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1.发明授权
公开(公告)号：EP2292678B1
公开(公告)日：2012-02-15
申请号：EP09762201.3
申请日：2009-02-20
发明人： IKEGAMI, Koichi , KOHIYAMA, Noboru , NISHIKAWA, Teppei , HIGUCHI, Michiya , HAMADA, Nobuhito , DAIDO, Hiroko , INUI, Chieko , KUBO, Tatsuya
IPC分类号： C08G59/17 , C08F8/14 , C08F290/06
CPC分类号： C08G59/1494 , C08F8/14 , C08F220/14 , C08F283/10 , C08F290/06 , C08F290/064 , C08F290/14 , C08F290/144 , C08F2220/1825 , C08F2220/1858 , C08F2220/325 , C08F2810/20 , C08F2810/30 , C08G59/186 , G03F7/032 , G03F7/038 , G03F7/0388 , H05K3/287 , C08F220/10
摘要： Disclosed is a carboxyl group-containing resin which is obtained by reacting a monocarboxylic acid (b) with epoxy groups of a resin (a), which has two or more epoxy groups in a molecule, in an amount of 0.3-0.85 mole per equivalent of the epoxy group in the resin (a), then reacting a polybasic acid (d) with epoxy groups of the thus-obtained reaction product (c) in an amount of 0.15-0.95 mole per equivalent of the epoxy group in the reaction product (c), and then further reacting a monocarboxylic acid (f) with epoxy groups of the thus-obtained reaction product (e) in an amount of 1.0-5.0 moles per equivalent of the epoxy group in the reaction product (f). The thus-obtained carboxyl group-containing resin has an acid value of 20-200 mgKOH/g, and is soluble in organic solvents.
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公开(公告)号：EP3232269B1
公开(公告)日：2019-05-15
申请号：EP14907950.1
申请日：2014-12-10
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公开(公告)号：EP3054350B1
公开(公告)日：2018-04-11
申请号：EP14866816.3
申请日：2014-12-10
CPC分类号： G03F7/031 , G03F7/0042 , G03F7/0043 , G03F7/029 , G03F7/038 , G03F7/0385 , G03F7/0388 , G03F7/20 , G03F7/2006 , G03F7/26 , G03F7/322 , H05K1/02 , H05K1/0274 , H05K1/0353 , H05K3/282 , H05K3/287 , H05K3/3452 , H05K2201/0166 , H05K2201/068
摘要： A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first ±-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25°C, and a second ±-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25°C.
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4.发明公开
公开(公告)号：EP2292678A1
公开(公告)日：2011-03-09
申请号：EP09762201.3
申请日：2009-02-20
发明人： IKEGAMI, Koichi , KOHIYAMA, Noboru , NISHIKAWA, Teppei , HIGUCHI, Michiya , HAMADA, Nobuhito , DAIDO, Hiroko , INUI, Chieko , KUBO, Tatsuya
IPC分类号： C08G59/17 , C08F8/14 , C08F290/06
CPC分类号： C08G59/1494 , C08F8/14 , C08F220/14 , C08F283/10 , C08F290/06 , C08F290/064 , C08F290/14 , C08F290/144 , C08F2220/1825 , C08F2220/1858 , C08F2220/325 , C08F2810/20 , C08F2810/30 , C08G59/186 , G03F7/032 , G03F7/038 , G03F7/0388 , H05K3/287 , C08F220/10
摘要： A carboxyl resin according to the present invention is obtained by a process including following steps: epoxy groups on a resin (a) having two or more epoxy groups in one molecule is made to react with 0.3-0.85 mol of a monocarboxylic acid (b) per one epoxy-group equivalent weight to obtain a reaction product (c); the epoxy group or groups on the reaction product (c) are made to react with 0.15-0.95 mol of a polybasic acid (d) per one epoxy-group equivalent weight to obtain a reaction product (e); and the epoxy group or groups on the reaction product (e) are further made to react with 1.0-5.0 mol of a monocarboxylic acid (f) per one epoxy-group equivalent weight. The carboxyl resin thus obtained has an acid value within a range from 20 to 200 mgKOH/g and is soluble in an organic solvent.
摘要翻译： 羧基树脂gemäß到本发明是通过一种方法，包括下述步骤获得：在具有两个或两个在一个分子以上环氧基的树脂（a）的环氧基团是由与0.3〜0.85摩尔的单羧酸的（b）反应 选择一个环氧基当量重量，得到反应生成物（c）; 对反应生成物（c）的环氧基团或基团是由用0.15-0.95摩尔每一个环氧基当量重量的多元羧酸（d）的反应，得到反应产物（S）; 和对反应产物（S）中的环氧基或基团是由用另外1.0-5.0摩尔，每一个环氧基当量重量的一元羧酸（f）的反应。 如此得到的含羧基树脂具有从20至200毫克KOH /克的范围内的酸值，且可溶于有机溶剂。
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公开(公告)号：EP2781530B1
公开(公告)日：2020-07-08
申请号：EP12849529.8
申请日：2012-11-13
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公开(公告)号：EP3232267B1
公开(公告)日：2019-11-27
申请号：EP15868034.8
申请日：2015-08-17
发明人： SAKAI, Yoshio , HIGUCHI, Michiya
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公开(公告)号：EP3232268B1
公开(公告)日：2019-05-08
申请号：EP14907967.5
申请日：2014-12-10
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公开(公告)号：EP3232268A1
公开(公告)日：2017-10-18
申请号：EP14907967.5
申请日：2014-12-10
CPC分类号： G03F7/029 , G03F7/004 , G03F7/031 , G03F7/038 , G03F7/16 , G03F7/168 , G03F7/2004 , G03F7/322 , G03F7/40 , H05K1/0353 , H05K3/285 , H05K2201/2081
摘要： A solder resist composition includes: a carboxyl group-containing resin; a photopolymerizable compound; a photopolymerization initiator containing a bisacylphosphine oxide-based photopolymerization initiator and an α-hydroxy allcylphenone-based photopolymerization initiator; and a phosphorescent dye. The bisacylphosphine oxide-based photopolymerization initiator contains bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide. The α-hydroxy alkylphenone-based photopolymerization initiator contains 2-hydroxy-2-methyl-1-phenyl-propane-1-one. A mass ratio of the bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide to the 2-hydroxy-2-methyl-1-phenyl-propane-1-one is 2:1 to 1:10.
摘要翻译： 阻焊剂组合物包含：含羧基的树脂; 可光聚合的化合物; 含有双酰基氧化膦系光聚合引发剂和α-羟基十六烷基苯甲酮系光聚合引发剂的光聚合引发剂， 和磷光染料。 双酰基氧化膦系光聚合引发剂含有双（2,4,6-三甲基苯甲酰基）苯基氧化膦。 α-羟基烷基苯基酮系光聚合引发剂含有2-羟基-2-甲基-1-苯基丙烷-1-酮。 双 - （2,4,6-三甲基苯甲酰基） - 苯基氧化膦与2-羟基-2-甲基-1-苯基 - 丙烷-1-酮的质量比为2:1至1:10。
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9.发明公开CARBOXYL-CONTAINING RESIN, RESIN COMPOSITION FOR USE IN SOLDER RESIST, AND MANUFACTURING PROCESS FOR CARBOXYL-CONTAINING RESIN 审中-公开含羧基树脂，树脂组合物用于阻焊AND METHOD FOR含羧基树脂
公开(公告)号：EP2781530A1
公开(公告)日：2014-09-24
申请号：EP12849529.8
申请日：2012-11-13
摘要： The objective of the present invention is to propose a carboxyl-containing resin which is less likely to gel and can form a solder mask layer with high electrical insulation reliability. The carboxyl-containing resin in accordance with the present invention has a structure resulting from addition of a carboxylic acid to at least one of epoxy groups of a biphenyl novolac epoxy resin. The carboxylic acid includes at least a polybasic acid.
摘要翻译： 本发明的目的是提出一种含羧基树脂，其全部是不太可能胶凝，并且可以形成具有高的电绝缘可靠性的焊料掩模层。 在雅舞蹈的含羧基树脂与本发明具有从加入羧酸联苯酚醛清漆型环氧树脂的环氧基团中的至少一个的产生的结构。 羧酸包括至少一个多元酸。
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公开(公告)号：EP2743286A1
公开(公告)日：2014-06-18
申请号：EP12821497.0
申请日：2012-06-20
CPC分类号： G03F7/0385 , C08G59/1466 , C08G59/40 , C08G59/42 , C08L63/10 , G03F7/027 , G03F7/032 , G03F7/038 , G03F7/0384 , G03F7/0388 , H05K3/287 , H05K3/3452
摘要： The present invention provides a resin composition for resist to be efficiently formed into a cured product with high properties of crack resistance, bulge resistance, protrusion resistance, and the like for filling a through-hole, a via hole, or the like with the cured product. The resin composition for masks in accordance with the present invention contains a first resin and a second resin. The first resin is prepared by an addition reaction of polybasic acid anhydride with an adduct of an ethylenically unsaturated compound having a carboxyl group and bifunctional epoxy resin. The second resin having: a group obtained by an addition reaction of an epoxy group with monocarboxylic acid; and a group obtained by addition reaction of an epoxy group with polybasic acid.
摘要翻译： 本发明提供了一种抗蚀剂用树脂组合物，其有效地形成为具有高耐龟裂性，耐膨胀性，突出性等的固化物，用于填充通孔，通孔等，其中固化 产品。 根据本发明的掩模用树脂组合物含有第一树脂和第二树脂。 第一树脂通过多元酸酐与具有羧基的烯属不饱和化合物和双官能环氧树脂的加合物的加成反应制备。 第二树脂具有：通过环氧基与一元羧酸的加成反应获得的基团; 和通过环氧基与多元酸的加成反应获得的基团。
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