公开(公告)号：EP3118934A4

公开(公告)日：2017-11-08

申请号：EP15761023

申请日：2015-02-10

Applicant: DEXERIALS CORP

Inventor： YAMADA YASUNOBU ,  SEKIGUCHI MORIO ,  KUMAKURA SUSUMU

IPC: C08J5/18 ,  C09J7/00 ,  C09J9/02 ,  C09J11/04 ,  C09J167/00 ,  C09J201/00 ,  H01B1/20 ,  H01B1/22 ,  H01B5/16 ,  H01R11/01 ,  H01R43/00

CPC classification number: C09J7/00 ,  C08K2201/001 ,  C08L75/04 ,  C09J7/10 ,  C09J9/02 ,  C09J11/04 ,  C09J167/00 ,  C09J175/04 ,  C09J2201/602 ,  C09J2201/61 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2467/00 ,  C09J2475/00 ,  H01B1/124 ,  H01B1/22 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/29499 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2924/01047 ,  H01R4/04

Abstract: An anisotropic conductive film for anisotropically conductively connecting a terminal of a first electronic component and a terminal of a second electronic component, the anisotropic conductive film including: a conductive particle-containing layer, which contains an adhesive layer-forming component and conductive particles, wherein the conductive particle-containing layer has two endothermic peaks in differential scanning calorimetry where endothermic peak temperatures are measured under conditions that a measuring temperature range is from 10°C to 250°C and a heating speed is 10°C/min, and wherein T2 is 30°C or higher, and T4-T2 is greater than 0°C but 80°C or less, where T2 is a temperature of the endothermic peak present at a lower temperature side, and T4 is a temperature of the endothermic peak present at a higher temperature side.

公开(公告)号：EP3086411A4

公开(公告)日：2017-12-20

申请号：EP14871737

申请日：2014-12-10

Applicant: DEXERIALS CORP

Inventor： YAMADA YASUNOBU ,  SEKIGUCHI MORIO ,  KUMAKURA SUSUMU

IPC: H01R11/01 ,  H01R43/00

CPC classification number: H05K3/225 ,  H05K1/0353 ,  H05K1/181 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2203/176

Abstract: A method for manufacturing a mounting body comprising: a mounting step of mounting an electronic component onto a wiring board via an anisotropic conductive film containing a binder having an epoxy resin as a primary constituent and conductive particles having a compressive hardness (K) of 500 kgf / mm 2 or more when compressively deformed by 10%, wherein a relation between a thickness (A) of the binder and an average particle diameter (B) is 0.6 ‰¦ B / A ‰¦ 1.5 and an elastic modulus of the binder after curing is 50 MPa or more at 100°C; and a remounting step of mechanically peeling to detach the electronic component and the wiring board in the case of a problem occurring in mounting of the mounting step and reusing the wiring board to perform the mounting step.