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    SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE DEVICE
    5.
    发明公开
    SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE DEVICE 审中-公开
    面波成分及其制备方法

    公开(公告)号：EP1313217A4

    公开(公告)日：2008-09-24

    申请号：EP01947885

    申请日：2001-07-06

    申请人： TOSHIBA KK

    发明人： FURUKAWA O

    IPC分类号： H03H3/08 ,  H03H9/25 ,  H01L21/60 ,  H01L23/31

    CPC分类号： H03H9/059 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/97 ,  H03H3/08 ,  H03H9/1078 ,  H03H9/1085 ,  H03H9/25

    摘要： A surface acoustic wave device used in, for example, a mobile communications field as a filter or duplexer and the like to handle high frequencies of about several GHz is fabricated by flip-chip-connecting a surface of a piezoelectric substrate to a base board facing thereto, emitting particulate first sealing material from above a back face of the piezoelectric substrate to apply the first sealing material to the back face of the piezoelectric substrate and hang the first sealing material from edges of the piezoelectric substrate to the base board to form bridging, and forming second sealing material on the first sealing material. These operations provide a manufacturing method of a small-sized surface-mounting surface acoustic wave device appropriate for flip-chip connection.

    ACOUSTIC BOUNDARY WAVE DEVICE
    8.
    发明公开
    ACOUSTIC BOUNDARY WAVE DEVICE 有权
    AKUSTISCHE GRENZWELLENEINRICHTUNG

    公开(公告)号：EP1635459A1

    公开(公告)日：2006-03-15

    申请号：EP05703310.2

    申请日：2005-01-05

    申请人： MURATA MANUFACTURING CO., LTD.

    发明人： KANDO, Hajime, c/o MURATA MANUFACTURING CO., LTD.

    IPC分类号： H03H9/145 ,  H01L41/09 ,  H01L41/18 ,  H01L41/22 ,  H03H3/08 ,  H03H9/25

    CPC分类号： H04R31/00 ,  H03H3/08 ,  H03H9/0222 ,  H03H9/02929 ,  H03H9/059 ,  H03H9/1078 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49007 ,  Y10T29/4908 ,  Y10T29/49798

    摘要： A boundary acoustic wave device using SH boundary acoustic waves is provided in which undesired spurious responses are reduced effectively, and which can produce superior resonance characteristics or filter characteristics.
    The boundary acoustic wave device (1) includes a first medium layer (2), a second medium layer (6) stacked on the first medium layer (2), and an electrode including an interdigital electrode (3) and reflectors (4 and 5). A sound-absorbing layer (7) is provided on the surface of the first medium layer (2) and/or the second medium layer (6) opposite the interface therebetween

    摘要翻译： 提供了使用SH边界声波的边界声波装置，其中不期望的寄生响应被有效地降低，并且其可以产生优异的谐振特性或滤波器特性。 弹性边界波装置（1）包括堆叠在第一介质层（2）上的第一介质层（2），第二介质层（6）和包括交叉指向电极（3）和反射器（4和5）的电极 ）。 在第一介质层（2）和/或第二介质层（6）的与其界面相对的表面上设置吸声层（7）

    SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE DEVICE
    9.
    发明公开
    SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE DEVICE 审中-公开
    VERFAHREN ZU SEINER HERSTELLUNG的OBERFLÄCHENWELLENBAUEMENT

    公开(公告)号：EP1313217A1

    公开(公告)日：2003-05-21

    申请号：EP01947885.8

    申请日：2001-07-06

    申请人： Kabushiki Kaisha Toshiba

    发明人： FURUKAWA,O. Intellectual Prop.Div. ToshibaCorp.

    IPC分类号： H03H9/25 ,  H03H3/08 ,  H01L23/31 ,  H01L21/60

    CPC分类号： H03H9/059 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/97 ,  H03H3/08 ,  H03H9/1078 ,  H03H9/1085 ,  H03H9/25

    摘要： A surface acoustic wave device used in, for example, a mobile communications field as a filter or duplexer and the like to handle high frequencies of about several GHz is fabricated by flip-chip-connecting a surface of a piezoelectric substrate to a base board facing thereto, emitting particulate first sealing material from above a back face of the piezoelectric substrate to apply the first sealing material to the back face of the piezoelectric substrate and hang the first sealing material from edges of the piezoelectric substrate to the base board to form bridging, and forming second sealing material on the first sealing material. These operations provide a manufacturing method of a small-sized surface-mounting surface acoustic wave device appropriate for flip-chip connection.

    摘要翻译： 用于例如作为滤波器或双工器等的移动通信领域中用于处理大约几GHz的高频的表面声波装置通过将压电基板的表面倒装连接到基板 从压电基板的背面的上方排出微粒第一密封材料，将第一密封材料施加到压电基板的背面，并将第一密封材料从压电基板的边缘悬挂到基板上以形成桥接， 以及在所述第一密封材料上形成第二密封材料。 这些操作提供适用于倒装芯片连接的小尺寸表面安装表面声波装置的制造方法。