Low shrinkage thermoplastic resin composition and molded article comprising the same
    84.
    发明公开
    Low shrinkage thermoplastic resin composition and molded article comprising the same 审中-公开
    Schrumpfarme thermoplastische Harzzusammensetzung und Formartikel damit

    公开(公告)号:EP2818520A1

    公开(公告)日:2014-12-31

    申请号:EP14174359.1

    申请日:2014-06-26

    CPC classification number: C08L69/00 C08K3/013 C08L51/04 C08L2201/02 C08K3/0033

    Abstract: Disclosed herein are a thermoplastic resin composition and a molded article produced therefrom. The thermoplastic resin composition includes a thermoplastic resin, an inorganic filler, and a maleic anhydride (MAH)-grafted rubber, and has a coefficient of linear expansion from 20×10 -6 cm/cm°C to 35×10 -6 cm/cm°C, as measured in accordance with ASTM D696. The thermoplastic resin composition exhibits low shrinkage, excellent impact resistance and excellent flexural modulus, and has good balance therebetween.

    Abstract translation: 本文公开了一种热塑性树脂组合物和由其制备的模塑制品。 热塑性树脂组合物包括热塑性树脂,无机填料和马来酸酐(MAH)接枝橡胶,线膨胀系数为20×10 -6 cm / cm 3〜35×10 -6 cm / cm 3,根据ASTM D696测量。 热塑性树脂组合物的收缩率低,耐冲击性优异,弯曲弹性模量优异,并且在其间具有良好的平衡。

    THERMOSET RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED CIRCUIT BOARD MANUFACTURED THEREFROM
    86.
    发明公开
    THERMOSET RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED CIRCUIT BOARD MANUFACTURED THEREFROM 有权
    WÄRMEHÄRTBAREHARZZUSAMMENSETZUNG SOWIE PREPREG UND LAMINATFÜRDARAUS HERGESTELLTE LEITERPLATTE

    公开(公告)号:EP2799493A1

    公开(公告)日:2014-11-05

    申请号:EP11878850.4

    申请日:2011-12-29

    Abstract: The present invention relates to a thermoset resin composition, and a prepreg and a laminate for a printed circuit board manufactured therefrom. The thermoset resin composition comprises the following components: a phosphorus-containing polyphenyl ether resin having low molecular weight, an epoxy resin, a cyanate resin and an accelerator. The prepreg manufactured using the resin composition comprises a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The laminate for a printed circuit board manufactured using the resin composition comprises a plurality of laminated prepregs, a metal foil covering one or two faces of the laminated prepregs by pressing, with each prepreg comprising a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The thermoset resin composition of the present invention has properties such as a low dielectric constant and a dielectric dissipation factor, high heat resistance, a high glass transition temperature, and flame retardancy, etc. The laminates for a printed circuit board manufactured using same have excellent metal foil peel strength, heat resistance and dielectric properties, and are suitable for high frequency and high speed electronic circuit boards.

    Abstract translation: 本发明涉及一种热固性树脂组合物,以及由其制成的印刷电路板用预浸料和层叠体。 热固性树脂组合物包含以下组分:低分子量的含磷聚苯醚树脂,环氧树脂,氰酸酯树脂和促进剂。 使用树脂组合物制造的预浸料通过浸渍和干燥将基材和热固性树脂组合物粘附到基材上。 使用该树脂组合物制造的印刷电路板用层压体包括多层叠预浸料,通过压制覆盖层叠预浸料坯的一面或两面的金属箔,每个预浸料坯包含基材,并且热固性树脂组合物粘附于基材 材料通过浸渍和干燥。 本发明的热固性树脂组合物具有低介电常数和介电损耗因子,高耐热性,高玻璃化转变温度和阻燃性等特性。使用该印刷电路板制造的印刷电路板的层压板具有优异的 金属箔剥离强度,耐热性和介电性能,适用于高频高速电路板。

    FLAME RETARD ANT POLY(SILOXANE) COPOLYMER COMPOSITIONS, METHODS OF MANUFACTURE, AND ARTICLES FORMED THEREFROM
    90.
    发明公开
    FLAME RETARD ANT POLY(SILOXANE) COPOLYMER COMPOSITIONS, METHODS OF MANUFACTURE, AND ARTICLES FORMED THEREFROM 审中-公开
    聚合物(SILOXAN)共聚物共聚物,HERSTELLUNGSVERFAHREN UND DARAUS GEFORMTE ARTIKEL

    公开(公告)号:EP2691475A1

    公开(公告)日:2014-02-05

    申请号:EP12719124.5

    申请日:2012-03-30

    Abstract: A marine vehicle component wherein the component is a partition or a light cover, and wherein the marine vehicle component is molded or formed from a thermoplastic polymer composition including a siloxane-containing copolymer in an amount effective to provide a total of 0.2 to 6.5 wt% of siloxane units based on the total weight of the polymers in the thermoplastic polymer composition, a bromine-containing polymer in an amount effective to provide 9 to 13 wt% of bromine, based on the total weight of the polymers in the thermoplastic polymer composition, and optionally a third polymer, wherein the wt% of the siloxane-containing copolymer, the bromine-containing polymer, and the optional third polymer, sum to 100 wt%, and 0.05 to 10 wt% of a light diffuser additive, based on the total weight of polymers in the thermoplastic polymer composition.

    Abstract translation: 一种聚(硅氧烷)共聚物组合物,其包含:包含第一重复单元的第一聚合物和聚(硅氧烷)嵌段单元,不同于第一聚合物并包含溴的第二聚合物; 和任选的一种或多种不同于第一聚合物和第二聚合物的第三聚合物; 其中硅氧烷单元以至少0.3重量%的量存在于组合物中,并且溴以至少7.8重量%的量存在于组合物中,各自基于第一,第二, 和任选的一种或多种第三聚合物; 并且其中由所述组合物模制的制品具有OSU集成的2分钟热释放试验值小于65kW-min / m 2且峰值放热速率小于65kW / m 2,以及E662烟雾试验Dmax值 小于200。

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