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8 条记录 (耗时 0.01 秒)

    Interposer substrate and method of manufacturing the same
    1.
    发明公开
    Interposer substrate and method of manufacturing the same 审中-公开
    Interposersubstrat和Verfahren zu seiner Herstellung

    公开(公告)号：EP2763514A1

    公开(公告)日：2014-08-06

    申请号：EP14166887.1

    申请日：2010-12-24

    申请人： Fujikura Ltd.

    发明人： Yamamoto, Satoshi ,  Suzuki, Takanao ,  Matsuyama, Masami

    IPC分类号： H05K1/11 ,  H01L23/12 ,  H05K3/40

    CPC分类号： H05K3/0029 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2203/025 ,  Y10T29/49165 ,  H01L2924/00

    摘要： A method of manufacturing an interposer substrate that is provided with a planar substrate, and with a through hole interconnection that is formed by filling a through hole that connects together a first main surface and a second main surface of the substrate with a conductor. The through hole has a first aperture portion in the first main surface, and has a second aperture portion in the second main surface. The through hole is formed by irradiating the area of the substrate with laser light, so that when the through hole is viewed in a vertical cross-sectional view of the substrate, the through hole has a trapezoidal shape. The side faces of the trapezoid are not parallel to each other and are both inclined towards the same side.

    摘要翻译： 一种制造具有平面基板的内插基板的制造方法，其特征在于，具有通过用导体填充将所述基板的第一主面与所述第二主面连接在一起的通孔而形成的贯通孔互连。 通孔在第一主表面具有第一开口部分，并且在第二主表面中具有第二开口部分。 通孔是通过用激光照射基板的区域而形成的，使得当在基板的垂直截面图中观察通孔时，通孔具有梯形形状。 梯形的侧面彼此不平行，并且朝向同一侧倾斜。

    Pressure sensor module and electronic component
    2.
    发明公开
    Pressure sensor module and electronic component 审中-公开
    压力传感器模块及电子部件

    公开(公告)号：EP2112488A3

    公开(公告)日：2011-04-20

    申请号：EP09251156.7

    申请日：2009-04-22

    申请人： Fujikura, Ltd.

    发明人： Yamamoto, Satoshi ,  Hashimoto, Hirokazu

    IPC分类号： G01L9/06 ,  B81B7/00 ,  G01L9/00 ,  G01L9/04

    CPC分类号： G01L9/0054 ,  G01L19/0069 ,  G01L19/148 ,  H01L2224/05001 ,  H01L2224/16225 ,  H01L2924/07811 ,  H01L2924/00

    摘要： A pressure sensor module includes a pressure sensor, a bump, and a laminated substrate. The pressure sensor includes a semiconductor substrate; a cavity; a pressure-sensitive element; and a conductive section. The cavity is disposed inside the semiconductor substrate such that a thin-plate region of the semiconductor substrate is provided and the thin-plate region being defined as a diaphragm. The pressure-sensitive element is arranged at the diaphragm. The conductive section is electrically connected to the pressure-sensitive element and disposed on the face of the semiconductor substrate at a region excluding the diaphragm. The bump is electrically connected to the conductive section. The laminated substrate includes a wiring base material electrically connected to the pressure sensor via the bump. The wiring base material is disposed inside the laminated substrate. A face of the wiring base material is electrically connected to the bump and has an exposed area from the laminated substrate.

    Pressure sensor and manufacturing method thereof
    4.
    发明公开
    Pressure sensor and manufacturing method thereof 审中-公开
    压力传感器及其制造方法

    公开(公告)号：EP1223420A3

    公开(公告)日：2003-07-09

    申请号：EP02290084.9

    申请日：2002-01-14

    申请人： FUJIKURA LTD.

    发明人： Yamamoto, Satoshi ,  Nakao, Osamu ,  Nishimura, Hitoshi ,  Sato, Masahiro

    IPC分类号： G01L9/12 ,  G01L1/14 ,  G01L9/00

    CPC分类号： G01L9/0073 ,  G01L1/148

    摘要： It is an object of the present invention to provide a touch mode capacitive pressure sensor having higher pressure durability than conventional sensors. In this invention, a touch mode capacitive pressure sensor has a diaphragm made from boron-doped silicon, and the boron concentration at the top face of the diaphragm is equal to or greater than 1 × 10 19 cm -3 and less than 9 × 10 19 cm -3 . Further, in this invention, a touch mode capacitive pressure sensor has a conductive diaphragm made by doping of an impurity and anisotropic etching, and the etch pit density on the top face of the diaphragm is equal to or less than five per µm 2 , and preferably equal to or less than one per µm 2 . As a result, the pressure durability of the diaphragm is greatly improved.

    Pressure sensor module and electronic component
    7.
    发明公开
    Pressure sensor module and electronic component 审中-公开
    Drucksensormodul und elektronische Komponente

    公开(公告)号：EP2112488A2

    公开(公告)日：2009-10-28

    申请号：EP09251156.7

    申请日：2009-04-22

    申请人： Fujikura, Ltd.

    发明人： Yamamoto, Satoshi ,  Hashimoto, Hirokazu

    IPC分类号： G01L9/06

    CPC分类号： G01L9/0054 ,  G01L19/0069 ,  G01L19/148 ,  H01L2224/05001 ,  H01L2224/16225 ,  H01L2924/07811 ,  H01L2924/00

    摘要： A pressure sensor module includes a pressure sensor, a bump, and a laminated substrate. The pressure sensor includes a semiconductor substrate; a cavity; a pressure-sensitive element; and a conductive section. The cavity is disposed inside the semiconductor substrate such that a thin-plate region of the semiconductor substrate is provided and the thin-plate region being defined as a diaphragm. The pressure-sensitive element is arranged at the diaphragm. The conductive section is electrically connected to the pressure-sensitive element and disposed on the face of the semiconductor substrate at a region excluding the diaphragm. The bump is electrically connected to the conductive section. The laminated substrate includes a wiring base material electrically connected to the pressure sensor via the bump. The wiring base material is disposed inside the laminated substrate. A face of the wiring base material is electrically connected to the bump and has an exposed area from the laminated substrate.

    摘要翻译： 压力传感器模块包括压力传感器，凸块和层压基板。 压力传感器包括半导体衬底; 一个空腔 压敏元件; 和导电部分。 空腔设置在半导体衬底内，使得设置半导体衬底的薄板区域，并且将薄板区域定义为隔膜。 压敏元件设置在隔膜上。 导电部分电连接到压敏元件并且设置在除了隔膜之外的区域的半导体衬底的表面上。 凸块电连接到导电部分。 层压基板包括经由凸块与压力传感器电连接的布线基材。 配线基材配置在层叠基板的内部。 布线基材的表面与凸点电连接，并且具有来自层压基板的露出区域。

    Method of forming a penetration electrode and substrate having a penetration electrode
    8.
    发明公开
    Method of forming a penetration electrode and substrate having a penetration electrode 审中-公开
    一种用于生产通过电极和基板有通电极的过程

    公开(公告)号：EP1432024A2

    公开(公告)日：2004-06-23

    申请号：EP03028922.7

    申请日：2003-12-17

    申请人： FUJIKURA LTD.

    发明人： Yamamoto, Satoshi ,  Takizawa, Takashi

    IPC分类号： H01L21/768

    CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4038 ,  H05K3/4061 ,  H05K2201/0394 ,  H05K2203/016 ,  H05K2203/128 ,  H01L2924/00

    摘要： A method of forming a penetration electrode in which an electroconductive substance is inserted into a micropore that has one end blocked off only by wiring and a pad formed by an electroconductive substance without the wiring and pad being broken. In this method of forming a penetration electrode, an electroconductive substance is inserted into the micropore that penetrates a substrate and that has one aperture blocked off by an electroconductive thin film. After a protective member that holds the electroconductive thin film is provided on a surface on the electroconductive thin film side of the substrate, an electroconductive substance is inserted from the other aperture of the micropore.

    摘要翻译： 形成其中的贯通电极到导电物质的方法被插入到的微孔（13）做有一个端挡着仅通过布线，并通过在导电物质没有布线和焊盘形成的垫被打破。 在导电性物质形成的贯通电极的该方法（14）被插入到所述微孔没有穿透基板和已做一个孔挡着在导电薄膜（12）。 后的保护部件（20）保持所述导电性确实提供了一种表面上，以导电性物质的基板的导电薄膜侧薄膜由微孔的另一个孔插入。