公开(公告)号：EP0828582A4

公开(公告)日：1999-02-03

申请号：EP96916923

申请日：1996-05-28

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  DOZIER THOMAS H ,  ELDRIDGE BENJAMIN N ,  GARY W GRUBE ,  GAETAN L MATHIEU

IPC: H01L23/32 ,  B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/32 ,  H05K3/40

CPC classification number: H05K3/4015 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/06711 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/73203 ,  H01L2224/78302 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H01L2924/00

Abstract: Interconnection elements (550) for electronic components (556), exhibiting desirable mechanical characteristics (such as resiliency), for making pressure contact(s) are formed by shaping a ribbon-like core element (552) of a soft material (such as gold or soft copper) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (558) such as nickel and it alloys, to impart a desired spring (resilient) characteristic to the resulting composite interconnection element (550). A final overcoat of a material (220) having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element (200). The resulting interconnection elements (500, 550) may be mounted to a variety of electronic components.