摘要:
The invention relates to a method for depositing a semiconductor thin layer (CM) comprising at least one sulphide of a metal species, the deposition being performed on a semiconductor film (F) arranged in a chemical bath (BC), the method comprising the steps of: preparing the chemical bath (BC) using at least one sulphurated precursor of said sulphide of a metal species and a salt containing said at least one metal species, the at least one sulphurated precursor containing a thioacid; and forming the thin layer (CM) by illumination by means of a light source (S) of the chemical bath (BC) and the semi-conductive film (F).
摘要:
The invention relates to a chemical bath for depositing a layer made from at least metal and sulphur. It also relates to a method for depositing such a layer. This bath comprises, in solution: - a metal salt comprising a metal chosen from at least one of the elements from groups IIB and IIIA of the periodic table; and - a sulphur precursor. The bath further comprises a morpholine compound.
摘要:
The invention relates to a chemical bath for depositing a layer made from at least metal and sulphur. It also relates to a method for depositing such a layer. The bath comprises, in solution: - a metal salt comprising a metal chosen from at least one of the elements from groups IIB and IIIA of the periodic table; and - a sulphur precursor. The bath further comprises a persulfate compound.
摘要:
A method and device for electrodeposition in cylindrical geometry. The invention relates to a method for electrochemically depositing a thin layer on a flexible substrate, comprising the following steps: -providing, in an electrolysis bath, a first closed cylinder in a second hollow cylinder, -applying the flexible substrate to one of the surfaces chosen from the outer surface of the first cylinder and the inner surface of the second cylinder, the flexible substrate forming a first electrode, -providing, in the electrolysis bath, a second electrode, and -applying a potential difference between the first electrode and the second electrode in order to electrodeposit the thin layer on the flexible substrate.