公开(公告)号：EP2405566A1

公开(公告)日：2012-01-11

申请号：EP10748439.6

申请日：2010-02-15

申请人： Ulvac, Inc.

发明人： YANAGIYA, Yoshio

IPC分类号： H02M7/5387 ,  C23C14/34 ,  H05H1/46

CPC分类号： C23C14/3464 ,  C23C14/3485 ,  H01J37/34 ,  H01J37/3444 ,  H01J37/3467 ,  H02M1/34 ,  H02M7/53871 ,  H02M2001/344

摘要： There is provided an AC power supply for a sputtering apparatus in which the AC power supply can prevent the induction of an arc discharge by suppressing an overvoltage to be generated when the polarity of each electrode is reversed. A bridge circuit 3 made up of a plurality of switching transistors SW1 - SW4 is disposed between positive and negative DC current output lines 2a and 2b from a DC electric power supply source 1. An inductor DCL which makes a DC output to have a constant-current characteristic is disposed in at least one of the positive and the negative DC output lines 2a and 2b from the DC electric power supply source 1 to the bridge circuit 3, and a snubber circuit 7 is disposed in parallel with inputs 3a and 3b of the bridge circuit 3.

摘要翻译： 提供了一种用于溅射装置的交流电源，其中交流电源可以通过抑制当每个电极的极性反转时产生的过电压来防止电弧放电的感应。 由多个开关晶体管SW1-SW4构成的桥式电路3由直流电源1设置在正，负直流电流输出线2a，2b之间。电感DCL使DC输出为恒定电流， 电流特性设置在从直流电源1到桥式电路3的正，负直流输出线2a和2b中的至少一个中，缓冲电路7与 桥接电路3。

公开(公告)号：EP2402980A2

公开(公告)日：2012-01-04

申请号：EP11171571.0

申请日：2011-06-27

申请人： PrimeStar Solar, Inc

发明人： Halloran, Sean Timothy

IPC分类号： H01J37/34

CPC分类号： H01J37/3444 ,  H01J37/32935 ,  H01J37/32944 ,  H01J37/3476

摘要： Methods and systems of arc suppression during RF sputtering of a thin film from a semiconducting target 104 onto a substrate 12 are provided. During sputtering, an alternating current of RF frequency can be applied to a semiconducting target 104 to form a plasma 110. Upon formation of an arc 112 extending from the target 104, an arc signature can be detected, where the arc signature is simultaneously defined by decreasing plasma voltage from an initial sputtering plasma voltage to an arc plasma voltage and increasing reflective power from an initial sputtering reflective power to an arc reflective power. Upon identification of the arc signature, the alternating current can be temporarily interrupted to the semiconducting target 104 to suppress the arc 112 extending from the target 104. Thereafter, the alternating current from the electrical power supply 102 can be reapplied to the semiconducting target 104.

摘要翻译： 提供这样的方法，并从半导体靶104的薄膜的RF溅射过程中的电弧抑制的系统到基板12。 在溅射过程中，交变的RF频率的电流可被施加到半导体靶104，以形成等离子体110在形成时从目标104扩展至电弧签名的电弧112的可被检测到，其中电弧签名通过同时限定 在电弧等离子体电压从初始溅射等离子体电压减小等离子体电压和从初始溅射反射功率在电弧反射功率增加的反射功率。 随着电弧签名的识别，交流电流可被暂时中断到半导体靶104抑制从目标104有后扩展弧112，从电电源102的交流电流可被重新应用到半导体靶第一百○四

公开(公告)号：EP0989202B1

公开(公告)日：2011-04-20

申请号：EP98904390.6

申请日：1998-02-19

申请人： Shibaura Mechatronics Corporation

发明人： KURIYAMA, Noboru ,  YATSU, Yutaka ,  UTSUNOMIYA, Nobuaki ,  YASUMOTO, Yuji

IPC分类号： C23C14/34 ,  C23C14/54 ,  H01L21/203 ,  H01L21/285

CPC分类号： H01J37/3444 ,  H01J37/34

摘要： A power supply device for sputtering which enables improvement in step coverage and improvement in fineness of a sputtering film, by realizing stable sputtering at a voltage not higher than a starting voltage, thereby reducing scattering of sputtering particles due to collision with a sputtering inert gas. The power supply device for sputtering includes a DC power source for sputtering (A), a constant-current circuit (B) connected with the DC power source, a sputtering source (21) connected with the constant-current circuit (B), and a controller (11) for controlling a current outputted from the constant-current circuit (B) to be a constant current.

公开(公告)号：EP2272080A2

公开(公告)日：2011-01-12

申请号：EP09737866.5

申请日：2009-04-28

申请人： CemeCon AG

发明人： CREMER, Rainer ,  MAY, Walter

IPC分类号： H01J37/34 ,  C23C14/35 ,  C23C14/34 ,  C23C14/02

CPC分类号： H01J37/3408 ,  C23C14/14 ,  C23C14/352 ,  H01J37/3444 ,  H01J37/3467 ,  H01J37/3473

摘要： The invention relates to a device and to a method for pretreating and coating bodies by magnetron atomization. Said device comprises a vacuum chamber with metal chamber walls (26) and magnetrons with sputter-targets are arranged in said vacuum chamber, at least one magnetron being an HPPMS magnetron to which electric impulses are fed such that a capacitive element (6) is connected by a switch element (5) to the sputter-target of the HPPMS-magnetron. According to a first aspect of the invention, in order to effectively pretreat and coat substrates, the switch element is arranged on the chamber wall.

公开(公告)号：EP2075823A1

公开(公告)日：2009-07-01

申请号：EP07025085.7

申请日：2007-12-24

申请人： Huettinger Electronic Sp. z o. o

发明人： Klimczak, Andrzej ,  Bugyi, Rafal ,  Ozimek, Pawel

IPC分类号： H01J37/34 ,  H02H9/02

CPC分类号： H02H9/021 ,  H01J37/3444 ,  H01J37/3467

摘要： In a method of limiting the current (I out ) flowing between a plasma chamber (3) and a power supply (2), wherein the current change di/dt is limited if the current exceeds a predetermined current by a by a current change limiting device (7, 40) which is provided in the current path between the power supply (2) and the plasma chamber (3).

摘要翻译： 在限制在等离子体室（3）和电源（2）之间流动的电流（I out）的方法中，其中如果电流超过预定电流a电流变化限制，则电流变化di / dt受到限制 装置（7,40），其设置在电源（2）和等离子体室（3）之间的电流路径中。

公开(公告)号：EP1882051A2

公开(公告)日：2008-01-30

申请号：EP06759403.6

申请日：2006-05-10

申请人： Applied Materials, Inc.

发明人： PETRACH, Philip

IPC分类号： C23C14/00

CPC分类号： H01J37/3405 ,  C23C14/568 ,  H01J37/3411 ,  H01J37/3444 ,  H01J37/3497

摘要： A module, such as a pump module or a sputtering module, comprises a lid assembly sufficient to fit or to cover a compartment, such as a pump compartment or a sputtering compartment, of a coating system, such as a modular coating system. A sputtering module comprises a power supply unit and is sufficient for receiving an electrical input and for delivering an electric output sufficient for sputtering in a sputtering compartment. A pump module, it comprises at least one pump and is sufficient for receiving an electrical input sufficient for operating the pump or pumps. Various connections between the module, external supplies, components or devices, and the compartment may be made automatically and/or manually. A control connection may be such that an external controller or a central controller is able to recognize a particular module that is associated with a particular compartment of the coating system.

公开(公告)号：EP1810312A1

公开(公告)日：2007-07-25

申请号：EP05798778.6

申请日：2005-11-02

申请人： Chemfilt Ionsputtering Aktiebolag

发明人： KOUZNETSOV, Vladimir ,  ARVÉN-MAYER, Patrick ,  BÖHLMARK, Johan ,  JOHANSSON, Mats ,  CARLSSON, Johan

IPC分类号： H01J37/02 ,  B23H1/02 ,  B23K9/09 ,  H05B7/02 ,  H05B7/144

CPC分类号： H05B6/68 ,  H01J37/3405 ,  H01J37/3444 ,  H01J37/3467 ,  H01J61/90 ,  H05B41/34

摘要： In producing discharges in a load element such as a magnetron sputtering device, electric pulses are provided from different electric pulse sources, e.g. three or more electric pulse sources. The pulse sources are controlled by a control and monitoring unit to give the element electric pulses different heights and start and end times. The element electric pulses are summed, such as by connecting the pulse sources in parallel to the load, to form resulting, relatively long electric pulses. Each of the resulting electric pulses can have a portion that has a substantially constant level and then the substantially constant level is formed from at least two element electric pulses having the same pulse height. The resulting electric pulses are applied to electrodes in the load. The element electric pulses can have the same polarity such as being half a period of a sinusoid oscillation of a single frequency. Then the time intervals between starts of successive element electric pulses are relatively short such as not being not larger than one third of the period of the sinusoid. For example, the resulting electric pulses can have a substantially rectangular shape, a shape including two different substantially constant levels or have a substantially triangular shape.

公开(公告)号：EP1727924A1

公开(公告)日：2006-12-06

申请号：EP05728585.0

申请日：2005-03-22

申请人： Materia Nova A.S.B.L ,  Centre National de la Recherche Scientifique ,  Universite Paris-Sud

发明人： GANCIU-PETCU, Mihai ,  HECQ, Michel ,  DAUCHOT, Jean-Pierre ,  KONSTANTINIDIS, Stephanos ,  BRETAGNE, Jean ,  DE POUCQUES, Ludovic ,  TOUZEAU, Michel

IPC分类号： C23C14/35 ,  H01J37/34

CPC分类号： C23C14/35 ,  C23C14/358 ,  H01J37/3405 ,  H01J37/3444

摘要： The invention relates to the deposition, in a magnetron reactor (1) fitted with a magnetron cathode (CM), of at least one material on a substrate (11a), said material being vaporized, by means of magnetron cathodic pulverization, with the aid of a gas which is ionized in a pulsed mode. In order to promote the formation of high current pulses of a short duration, while avoiding the formation of arcs and enabling efficient ionization of the pulverized vapor, the gas is preonized prior to application of the main voltage pulse to the magnetron cathode (CM) such that it is possible to generate current pulses (IC) whose duration of decline (Td) is less than 5µs after interruption of the main voltage pulse (IT).

公开(公告)号：EP1690279A2

公开(公告)日：2006-08-16

申请号：EP04810268.5

申请日：2004-11-04

申请人： Zond, Inc.

发明人： CHISTYAKOV, Roman

IPC分类号： H01J37/34

CPC分类号： H01J37/3405 ,  C23C14/0063 ,  C23C14/345 ,  C23C14/352 ,  C23C14/542 ,  H01J37/3408 ,  H01J37/3411 ,  H01J37/342 ,  H01J37/3429 ,  H01J37/3438 ,  H01J37/3444 ,  H01J37/3455 ,  H01J37/3458 ,  H01J37/347

摘要： A plasma source includes a chamber for containing a feed gas. An anode is positioned in the chamber. A segmented magnetron cathode comprising a plurality of electrically isolated magnetron cathode segments is positioned in the chamber proximate to the anode. A power supply is electrically connected to an electrical input of a switch. A respective one of the plurality of electrical outputs of the switch is electrically connected to a respective one of the plurality of magnetron cathode segments. The power supply generates a train of voltage pulses that ignites a plasma from the feed gas. Individual voltage pulses in the train of voltage pulses are routed by the switch in a predetermined sequence to at least two of the plurality of magnetron cathode segments.

公开(公告)号：EP1016122B1

公开(公告)日：2006-07-26

申请号：EP98924885.1

申请日：1998-05-26

申请人： ADVANCED ENERGY INDUSTRIES, INC.

发明人： SCHATZ, Douglas, S. ,  SCHOLL, Richard, A.

IPC分类号： H01J37/34

CPC分类号： H01J37/3438 ,  H01J37/34 ,  H01J37/3444

摘要： A method and an apparatus are disclosed for sputter deposition of an insulating material on a substrate (3) in a continuous mode of operation. A novel design for an anode assembly and driving power supply is disclosed to permit this. Single or multiple anodes (11 and 12) are used, which at any given time may be biased negatively with respect to the plasma (2), so that any insulating material which may have been deposited thereupon may be sputtered away so as to provide a clean positive anode to the system, and at least for some period of time is biased positively so that it acts as an anode. The removal of any insulating material which may have formed on the anode structure permits its continuing effective use in collecting electrons from the plasma when it is biased positively, and therefore its continuing effective use as an anode for the system, permitting continuous operation of the system.

摘要翻译： 的方法和装置游离缺失光盘为在操作的连续模式中的底物（3）的阴极材料的溅射沉积。 一种新颖的设计为阳极的组件和驱动电源是游离缺失盘，以允许此。 单个或多个阳极（11和12）被使用，其中在任何给定时间可以相对于负偏压到等离子体（2），所以没有哪个可能已经沉积在其上可被溅射掉，以便提供一个任何阴极材料 清洁正阳极到系统中，并至少在一段时间内被偏置正所以没有它充当阳极。 其可具有在阳极结构中形成的任何绝缘材料的去除允许在当正偏压从等离子体收集电子其持续有效地利用，并且该系统的因此它的持续有效用作阳极的系统的，允许continuousOperation