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153 条记录 (耗时 0.018 秒)

    TRANSMITTER FOR AN OPTICAL COMMUNICATION SIGNAL
    72.
    发明公开
    TRANSMITTER FOR AN OPTICAL COMMUNICATION SIGNAL 有权
    站进行光通信信号

    公开(公告)号：EP1639729A1

    公开(公告)日：2006-03-29

    申请号：EP04766112.9

    申请日：2004-07-01

    申请人： Marconi Communications GmbH

    发明人： WERNZ, Horst ,  ELBERS, Joerg-Peter ,  GRIESSER, Helmut

    IPC分类号： H04B10/155

    CPC分类号： H04B10/50

    摘要： A transmitter for an optical RZ-DPSK communication signal comprises a source (1) for an optical carrier, an electro-­optical modulator (4), which comprises at least one element (11, 12) having an optical path length adapted to be varied by an electrical driver signal (T), for intensity modulating the optical carrier based on the driver signal (T), and a driver circuit (6) for generating the driver signal from an electrical communication signal (DATA). The driver signal (T) is an impulse-type signal having two types of impulses spaced in time by a neutral signal state, wherein in presence of the neutral state of the driver signal at the modulator (4), the transmission of the modulator (4) becomes zero, and the two types of impulses each cause a transmission different from zero and a phase which is specific for the type of the impulses in modulator (4).

    GLUING METHOD AND DEVICE
    74.
    发明公开
    GLUING METHOD AND DEVICE 有权
    胶的方法和装置

    公开(公告)号：EP1621058A1

    公开(公告)日：2006-02-01

    申请号：EP04730548.7

    申请日：2004-04-30

    申请人： Marconi Communications GmbH

    发明人： KONRATH, Willibald ,  SCHOLL, Klaus ,  SCHMELCHER, Haiko ,  GORTZEN, Ralf ,  NAHRING, Martin ,  MULLER, Ulf

    IPC分类号： H05K13/04

    CPC分类号： H05K13/0469 ,  H05K3/305 ,  H05K2203/0126 ,  H05K2203/0545 ,  Y02P70/613 ,  Y10T156/1089

    摘要： For gluing a circuit component (51) onto a circuit board (6), the circuit component (51) having a bottom area for bringing into contact with the circuit board with at least one edge (52, 53), the distance (d]) between the edge and a first line (56, 57) parallel to said edge and an amount of adhesive to be applied per length unit along said line (56, 57) are determined such that when placing the circuit component (51) on the circuit board (6) the adhesive advances to said edge (52, 53) but not to a second circuit component (54, 55) adjacent to said edge; the adhesive is applied ill the selected quantity along said first line (56, 57) and along further lilies (58) which are parallel to said first line and further away from said edge (52, 53); then the circuit component (51) is placed on the circuit board (6).

    VERFAHREN ZUR HERSTELLUNG EINES KONDENSATORBAUELEMENTS
    76.
    发明授权
    VERFAHREN ZUR HERSTELLUNG EINES KONDENSATORBAUELEMENTS 有权
    用于生产电容器元件

    公开(公告)号：EP1224674B1

    公开(公告)日：2005-10-19

    申请号：EP00960913.2

    申请日：2000-09-08

    申请人： Marconi Communications GmbH

    发明人： PURSCHE, Udo

    IPC分类号： H01G4/38

    CPC分类号： H05K3/328 ,  H01G4/385 ,  H05K3/3436 ,  H05K2203/049

    摘要： The invention relates to a capacitor component (1) to be fitted on a module rack that is provided with electronic circuit elements. Said capacitor component comprises a capacitor of a first electrode layer, a second electrode layer and a dielectric substrate interposed between the first and the second electrode layer. The aim of the invention is to avoid production-related variations of the capacity values when producing capacitors of the same kind that have similar capacities. To this end, the dielectric substrate is formed by a dielectric support plate and the capacitor component comprises at least one further capacitor with a third electrode layer (6) and a fourth electrode layer (7), the first (4) and the third (6) electrode layer being applied on the upper side (2) and the second (5) and fourth (7) electrode layer being applied on the lower side (3) of the dielectric support plate. The spatial dimensions of the third electrode layer (6) correspond to the dimensions of the first electrode layer (4) and the spatial dimensions of the fourth electrode layer (7) correspond to the dimensions of the second electrode layer (5).

    BANDPASSFILTER MIT PARALLELEN SIGNALWEGEN
    80.
    发明公开
    BANDPASSFILTER MIT PARALLELEN SIGNALWEGEN 审中-公开
    与并行信号，带通滤波器

    公开(公告)号：EP1479162A2

    公开(公告)日：2004-11-24

    申请号：EP03743000.6

    申请日：2003-02-28

    申请人： Marconi Communications GmbH

    发明人： ROSENBERG, Uwe ,  AMARI, Smain

    IPC分类号： H03H9/54 ,  H01P1/208

    CPC分类号： H01P1/203 ,  H01P1/2053 ,  H01P1/208 ,  H01P1/2084

    摘要： The invention relates to a bandpass filter comprising a number of resonators (1, 2, 3, 4), which are arranged between an input (S) and an output (L) of the filter and which are interconnected to form at least two main signal paths (S, 1, 2, L; S, 3, 4, L) that lead from the input (S) to the output (L). The at least two main signal paths (S, 1, 2, L; S, 3, 4, L) have overlapping passbands and are connected to the input (S) and/or output (L) via different resonators (1, 3; 2, 4).