公开(公告)号：EP2370348A4

公开(公告)日：2016-12-21

申请号：EP09836644

申请日：2009-12-02

申请人： 3M INNOVATIVE PROPERTIES CO

发明人： WANG DING ,  PORQUE JEROME C

IPC分类号： B82B3/00 ,  B82B1/00 ,  B82Y20/00 ,  C25D1/00 ,  C25D5/02 ,  G02B5/30

CPC分类号： C25D1/006 ,  B82Y20/00 ,  C25D1/003 ,  C25D5/02 ,  C25D5/028 ,  G02B5/3025 ,  G02B2207/101

公开(公告)号：EP2753574A4

公开(公告)日：2015-04-08

申请号：EP12830349

申请日：2012-09-06

申请人： IBM

发明人： PENG HONGBO ,  LUAN BINQUAN ,  AFZALI-ARDAKANI ALI

IPC分类号： B82Y40/00 ,  B82Y30/00 ,  C25D3/66 ,  C25D5/02 ,  C25D13/04 ,  G01N33/487

CPC分类号： B82Y30/00 ,  B82Y40/00 ,  C12Q1/6869 ,  C25D3/665 ,  C25D5/028 ,  C25D13/04 ,  G01N33/48721

摘要： A technique for embedding a nanotube in a nanopore is provided. A membrane separates a reservoir into a first reservoir part and a second reservoir part, and the nanopore is formed through the membrane for connecting the first and second reservoir parts. An ionic fluid fills the nanopore, the first reservoir part, and the second reservoir part. A first electrode is dipped in the first reservoir part, and a second electrode is dipped in the second reservoir part. Driving the nanotube into the nanopore causes an inner surface of the nanopore to form a covalent bond to an outer surface of the nanotube via an organic coating so that the inner surface of the nanotube will be the new nanopore with a super smooth surface for studying bio-molecules while they translocate through the nanotube.

公开(公告)号：EP2201160B1

公开(公告)日：2012-10-31

申请号：EP09765476.8

申请日：2009-05-08

申请人： RENA GmbH

发明人： BÜRGER, Norbert ,  DELAHAYE, Franck ,  KALTENBACH, Konrad

IPC分类号： C25D5/08 ,  C25D7/12 ,  C25D17/02 ,  C25D17/06 ,  H01L31/0224 ,  H01L31/18 ,  C25D5/02 ,  C25D17/00

CPC分类号： H01L31/18 ,  C23C18/1621 ,  C23C18/163 ,  C25D5/006 ,  C25D5/028 ,  C25D5/08 ,  C25D5/18 ,  C25D7/126 ,  C25D17/001 ,  C25D17/005 ,  C25D17/02 ,  C25D17/06 ,  C25F3/12 ,  C25F7/00

摘要： The invention relates to the wet-chemical or electrolytic treatment of flat material, for example a wafer, which according to the prior art is treated by means of technically complex frames or grippers in treatment chambers. Particularly in the case of fracture-sensitive material such as silicon solar cells, the handling is very time-consuming, especially when the underside  of the material must not be wetted. According to the invention, the material (1) is placed without frames, grippers or holders above a vertically arranged treatment chamber (3) so that only the underside is wetted by the treatment liquid. As a result of a rotationally symmetric flow (4) on the underside (7) of the material placed on the surface of a treatment liquid, the adhesion forces acting horizontally on the material (1) cancel one another out. A lateral shift of the material does not occur. The limiters or lateral end stops which are usually used can therefore be dispensed with.

公开(公告)号：EP2505692A2

公开(公告)日：2012-10-03

申请号：EP12161834.2

申请日：2012-03-28

申请人： Pratt & Whitney Canada Corp.

发明人： James, Jerome

IPC分类号： C25D5/02 ,  C25D17/00 ,  C25D17/10

CPC分类号： C25D17/10 ,  B33Y70/00 ,  B33Y80/00 ,  C25D5/026 ,  C25D5/028 ,  C25D5/08 ,  C25D7/04 ,  C25D17/02 ,  C25D17/12 ,  F01D9/04 ,  F01D25/28 ,  F05D2230/90

摘要： An apparatus (20) for metal plating aircraft engine components (10) allows the creation a local environment for plating by covering a localized area (12) to be plated so that the localized area (12) to be plated is sealed from remaining parts of the component (10), thereby eliminating the need for masking remaining parts of the component (10) prior to plating. The apparatus (20) comprises a hood body (22) adapted to cover the surface area (12), the body (12) having an annular anode (44) and passages (36) for passing plating fluid to a gap (42) between the hood (22) and the component (10).

公开(公告)号：EP2484812A1

公开(公告)日：2012-08-08

申请号：EP10820399.3

申请日：2010-09-21

申请人： JX Nippon Mining & Metals Corporation

发明人： CHIBA Yoshihiro

IPC分类号： C25D7/06 ,  B32B15/08 ,  C25D3/30 ,  H05K9/00

CPC分类号： H05K9/0084 ,  B32B15/09 ,  C25D3/30 ,  C25D3/60 ,  C25D5/028 ,  C25D7/0614 ,  C25D15/00

摘要： A Sn or Sn alloy plated film 2 formed on other surface of a copper foil or a copper alloy foil 1 having a resin layer or film 4 laminated on one side surface thereof, wherein Sn or Sn alloy plated film has a percentage of (200) plane orientation of 20 to 40%.

摘要翻译： 在铜箔的另一个表面上形成的Sn或Sn合金镀膜2或在其一个侧面层叠有树脂层或膜4的铜合金箔1，其中Sn或Sn合金镀膜的百分比为（200） 平面取向为20〜40％。

公开(公告)号：EP2152939A1

公开(公告)日：2010-02-17

申请号：EP09757157.4

申请日：2009-05-08

申请人： RENA GmbH

发明人： GUTEKUNST, Mathias

IPC分类号： C25D5/02 ,  C25D17/00 ,  C25D7/06 ,  C25D21/12

CPC分类号： C25D5/028 ,  C25D5/18 ,  C25D7/0621 ,  C25D17/001 ,  C25D17/005 ,  C25D21/12

摘要： The invention relates to the electrical contact of flat material (1) as sections in straight-through installations for the electrolytic and/or chemical wet treatment of the treatment side (10) of the material using external electric current, with the top, contact side (9) being kept dry and the treatment side (10) penetrating into the treatment liquid (11). The known transporting systems with top and bottom transporting and/or contact means result in treatment liquid (11) being transferred from the bottom means to the top means, in which case the top side of the material is often inadmissbly wetted and the top contacts are galvanized and therefore continuously stripped, which requires relatively high outlay. According to the invention, the level is lowered in the region of top contacts (6). This means that these cannot be wetted, even when there is no material located in the region of the contacts (6). This is achieved by way of downpipes (5) which are assigned to each contact (6). Even in the case of contacts being relieved of any stressing, they do not come into contact with any treatment liquid, as a result of which the top side of the material remains dry and the contacts do not require any stripping.

公开(公告)号：EP2103716A1

公开(公告)日：2009-09-23

申请号：EP09154740.6

申请日：2009-03-10

申请人： Rohm and Haas Electronic Materials LLC

发明人： Hamm, Gary ,  Jacques, David J. ,  Colangelo, Carl J.

IPC分类号： C25D3/46 ,  C25D5/02 ,  C25D7/12

CPC分类号： C25D3/46 ,  C25D5/022 ,  C25D5/028 ,  H01L31/022425 ,  Y02E10/50

摘要： Methods of inhibiting background plating on semiconductor substrates using oxidizing agents are disclosed.

摘要翻译： 公开了使用氧化剂抑制半导体衬底上的背景电镀的方法。

公开(公告)号：EP1170401A3

公开(公告)日：2004-01-28

申请号：EP01113788.2

申请日：2001-06-06

申请人： Degussa Galvanotechnik GmbH

发明人： Engert, Thomas ,  Steinhilber, Gerhard

IPC分类号： C25D5/02 ,  C25D3/66 ,  C25B11/04

CPC分类号： C25D5/028 ,  C25B11/0473 ,  C25D3/66 ,  C25D5/026

摘要： Die erfindung betrifft ein Verfahren zur Herstellung von einseitig platinierten Platten aus Refraktärmetallen, bei dem man Platten vorgegebener Abmessung aus Refraktärmetall Rücken an Rücken formschlüssig dicht mit einander verbindet, diese mittels Schmelzelektrolyse auf ihren freien Oberflächen mit Platin beschichtet und dann die Platten von einander trennt. Diese Platten können zu einseitig platinierten Streckmetallgittern verarbeitet werden. Diese einseitig platinierten Platten aus Refraktärmetallen und die daraus gefertigten einseitig platinierten Streckmetallgitter können sehr vorteilhaft als Anoden in elektrolytischen und galvanischen Prozessen eingesetzt werden.

公开(公告)号：EP0398534B1

公开(公告)日：1994-08-17

申请号：EP90304621.7

申请日：1990-04-27

申请人： SUMITOMO METAL INDUSTRIES, LTD.

发明人： Suzuki, Nobukazu ,  Bando, Seiji ,  Kurayasu, Hirofumi ,  Okawa, Kazunobu

IPC分类号： C25D5/02 ,  C25D5/36 ,  C25D5/48 ,  C25D21/14 ,  G01N31/22

CPC分类号： C25D21/14 ,  C25D5/028 ,  C25D5/36 ,  C25D5/48

公开(公告)号：EP0410955A1

公开(公告)日：1991-01-30

申请号：EP90890216.6

申请日：1990-07-24

申请人： Maschinenfabrik Andritz Actiengesellschaft

发明人： Maresch, Gerald, Dr. Dipl.-Ing. ,  Krupicka, Ulrich

IPC分类号： C25D5/02 ,  C25F5/00

CPC分类号： C25D5/028 ,  C25F5/00

摘要： Verfahren zur einseitigen elektrolytischen Beschichtung flächiger Werkstücke aus Stahl, insbesondere Stahlbänder, mit einem Metall bzw. einer Metallegierung, insbesondere mit einer Zink-Nickel-Legierung, gekennzeichnet durch das Aufbringen einer dünnen Schicht aus demselben Material, das für die einseitige Beschichtung vorgesehen ist, auf beiden Seiten des Werkstückes; anschließende einseitige Beschichtung; und schließlich elektrolytische Ablösung der dünnen Schicht auf der Seite, welche der dauerhaft zu beschichtenden Seite gegenüberliegt. Als Elektrolyt bei der Ablösung wird eine wässrige Lösung eines Alkali- oder Erdalkalichlorids, vorzugsweise Natrium- oder Kalkumchlorid bei einem ph-Wert von 7 - 12 verwendet.

摘要翻译： 用钢，特别是钢带，金属或金属合金，特别是锌 - 镍合金制成的平面工件的单面电镀工艺，其特征在于沉积相同材料的薄层，设计的薄层 用于工件两侧的单面电镀; 随后单面电镀; 最后，在与要永久涂覆的一侧相对的一侧电解剥离薄层。 在汽提中使用的电解质是碱金属或碱土金属氯化物，优选pH为7-12的氯化钠或氯化钙的水溶液。