PROCÉDÉ DE RÉALISATION DE MOTIFS
    2.
    发明公开
    PROCÉDÉ DE RÉALISATION DE MOTIFS 审中-公开
    PROCÉDÉDERÉALISATIONDE MOTIFS

    公开(公告)号:EP3238233A1

    公开(公告)日:2017-11-01

    申请号:EP15820159.0

    申请日:2015-12-22

    摘要: The invention concerns, in particular, a method for producing patterns in a layer to be etched (410), from a stack comprising at least the layer to be etched (410) and one masking layer (420) overlying the layer to be etched (410), the masking layer (420) having at least one pattern (421), the method comprising at least: a) a step of modifying at least one area (411) of the layer to be etched (410) by ion implantation (430) in line with the at least one pattern (421); b) at least one sequence of steps comprising: b1) a step (440) of enlarging the at least one pattern (421) in a plane in which the layer (410) to be etched mainly extends; b2) a step of modifying at least one area (411', 411'') of the layer to be etched (410) by ion implantation (430) in line with the at least one enlarged pattern (421), the implantation being carried out at a depth less than the implantation depth of the preceding modification step; c) a step (461, 462) of removing the modified areas (411, 411', 411''), the removal comprising a step of etching the modified areas (411, 411', 411'') selectively to the non-modified areas (412) of the layer (410) to be etched.

    摘要翻译: 本发明尤其涉及一种用于由至少包括待蚀刻层(410)和覆盖待蚀刻层(410)的一个掩蔽层(420)的叠层产生待蚀刻层(410)中的图案的方法, 410),所述掩模层(420)具有至少一个图案(421),所述方法至少包括:a)通过离子注入(410)修改要蚀刻的层(410)的至少一个区域(411) 430)与所述至少一个图案(421)一致; b)至少一个步骤序列,包括:b1)在待蚀刻的层(410)主要延伸的平面中放大至少一个图案(421)的步骤(440); b) b2)通过与至少一个放大图案(421)一致的离子注入(430)来修改待蚀刻层(410)的至少一个区域(411',411“)的步骤, 以小于前一修改步骤的植入深度的深度排出; c)去除所述修改区域(411,411',411“)的步骤(461,462),所述去除包括选择性地将所述修改区域(411,411',411”)蚀刻到所述修改区域 将被蚀刻的层(410)的改性区域(412)。