公开(公告)号：EP2779226A1

公开(公告)日：2014-09-17

申请号：EP14158359.1

申请日：2014-03-07

申请人： Altera Corporation

发明人： Liu, Hui ,  Shi, Hong ,  Xie, Yuanlin ,  Jiang, Xiaohong

IPC分类号： H01L23/13 ,  H01L23/498 ,  H01L23/552

CPC分类号： H01L23/552 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/45012 ,  H01L2224/45015 ,  H01L2224/45016 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/45572 ,  H01L2224/45624 ,  H01L2224/45647 ,  H01L2224/45686 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/73257 ,  H01L2224/8592 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/014 ,  H01L2924/05442 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： An apparatus includes a substrate that includes electronic circuitry. The apparatus further includes a first die that includes electronic circuitry, and at least one shielded interconnect. The shielded interconnect(s) couple(s) electronic circuitry in the substrate to electronic circuitry in the first die.

摘要翻译： 一种装置包括衬底做了包括电子电路。 该装置包括第一此外，电子电路包括没有，和至少一个屏蔽互连。 所述屏蔽互连（多个）对（多个）电子电路基板向电子电路在所述第一的。

公开(公告)号：EP3144967B1

公开(公告)日：2018-11-21

申请号：EP16189120.5

申请日：2016-09-16

申请人： Altera Corporation

发明人： Jiang, Xiaohong ,  Xie, Yuanlin

IPC分类号： H01L23/66 ,  H01L23/498 ,  H01P3/08 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H01L23/13 ,  H01L23/36

CPC分类号： H01L23/66 ,  H01L23/13 ,  H01L23/36 ,  H01L23/5385 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01P3/081 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/141 ,  H05K1/183 ,  H05K3/3436 ,  H05K2201/10378 ,  H01L2924/014 ,  H01L2924/00014

摘要： In one embodiment, an integrated circuit package includes a package substrate, a printed circuit board, an interposer structure and a transmission line bridge interconnect within the interposer. The interposer structure, which includes multiple interposer layers, may be formed on a top surface of the package substrate. The printed circuit board may be coupled to the package substrate through the transmission line bridge interconnect. The transmission line may be formed on at least one of the interposer layers. The transmission line may be utilized to convey signals between the package substrate and the printed circuit board. The transmission line may be a stripline transmission line or a micro-strip transmission line. The transmission line may have a low parasitic inductance and implementation of the transmission line does not introduce large dimensional discontinuity throughout that signal pathway. The integrated circuit package may be part of a circuit system that includes external circuits.

公开(公告)号：EP3144967A3

公开(公告)日：2017-05-10

申请号：EP16189120.5

申请日：2016-09-16

申请人： Altera Corporation

发明人： Jiang, Xiaohong ,  Xie, Yuanlin

IPC分类号： H01L23/66 ,  H01L23/498 ,  H01P3/08 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18

CPC分类号： H01L23/66 ,  H01L23/13 ,  H01L23/36 ,  H01L23/5385 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01P3/081 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/141 ,  H05K1/183 ,  H05K3/3436 ,  H05K2201/10378 ,  H01L2924/014 ,  H01L2924/00014

摘要： In one embodiment, an integrated circuit package includes a package substrate, a printed circuit board, an interposer structure and a transmission line bridge interconnect within the interposer. The interposer structure, which includes multiple interposer layers, may be formed on a top surface of the package substrate. The printed circuit board may be coupled to the package substrate through the transmission line bridge interconnect. The transmission line may be formed on at least one of the interposer layers. The transmission line may be utilized to convey signals between the package substrate and the printed circuit board. The transmission line may be a stripline transmission line or a micro-strip transmission line. The transmission line may have a low parasitic inductance and implementation of the transmission line does not introduce large dimensional discontinuity throughout that signal pathway. The integrated circuit package may be part of a circuit system that includes external circuits.

摘要翻译： 在一个，集成电路封装的实施方式包括一封装基板，印刷电路板，到插入结构和内插器内的传输线桥互连。 该内插器结构，其包括多个内插器的层，也可以在封装基板的顶表面上形成。 该印刷电路板可以被耦合到通过传输线桥互连的封装基板。 传输线可以在插入层中的至少一种形成。 传输线可以被用来将封装基板和印刷电路板之间传送信号。 传输线可以是带状线传输线或微带传输线。 传输线路可以具有传输线的低寄生电感和执行整个做信号通路不引入大的尺寸的不连续性。 集成电路封装可以是电路系统的一部分做了包括外部电路。

公开(公告)号：EP3144967A2

公开(公告)日：2017-03-22

申请号：EP16189120.5

申请日：2016-09-16

申请人： Altera Corporation

发明人： Jiang, Xiaohong ,  Xie, Yuanlin

IPC分类号： H01L23/66 ,  H01L23/498 ,  H01P3/08 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18

CPC分类号： H01L23/66 ,  H01L23/13 ,  H01L23/36 ,  H01L23/5385 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01P3/081 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/141 ,  H05K1/183 ,  H05K3/3436 ,  H05K2201/10378 ,  H01L2924/014 ,  H01L2924/00014

摘要： In one embodiment, an integrated circuit package includes a package substrate, a printed circuit board, an interposer structure and a transmission line bridge interconnect within the interposer. The interposer structure, which includes multiple interposer layers, may be formed on a top surface of the package substrate. The printed circuit board may be coupled to the package substrate through the transmission line bridge interconnect. The transmission line may be formed on at least one of the interposer layers. The transmission line may be utilized to convey signals between the package substrate and the printed circuit board. The transmission line may be a stripline transmission line or a micro-strip transmission line. The transmission line may have a low parasitic inductance and implementation of the transmission line does not introduce large dimensional discontinuity throughout that signal pathway. The integrated circuit package may be part of a circuit system that includes external circuits.