公开(公告)号：EP1412974A2

公开(公告)日：2004-04-28

申请号：EP02747220.8

申请日：2002-06-14

Applicant: EPCOS AG

Inventor： STELZL, Alois ,  KRÜGER, Hans ,  FEIERTAG, Gregor ,  CHRISTL, Ernst

IPC: H01L21/50 ,  H01L23/10

CPC classification number: H01L24/97 ,  H01L21/50 ,  H01L23/10 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/3025 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49171 ,  Y10T29/49176 ,  Y10T29/49789 ,  H01L2224/81 ,  H01L2924/00

Abstract: The invention relates to a method for hermetically encapsulating a component (1) that is mounted in flip-chip design on a support (4). The inventive method is characterized by first covering the component with a film (8) that closely rests on the component and the support, then structuring the film, and providing thereon a hermetically sealing layer (14), especially a metal layer, which seals up with the support.

公开(公告)号：EP1356518A2

公开(公告)日：2003-10-29

申请号：EP02701213.7

申请日：2002-01-21

Applicant: EPCOS AG

Inventor： FEIERTAG, Gregor ,  STELZL, Alois ,  KRÜGER, Hans

IPC: H01L23/498

CPC classification number: H03H9/059 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H03H9/1078 ,  H03H9/1092 ,  H05K1/0306 ,  H05K1/114 ,  H05K2201/10674 ,  H01L2224/0401

Abstract: The aim of the invention is to use a slow dissolving ceramic substrate for components mounted according to the Flip-Clip method, particularly surface wave components, whereby multi-layered metallisations are optionally produced thereon by metal deposition. The bumps can also be produced by self-adjusting metal deposition.