公开(公告)号：EP0633716A4

公开(公告)日：1996-02-28

申请号：EP94905211

申请日：1994-01-27

申请人： NIPPON PAINT CO LTD

发明人： MATSUO SEIICHI ,  NAGATA KOUICHI ,  TANAKA SHIGEHARU ,  SHIMIZU MAKOTO

IPC分类号： G03F7/16 ,  H05K3/00 ,  H05K3/06

CPC分类号： G03F7/164 ,  G03F7/168 ,  H05K3/0079 ,  H05K3/064 ,  H05K2203/0278 ,  H05K2203/1105 ,  H05K2203/135

摘要： A method of forming a photosensitive resist film for the manufacture of finely-machined precision parts, by which dehydration and baking of a resist film can be done by a short-time heating, the resist film formed is of a resolution much higher than conventional, and thin-film drying can be performed. After the electrodeposition coating, the resist film (2) is rolled by pressure rollers (4) while being heated.

公开(公告)号：EP0680247A1

公开(公告)日：1995-11-02

申请号：EP95105420.4

申请日：1995-04-11

申请人： Blaupunkt-Werke GmbH

发明人： Heyne, Michael ,  Wabnik, Helmut

IPC分类号： H05K3/00 ,  B41F35/00

CPC分类号： H05K3/0079 ,  B41F35/005 ,  H05K1/116 ,  H05K3/061 ,  H05K3/1233 ,  H05K3/26 ,  H05K3/428 ,  H05K2203/082

摘要： Die Erfindung betrifft ein Siebdruckverfahren zur Herstellung gedruckter Schaltungen mittels einer gegen Ätzmittel resistenten Paste (P), bei dem Leiterbahnenmuster auf metallkaschierte Isolierstoffplatten (1) aufgedruckt werden.
Nach dem Druckvorgang und dem Abheben des Drucksiebes (4) von der Isolierstoffplatte (1) werden mittels einer mit einem atmosphärischen Unterdruck betriebenen, die wirksame Fläche des Drucksiebes (4) überstreichenden Saugrakel (7) die im Drucksieb (4) verbliebenen Pastenrückstände (11) abgesaugt.

摘要翻译： 在用于制造印刷电路板的方法中，导电轨迹图案印刷到金属包覆绝缘板具有通孔。 打印屏幕（4）降低在绝缘板（1）。 糊状所有这是耐蚀刻通过由刮板（6）在打印屏幕（4）中的孔推压。 后者（6）延伸过屏幕（4）的宽度和沿其长度移动。 从印刷电路板抬起屏幕（4）（1）后，（7）在大气压下操作的抽吸装置被施加到屏幕（4）。 所述抽吸装置（7）被引导越过屏幕（4），其覆盖在屏幕的中从印刷过程中的屏幕（4）留下的有效表面（4），检测没有和剩余的浆料（11）。

公开(公告)号：EP0666506A1

公开(公告)日：1995-08-09

申请号：EP94119218.9

申请日：1994-12-06

申请人： International Business Machines Corporation

发明人： Cummings, Michael James ,  Griffin, John Michael ,  Miller, Curtis Lee

IPC分类号： G03F7/16 ,  B32B31/00 ,  B05C1/02 ,  B05C9/04

CPC分类号： B32B37/226 ,  B32B37/0038 ,  B32B38/1858 ,  B32B2457/08 ,  H05K3/0079 ,  Y10T156/15 ,  Y10T156/1729 ,  Y10T156/1741 ,  Y10T156/1798

摘要： A system for wet application of a dry film, such as a photoresist, to a generally planar panel (12) having upper and lower surfaces (12a,12b), such as a printed circuit board, is provided. The apparatus comprises rotatable upper and lower wetting rollers (14,16) each having an absorbent material such as neoprene on the surface thereof, and a mechanism for holding the upper wetting roller in forcible contact with the lower wetting roller so that rotation of the lower wetting roller is translated into rotation of the upper wetting roller. The lower wetting roller is positioned at least partially within a container (26) providing a supply of wetting agent (36), such as water, such that the wetting agent is in contact with the absorbent material (44) on the surface of the lower wetting roller. Wetting agent absorbed by the absorbent material on the lower wetting roller (16) is transferred to the absorbent material (44) on the upper wetting roller (14) when the upper and lower wetting rollers are rotated, and wetting agent absorbed by the absorbent material on the upper and lower rollers, respectively, is transferred to the upper and lower surfaces of the panel to wet the surfaces when the panel is drawn through the rollers. A pair of upper and lower film supply rolls (18,20) are provided for applying layers of film, respectively, on the upper and lower wetted surfaces of the panel, and a pair of upper and lower cure rollers (22,24) are provided for curing the upper and lower surfaces of the panel having film applied thereon.

公开(公告)号：EP0326516B1

公开(公告)日：1995-03-15

申请号：EP89810043.3

申请日：1989-01-18

申请人： CIBA-GEIGY AG

发明人： Banks, Christopher Paul, Dr. ,  Irving, Edward, Dr.

IPC分类号： H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  G03F7/00 ,  G03F7/40 ,  C23F1/02 ,  C08G18/72

CPC分类号： H05K3/0079 ,  C23F1/02 ,  G03F7/40 ,  H05K3/0076 ,  H05K3/061 ,  H05K2203/0582 ,  H05K2203/0783 ,  H05K2203/1105 ,  H05K2203/135

公开(公告)号：EP0401701B1

公开(公告)日：1994-10-05

申请号：EP90110469.5

申请日：1990-06-01

申请人： SOMAR CORPORATION

发明人： Nagafuchi, Yasuhiro ,  Seki, Mitsuhiro ,  Sumi, Shigeo ,  Hamamura, Fumio

IPC分类号： B32B31/20 ,  B26D5/04

CPC分类号： B32B37/226 ,  B26D1/385 ,  B26D5/04 ,  B32B38/0004 ,  B32B38/185 ,  B32B2457/08 ,  H05K3/0079 ,  Y10T156/1322 ,  Y10T156/1339 ,  Y10T156/1343 ,  Y10T156/1734

公开(公告)号：EP0583714A3

公开(公告)日：1994-09-28

申请号：EP93112745.0

申请日：1993-08-09

申请人： E.I. DU PONT DE NEMOURS AND COMPANY

发明人： Walker, Peter ,  Ma, Sheau-Hwa ,  Matthews, Andrew Ernest

IPC分类号： G03F7/00 ,  H01L21/70 ,  H05K3/12 ,  B41C1/02 ,  B41C1/10

CPC分类号： B82Y10/00 ,  B41C1/003 ,  B41C1/1008 ,  B41C2210/02 ,  B41C2210/08 ,  B41C2210/22 ,  B41C2210/24 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/2018 ,  H05K3/0079 ,  H05K2203/013 ,  H05K2203/0511

摘要： A method for preparing high resolution wash-off images, preferably using ink jet printing, comprising the sequential steps of: (a) providing a non-photosensitive layer, preferably on a substrate, wherein the non-photosensitive layer comprises a polymer selected from the group consisting of acid containing polymers having at least 0.4 milliequivalents of acid functions per gram of polymer and amine containing polymers having at least 0.4 milliequivalents of amine functions per gram of polymer, (b) applying an aqueous ink imagewise to the non-photosensitive layer to form a salt of the polymer in the ink applied areas, said aqueous ink comprising an aqueous carrier medium and a salt-forming agent; and
(c) washing the non-photosensitive layer with an aqueous solution to remove the imaged areas of the non-photosensitive layer.

公开(公告)号：EP0541111A1

公开(公告)日：1993-05-12

申请号：EP92119038.5

申请日：1992-11-06

申请人： Nippon Paint Co., Ltd.

发明人： Yamagami, Yoshikazu ,  Kashihara, Akio ,  Seio, Mamoru ,  Tanabe, Hisaki

IPC分类号： H05K3/34 ,  G03F7/038 ,  G03F7/027

CPC分类号： G03F7/038 ,  G03F7/164 ,  H05K3/0079 ,  H05K3/28 ,  H05K2203/1105 ,  H05K2203/1355

摘要： The present invention has as its object providing a solder mask which permits high density mounting, is suitable for protecting conductor circuits, particularly has mask thickness on the circuit parts and each edge part of the circuits which make almost no difference from those on other parts, and is excellent in electrical insulation, heat resistance and solvent resistance.
This invention provides a method of forming a solder mask for printed circuit boards, using any powder paint which is curable by both irradiation of ultraviolet ray and heat, comprising:

(1) a step of coating the powder paint on a printed circuit board, while holding it at a temperature higher than a softening point of the powder paint,
(2) a step of irradiating ultraviolet rays thereon through a pattern mask,
(3) a step of making development with a medium which dissolves the region not irradiated by ultraviolet rays and,
(4) a step of completely curing the coating part developed on the printed circuit board at a temperature higher than the curing temperature of the powder paint.

摘要翻译： 本发明的目的是提供一种允许高密度安装的焊接掩模，适用于保护导体电路，特别是在电路部分和电路的每个边缘部分具有掩模厚度，其与其它部件几乎没有差别， 电绝缘性，耐热性和耐溶剂性优异。 本发明提供一种形成印刷电路板用焊料掩模的方法，使用可通过紫外线照射和热照射而固化的任何粉末涂料，其包括：（1）在粉末涂料上涂布印刷电路板的步骤，同时 将其保持在高于粉末涂料的软化点的温度下，（2）通过图案掩模在其上照射紫外线的步骤，（3）利用溶解不被紫外线照射的区域的介质进行显影的步骤 和（4）在高于粉末涂料的固化温度的温度下完全固化在印刷电路板上显影的涂层部分的步骤。

公开(公告)号：EP0294611B1

公开(公告)日：1993-02-24

申请号：EP88107658.2

申请日：1988-05-13

申请人： HOECHST AKTIENGESELLSCHAFT

发明人： Pliefke, Engelbert, Dr. Dipl.-Chem. ,  Frass, Werner, Dr. Dipl.-Chem.

IPC分类号： C25D13/04 ,  G03G13/00 ,  B41C1/10

CPC分类号： G03F7/164 ,  B41N3/08 ,  G03F7/40 ,  H05K3/0079 ,  H05K3/225 ,  H05K2203/135

公开(公告)号：EP0507043A3

公开(公告)日：1992-12-16

申请号：EP92100140.0

申请日：1992-01-07

申请人： SHIPLEY COMPANY INC.

发明人： Harris, Martin J. ,  Ho, Ivan K.

IPC分类号： C23F1/02 ,  C25D5/02

CPC分类号： H01L21/4828 ,  C09D5/4411 ,  C23F1/02 ,  C25D5/022 ,  G03F7/164 ,  H05K3/0079 ,  H05K3/064 ,  H05K3/202

摘要： Method for selective and precise etching and plating of a conductive substrate through electrophoretic deposition of a photoresist composition. The invention enables chemical milling and plating of products useful in high performance applications such as lead frames with lead widths less than 1.0 mil and precisely plated lead faces.

公开(公告)号：EP0476821A3

公开(公告)日：1992-11-04

申请号：EP91307198.1

申请日：1991-08-06

申请人： ROHM AND HAAS COMPANY

发明人： Winkle, Mark Robert

IPC分类号： C09D5/44

CPC分类号： C09D5/4492 ,  H05K3/0076 ,  H05K3/0079

摘要： This invention is directed to a method for eliminating or reducing pinhole defects in cataphoretically deposited films without interfering with the electrolysis of water needed for electrodeposition. The method comprises decreasing the evolution of hydrogen gas at the cathode by adding, to the electrodepositable composition, a compound which is reduced by the hydrogen produced at the cathode during the electrodeposition. The hydrogen reacts with this non-gaseous compound rather than becoming hydrogen gas and forming bubbles which lead to pinhole defects.