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公开(公告)号：EP3172762A2
公开(公告)日：2017-05-31
申请号：EP15824894.8
申请日：2015-07-22
申请人： Brewer Science, Inc.
发明人： LIU, Xiao , BAI, Dongshun , FLAIM, Tony D. , ZHONG, Xing-Fu , WU, Qi
IPC分类号： H01L21/58
CPC分类号： B32B7/06 , B05D3/007 , B32B27/06 , B32B37/14 , B32B2255/26 , B32B2307/412 , B32B2405/00 , B32B2457/00 , C08G73/1014 , C08G73/1039 , C08G73/1067 , C09D179/08 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10S156/93 , Y10S156/941 , Y10T156/1158 , Y10T156/1917
摘要： The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.
摘要翻译： 本发明广泛地涉及在微电子制造过程中能够进行薄晶片处理的剥离层组合物。 优选的释放层由包含溶解或分散在溶剂体系中的聚酰胺酸或聚酰亚胺的组合物形成，随后在约250℃至约350℃下固化和/或除去溶剂少于约10分钟，产生 薄膜。 该过程将释放组合物形成聚酰亚胺释放层，其可以用于临时粘合过程，并且在期望的处理已经进行之后激光剥离。
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公开(公告)号：EP2601676A2
公开(公告)日：2013-06-12
申请号：EP11836791.1
申请日：2011-08-05
申请人： Brewer Science, Inc.
IPC分类号： H01L21/20
CPC分类号： H01L21/6835 , B32B38/0008 , B32B38/10 , B32B43/006 , H01L21/2007 , H01L21/6836 , H01L24/83 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01L2924/351 , Y10T156/10 , Y10T156/11 , Y10T156/1126 , Y10T428/24942 , Y10T428/26 , Y10T428/31511 , Y10T428/31551 , Y10T428/31663 , Y10T428/31721 , Y10T428/31725 , Y10T428/31935 , Y10T428/31938 , H01L2924/00
摘要： Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.
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公开(公告)号：EP3311393A1
公开(公告)日：2018-04-25
申请号：EP16815145.4
申请日：2016-06-21
申请人： Brewer Science Inc.
发明人： ZHONG, Xing-Fu , HUANG, Runhui , ZHANG, Boyu
IPC分类号： H01L21/027 , H01L21/768 , G03F1/22 , G03F1/48 , G03F7/26 , G03F7/004
CPC分类号： H01L21/0337 , C09D125/08 , C09D131/02 , C09D179/08 , H01L21/02118 , H01L21/02282
摘要： Planarizing and spin-on-carbon (SOC) compositions that fill vias and/or trenches on a substrate while planarizing the surface in a single thin layer coating process are provided. The compositions can planarize wide ranges of substrates with vias or trenches of from about 20 nm to about 220 nm wide, and up to about 700 nm deep. These extraordinary properties come from the low molecular weight of the polymers used in the materials, thermally-labile protecting groups on the polymers, and a delayed crosslinking reaction.
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公开(公告)号：EP2419926A1
公开(公告)日：2012-02-22
申请号：EP10810300.3
申请日：2010-03-19
申请人： Brewer Science, Inc.
发明人： TANG, Tingji , XU, Gu , ZHONG, Xing-Fu , HONG, Wenbin , FLAIM, Tony, D. , YESS, Kimberly , TRICHUR, Ramachandran, K.
IPC分类号： H01L21/312
CPC分类号： B81C1/00801 , B81C2201/053 , C08G61/08 , C08G2261/3324 , C08G2261/418 , G03F7/033 , G03F7/094 , H01L21/0274 , H01L21/3081 , Y10T428/31645 , Y10T428/31667 , Y10T428/31692 , Y10T428/31855 , Y10T428/31909
摘要： New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.
摘要翻译： 提供了在生产半导体和MEMS器件期间使用这些组合物作为保护层的新组合物和方法。 该组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于形成在酸蚀刻和其他处理和处理期间保护基材的层。 保护层可以是光敏或非光敏的，并且可以在保护层下具有或不具有底漆层的情况下使用。 优选的底漆层在溶剂体系中包含碱性聚合物。
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公开(公告)号：EP4193221A1
公开(公告)日：2023-06-14
申请号：EP21856496.1
申请日：2021-08-09
申请人： Brewer Science Inc.
发明人： ZHONG, Xing-Fu , HUANG, Runhui , XU, Gu , SIMMONS, Sean , SWEAT, Daniel , KOZA, Jakub
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公开(公告)号：EP2601676B1
公开(公告)日：2020-03-25
申请号：EP11836791.1
申请日：2011-08-05
申请人： Brewer Science Inc.
IPC分类号： H01L21/20 , H01L21/683
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