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    INTERCONNECT FOR BATTERY PACKS
    1.
    发明公开
    INTERCONNECT FOR BATTERY PACKS 审中-公开
    互连电池组

    公开(公告)号：EP3192111A1

    公开(公告)日：2017-07-19

    申请号：EP15840309.7

    申请日：2015-08-31

    申请人： CELLINK CORPORATION

    发明人： COAKLEY, Kevin Michael ,  BROWN, Malcolm

    IPC分类号： H01M2/20 ,  H01M2/26 ,  H01M2/10

    CPC分类号： H05K3/0058 ,  H01L23/5386 ,  H01M2/202 ,  H01M2/206 ,  H01M10/4257 ,  H01M10/48 ,  H05K1/0268 ,  H05K1/118 ,  H05K1/189 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/056 ,  H05K2201/09081 ,  H05K2201/10037

    摘要： Provided are interconnect circuits for interconnecting arrays of battery cells and methods of forming these interconnect circuits as well as connecting these circuits to the battery cells. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different battery cell terminal. In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.

    摘要翻译： 提供用于互连器件阵列的互连电路以及形成这些互连电路的方法以及将这些电路连接到器件。 互连电路可以包括导电层和一个或多个绝缘层。 导电层可以被图案化为具有限定接触焊盘的开口，使得每个焊盘被用于连接到互连器件的不同电端子。 在一些实施例中，每个接触焊盘通过由与接触焊盘相同的导电层形成的熔丝连接到导电层的其余部分。 熔丝连接控制流入和流出该接触垫的电流。 绝缘层被层压到导电层并为接触垫提供支撑。 绝缘层还可以被图案化为具有开口，这允许通过绝缘层在接触焊盘和电池端子之间形成电连接。

    SYSTEMS AND METHODS FOR COMBINED THERMAL AND ELECTRICAL ENERGY TRANSFER
    6.
    发明公开
    SYSTEMS AND METHODS FOR COMBINED THERMAL AND ELECTRICAL ENERGY TRANSFER 审中-公开
    用于组合的热能和电能转移的系统和方法

    公开(公告)号：EP3254308A1

    公开(公告)日：2017-12-13

    申请号：EP16747245.5

    申请日：2016-02-03

    申请人： CelLink Corporation

    发明人： COAKLEY, Kevin Michael ,  BROWN, Malcolm

    IPC分类号： H01L23/36 ,  H01L23/12

    CPC分类号： H05K1/0209 ,  H01L33/647 ,  H05K1/18 ,  H05K2201/10106

    摘要： Provided are interconnect circuits for combined electrical and thermal energy transfer to devices connected to these circuits. Also provided are methods of fabricating such interconnect circuits. An interconnect circuit may include an electro-thermal conductor and at least one insulator providing support to different portions of the conductor with respect to each other. The insulator may include one or more openings for electrical connections and/or heat exchange with the electro-thermal conductor. The portions of the conductor may be electrically isolated from each other in the final circuit. Initially, these portions may be formed from the same conductive sheet, such as a metal foil having a thickness of at least about 50 micrometers. This thickness ensures sufficient thermal transfer in addition to providing excellent electrical conductance. In some embodiments, the conductor may include a surface coating to protect its base material from oxidation, enhancing electrical connections, and/or other purposes.