公开(公告)号：EP3038974A1

公开(公告)日：2016-07-06

申请号：EP14839979.3

申请日：2014-08-26

Applicant: Silex Microsystems AB

Inventor： KÄLVESTEN, Edvard ,  EBEFORS, Thorbjörn ,  SVEDIN, Niklas

IPC: B81B7/00 ,  B81C1/00 ,  H01L21/50 ,  H01L23/48

CPC classification number: B81B7/007 ,  B81B2201/01 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2207/095 ,  B81C1/00301 ,  B81C2201/0153 ,  B81C2201/036 ,  B81C2203/0109 ,  B81C2203/0145 ,  H01L21/50 ,  H01L23/08 ,  H01L24/94 ,  H01L2924/16235

Abstract: The invention relates to a device comprising a base substrate(700) with a micro component (702) attached thereto. Suitably it is provided with routing elements (704) for conducting signals to and from said component (702). It also comprises spacer members (706) which also can act as conducting structures for routing signals vertically. There is a capping structure (708) of a glass material, provided above the base substrate (700), bonded via said spacer members (706), preferably by eutectic bonding, wherein the capping structure (708) comprises vias (710) comprising metal for providing electrical connection through said capping structure. The vias can be made by a stamping/pressing method entailing pressing needles under heating to soften the glass and applying pressure, to a predetermined depth in the glass. However, other methods are possible, e-g- drilling, etching, blasting.

Abstract translation: 一种装置包括具有附接到其上的微组件（702）的基底（700）。 适当地，它设置有用于向组件（702）传导信号和从组件（702）传出信号的路由元件（704）。 它还包括间隔件（706），其也可以用作垂直路线信号的导电结构。 存在玻璃材料的覆盖结构（708），其设置在基底基板（700）上方，优选地通过共晶接合通过间隔件（706）接合，其中封盖结构（708）包括通孔（710），包括金属 用于通过封盖结构提供电连接。 通孔可以通过加压的冲压/压制方法制成，以使玻璃软化并施加压力至玻璃中的预定深度。 然而，其他方法是可能的，例如钻孔，蚀刻，爆破。

公开(公告)号：EP2758999A4

公开(公告)日：2016-01-27

申请号：EP12833705

申请日：2012-09-22

Applicant: 1366 TECHNOLOGIES INC

Inventor： SACHS EMANUEL M

IPC: H01L31/18 ,  B29C33/42 ,  B81C99/00

CPC classification number: H01L31/18 ,  B29C33/40 ,  B29C33/42 ,  B29C33/424 ,  B29C43/021 ,  B29C2033/426 ,  B29C2043/025 ,  B29C2059/023 ,  B81C99/0085 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

公开(公告)号：EP1760042B1

公开(公告)日：2013-05-29

申请号：EP06300836.1

申请日：2006-07-28

Applicant: Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Inventor： Marion, François

IPC: B81C1/00 ,  H05K3/34

CPC classification number: B81C1/00269 ,  B81C2201/0153 ,  B81C2203/019 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/062 ,  H05K3/3478 ,  H05K2203/0113 ,  H05K2203/0405 ,  H05K2203/043 ,  Y10T29/49155 ,  Y10T29/49158 ,  H01L2924/00 ,  H01L2924/00014

公开(公告)号：EP1948556B1

公开(公告)日：2013-05-01

申请号：EP05795286.3

申请日：2005-10-20

Applicant: Agency for Science, Technology and Research

Inventor： ZHANG, Fengxiang ,  LOW, Hong Yee

IPC: B81C99/00 ,  G03F7/00

CPC classification number: B29C59/02 ,  B81C99/0085 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10T428/24479

公开(公告)号：EP2360115A1

公开(公告)日：2011-08-24

申请号：EP10194892.5

申请日：2010-12-14

Applicant: Helmholtz-Zentrum Berlin für Materialien und Energie GmbH ,  Consejo Superior De Investigaciones Cientificascs CSIC

Inventor： Senn, Tobias ,  Esquivel-Bojorquez, Juan Pablo ,  Sabaté-Vzcarra, Neus ,  Lörgen, Dr. Marcus

IPC: B81C99/00 ,  H01M8/00

CPC classification number: B81C99/009 ,  B81B2201/051 ,  B81C1/00206 ,  B81C2201/0153 ,  B81C2201/034 ,  H01M8/0258 ,  H01M8/04164 ,  H01M2008/1095

Abstract: A method of producing a polymer stamp for the reproduction of devices is provided, wherein the device comprises microstructures and nanostructures. The method comprises the steps of providing a thermoplastic foil (27), providing a first substrate (1), patterning nanostructures (3) into the thermoplastic foil (27), patterning microstructures (5, 6) onto the first substrate (1), covering the first substrate (1) surface comprising the microstructures (5, 6) with the nanostructured thermoplastic foil (27), casting a polymer elastomer onto the first substrate (1) with nanostructures (3) and microstructures (5, 6) to form a polymer stamp (11) and releasing the polymer stamp (11). Accordingly, a polymer stamp and a device are provided, wherein the aspect ratio of a single nanostructure element in the polymer stamp or the device is larger than 5.

Abstract translation: 制造用于器件的再现的聚合物印模的一种方法被提供，worin所述装置包括微结构和纳米结构。 该方法包括：提供热塑性箔（27）提供第一基片（1），图案化的纳米结构（3）在热塑性箔（27），图案化的微结构（5,6）在第一衬底的步骤（1） 覆盖所述第一基板（1）表面，其包括微结构（5,6）与所述纳米结构化的热塑性箔（27），流延的聚合物弹性体到所述第一基片（1）纳米结构（3）和微结构（5,6），以形成 聚合物印模（11）和释放所述聚合物印模（11）。 因此，提供了一个聚合物印模和设备，worin单个纳米结构元件在聚合物印模的纵横比或设备大于第五大

公开(公告)号：EP2340287A2

公开(公告)日：2011-07-06

申请号：EP09748237.6

申请日：2009-10-21

Applicant: Karlsruher Institut für Technologie

Inventor： WORGULL, Matthias ,  HÖLSCHER, Hendrik

IPC: C09J7/00 ,  B81C1/00 ,  A44B18/00

CPC classification number: C09J7/00 ,  A44B18/0053 ,  B81B2203/0361 ,  B81C1/00111 ,  B81C2201/0153 ,  C09J2201/626

Abstract: The invention relates to a moulded product comprising a substrate (1), to which a plurality of first fibres (10) is applied, the underside (11) of each fibre being permanently fixed to the surface (2) of the substrate (1), and a plurality of second fibres (20), the respective undersides (21) of which are permanently connected to the surfaces (12) of the first fibres (10). The flanks (15) of the first fibres (10) and the flanks (25) of the second fibres (20) are concave. The invention further relates to a method for producing a moulded product of this type and to the use of said product as the attachment surface of an object.

公开(公告)号：EP1915888A4

公开(公告)日：2013-05-22

申请号：EP06844135

申请日：2006-06-05

Applicant: MOLECULAR IMPRINTS INC

Inventor： XU FRANK Y

IPC: B29B9/00 ,  C08L59/00 ,  C09J5/00 ,  C30B23/00 ,  C30B25/00 ,  G03F7/00

CPC classification number: B32B37/14 ,  B32B38/06 ,  B81C1/0046 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  C08L59/00 ,  C09J5/00 ,  C09J2205/31 ,  C09J2451/00 ,  G03F7/0002 ,  Y10T156/10

Abstract: The present invention provides a method adhering a layer to a substrate that features defining first and second interfaces by having a composition present between the layer and the substrate that forms covalent bonds to the layer and adheres to the substrate employing one or more of covalent bonds, ionic bonds and Van der Waals forces. In this manner, the strength of the adhering force of the layer to the composition is assured to be stronger than the adhering force of the layer to the composition formed from a predetermined adhering mechanism, i.e., an adhering mechanism that does not include covalent bonding.

公开(公告)号：EP2206678A3

公开(公告)日：2012-09-26

申请号：EP09009362.6

申请日：2009-06-25

Applicant: BPE e. K.

Inventor： Hornig, Wolfgang, Dr.

IPC: B81C99/00 ,  B44B3/00 ,  B44C1/24

CPC classification number: B81C99/0085 ,  B44B3/00 ,  B44C1/24 ,  B81C99/009 ,  B81C2201/0153 ,  B81C2201/036

Abstract: Die Erfindung betrifft ein Verfahren, mit dem die Oberflächen von Körpern mit unterständigen Mikro- oder Nanostrukturen versehen sowie mikro- und/oder nanogroß durchbrochene Folien hergestellt werden können. Hierzu wird die aus Diamant, Hartmetall, Glas oder Keramik bestehende Spitze (2) zumindest eines nadelförmigen Prägewerkzeugs (1) unter Verwendung einer Positioniereinrichtung sehr oft auf verschiedene Stellen der Oberfläche des Körpers (3) gepresst, wodurch an allen Aufpressstellen Vertiefungen (4) eingeprägt und/oder Durchbrüche (5) erzeugt werden. Das Verfahren ist für die kostengünstige Herstellung von Urformen für den Polymer-Spritzguss von Mikro- oder Nanolinsenarrays, von Mikro- oder Nano-Prägewerkzeugen, von Mikroreaktoren ("lab on a chip"), von strukturierten Elektroden- sowie Wärmetauscherflächen, von lithografischen Masken und für die fälschungssichere Kennzeichnung von Gegendständen geeignet. Spezifische Signaturen können auch als Nachweis für nachträglich erfolgte Veränderungen oder Belastungen (Schrumpfung, plastische Verformung, Reibung, Verschleiß, Korrosion, Beschichtung) an Körpern dienen. - Fig. 1 -

公开(公告)号：EP1948556A4

公开(公告)日：2011-01-05

申请号：EP05795286

申请日：2005-10-20

Applicant: AGENCY SCIENCE TECH & RES

Inventor： ZHANG FENGXIANG ,  LOW HONG YEE

IPC: B82B3/00 ,  B29C59/02 ,  G03F7/00

CPC classification number: B29C59/02 ,  B81C99/0085 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10T428/24479

公开(公告)号：EP1639411B1

公开(公告)日：2010-08-04

申请号：EP04743806.4

申请日：2004-06-22

Applicant: Consiglio Nazionale delle Ricerche

Inventor： TORMEN, Massimo

IPC: G03F7/00 ,  B29C45/73 ,  B82B3/00

CPC classification number: G03F7/0002 ,  B29C33/02 ,  B81C99/0085 ,  B81C2201/0153 ,  B81C2201/036 ,  B82Y10/00 ,  B82Y40/00

Abstract: A lithographic process for forming a pattern in relief (20) on a mass (10) of polymeric material comprises the steps of: preparing the mass (10) of polymeric material and a die (12) having a surface region (14) facing towards the mass (10) of polymeric material and which reproduces in negative the pattern in relief (20); heating the die (12) and putting the mass (10) of polymeric material into contact with the die (12) in any temporal sequence, in such a way that the part of the mass (10) of polymeric material in contact with the surface zone (14) is subject to softening; and separating the die (12) from the mass (10) of polymeric material on the surface of which the pattern in relief (20) has been formed. The heating of at least one part of the die (12) is obtained by generation of thermal energy upon dissipation of another form of energy in at leats one region (16) of the die (12).