D5/34 , C25D5/40 , Y10T428/12472 , Y10T428/12847
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53.发明公开Holding device for a substrate holder for vertical galvanic metal deposition on a substrate to be treated; and a substrate holder for being inserted in such a device 审中-公开用于在衬底上垂直电金属沉积的衬底夹具保持装置的待处理，并且用于插入一个衬底保持器为这样的设备
公开(公告)号：EP2813602A1
公开(公告)日：2014-12-17
申请号：EP13171962.7
申请日：2013-06-14
发明人： Klingl, Heinz
CPC分类号： C25D17/06 , C25D17/08 , H01L21/68721
摘要： The present invention is related to a holding device for a substrate holder for a vertical galvanic metal, preferably copper, deposition on a substrate to be treated comprising at least a first device element, at least a second device element and at least a third device element, wherein the first device element is a first fastening means for fastening the second and third device element; the second device element and the third device element are supporting elements, which are arranged in such a way that there is defined an at least semi-enclosed receiving hole for a substrate holder by the respective spacing between said second device element and said third device element, preferably defined by the respective spacing between first, second and third device element; wherein said second device element further comprise at least a first recess and said third device element further comprise at least a second recess for an accurate positioning and fixation of a substrate holder.
The invention is further related to a substrate holder for being inserted in such a holding device.摘要翻译： 本发明涉及一种保持装置用于衬底保持器用于垂直电镀金属，优选铜，沉积在基片被处理，其包括至少一个第一设备元件，至少一个第二设备元件和至少一个第三设备元件 ，worin第一器件元件是一个第一紧固装置用于紧固所述第二和第三器件元件; 第二设备元件和第三设备元件的支撑元件，它们在寻求thatthere由所述第二装置元件之间的间距respectivement至少半封闭的容纳孔限定了衬底保持器和所述的方式布置第三设备元件 ，优选通过respectivement之间的间隔的第一，第二和第三设备元件限定; worin所述第二装置元件进一步包括至少一个第一凹部和所述第三设备元件进一步包括至少一个第二凹部，用于向保持器基板的准确的定位和固定。 本发明涉及一种另外的基材支架用于插入在寻求保持装置。
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54.发明公开Method for depositing thick copper layers onto sintered materials 审中-公开Verfahren zur Ablagerung dicker Kupferschichten auf gesinterten Materialien
公开(公告)号：EP2803756A1
公开(公告)日：2014-11-19
申请号：EP13075031.8
申请日：2013-05-13
CPC分类号： C25D3/38 , C25D5/10 , C25D5/18 , C25D5/38 , C25D5/44 , C25D5/54 , C25D21/12 , H05K1/0265 , H05K1/0306 , H05K3/241 , H05K3/246 , H05K2203/0307 , H05K2203/0723 , H05K2203/1492
摘要： The present invention relates to a method for electrodepositing a thick copper layer onto an electrically conductive, sintered layer. The thick copper layer has a high adhesion strength, is poor in defects and internal stress, and has high electrical and thermal conductivity. The thick copper layer on the sintered layer is suited for printed circuit boards for high power electronic applications.
摘要翻译： 本发明涉及一种将厚铜层电沉积到导电烧结层上的方法。 厚铜层具有高粘合强度，缺陷和内应力差，导电性高。 烧结层上的厚铜层适用于大功率电子应用的印刷电路板。
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公开(公告)号：EP2796019A1
公开(公告)日：2014-10-29
申请号：EP12805956.5
申请日：2012-11-27
发明人： MIRKOVIC, Marko , KLOBUS, Marcin , TONG, Terry , CHEN, Ted , TANG, Tiger , MOSER, Christoph
IPC分类号： H05K3/42 , C25D3/38 , C25D5/18 , H01L21/288 , C23C18/16
CPC分类号： H05K3/423 , C23C18/1653 , C25D3/38 , C25D5/02 , C25D5/18 , C25D7/00 , C25D7/123 , H05K3/424 , H05K2203/0789 , H05K2203/1476 , H05K2203/1492
摘要： The present invention relates to a method for copper electroplating in the manufacture of printed circuit boards, IC substrates and the like. Said method is suitable for a combined conformal through-hole (5) filling and filling of blind micro vias (6). The method utilizes a metal redox system and pulse reverse plating and involves a multilayer laminate comprising a dielectric core layer (1) having an inner copper layer (3), a dielectric outer layer (2) and an outer copper layer (4). A first copper layer (7) is formed by flash plating then copper (8) is electroplated by pulse reverse plating.
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公开(公告)号：EP2788529A2
公开(公告)日：2014-10-15
申请号：EP12795812.2
申请日：2012-12-05
CPC分类号： C23C28/345 , B82Y30/00 , C23C18/165 , C23C18/1653 , C23C18/18 , C23C18/1865 , C23C18/1893 , C23C18/2033 , C23C18/2066 , C25D5/54 , C25D7/12 , H05K3/389
摘要： A method is provided for metallization of substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies novel adhesion promoting agents comprising nanometer-sized oxide particles prior to metallization. The particles are selected from one or more of silica, alumina, titania, zirconia, tin oxide and zinc oxide particles which have at least one attachment group bearing a functional chemical group suitable for binding to the substrate.
摘要翻译： 提供了一种用于金属化衬底的方法，其提供沉积的金属对衬底材料的高粘附性，从而形成耐用的结合。 该方法在金属化之前应用包含纳米尺寸氧化物颗粒的新型粘合促进剂。 颗粒选自二氧化硅，氧化铝，二氧化钛，氧化锆，氧化锡和氧化锌颗粒中的一种或多种，其具有至少一个具有适于结合底物的官能化学基团的连接基团。
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公开(公告)号：EP2784188A1
公开(公告)日：2014-10-01
申请号：EP13161011.5
申请日：2013-03-26
发明人： Dingwerth, Dr. Björn , Krüger, Mike
摘要： The present invention relates to a process for corrosion protection of an iron-containing substrate wherein a first zinc-nickel alloy layer, a second zinc-nickel alloy layer and a black passivate layer are deposited onto the substrate. The nickel concentration in the second zinc-nickel alloy layer is higher than the nickel concentration in the first zinc-nickel alloy layer. The substrate surface obtained is homogenously black with an appealing decorative appearance and both resistance against white rust and red rust are improved.
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58.发明公开Aqueous composition for etching of copper and copper alloys 有权WässrigeZusammensetzung zurÄtzungvon Kupfer und Kupferlegierungen
公开(公告)号：EP2754732A1
公开(公告)日：2014-07-16
申请号：EP13151243.6
申请日：2013-01-15
CPC分类号： C23F1/18 , C23F1/02 , C23F1/46 , H05K3/067 , H05K2203/0789
摘要： The present invention relates to an aqueous composition for and a process for etching copper and copper alloys applying said aqueous composition. The aqueous composition comprises a source for Fe 3+ ions, at least one acid, at least one triazole or tetrazole derivative, and at least one etching additive selected from N-alkylated iminodipropionic acid, salts thereof, modified polyglycol ethers and quaternary ureylene polymers. The aqueous composition is particularly useful for making of fine structures in the manufacture of printed circuit boards, IC substrates and the like.
摘要翻译： 本发明涉及一种用于蚀刻应用所述含水组合物的铜和铜合金的水性组合物和方法。 含水组合物包含Fe 3+离子源，至少一种酸，至少一种三唑或四唑衍生物，以及至少一种选自N-烷基化亚氨基二丙酸，其盐，改性聚乙二醇醚和季戊烯聚合物的蚀刻添加剂。 含水组合物特别可用于制造印刷电路板，IC基板等中的精细结构。
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59.发明授权VERFAHREN, BEHANDLUNGSSTATION UND ANLAGE ZUM BEHANDELN VON FLÄCHIGEM BEHANDLUNGSGUT 有权过程中，处理站AND SYSTEM FOR片材的治疗要治疗
公开(公告)号：EP2430889B1
公开(公告)日：2014-04-30
申请号：EP10721984.2
申请日：2010-05-12
发明人： KUNZE, Henry
CPC分类号： H05K3/0085 , B05C3/09 , B05C11/06 , C25D7/0621 , C25D7/0642 , C25D17/00 , C25D21/10 , H05K2203/0143 , H05K2203/0746 , H05K2203/1509 , H05K2203/1572
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公开(公告)号：EP2705176A2
公开(公告)日：2014-03-12
申请号：EP12717725.1
申请日：2012-04-27
摘要： The invention relates to methods and plating baths for electrodepositing a dark chromium layer on a workpiece. The trivalent chromium electroplating baths comprise sulphur compounds and the methods for electrodepositing a dark chromium layer employ these trivalent chromium electroplating baths. The dark chromium deposits and workpieces carrying dark chromium deposits are suited for application for decorative purposes.
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