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2.发明授权PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST COMPOSITION, AND COVER-PRINTED WIRING BOARD 有权光敏树脂组合物，焊料组合物和覆盖印刷线路板
公开(公告)号：EP3109701B1
公开(公告)日：2018-04-18
申请号：EP15867418.4
申请日：2015-08-17
发明人： SAKAI, Yoshio
IPC分类号： G03F7/004 , G03F7/029 , G03F7/031 , G03F7/038 , G03F7/20 , G03F7/26 , H05K1/02 , H05K1/03 , H05K3/28
CPC分类号： G03F7/031 , G03F7/0042 , G03F7/0043 , G03F7/029 , G03F7/038 , G03F7/0385 , G03F7/0388 , G03F7/20 , G03F7/2006 , G03F7/26 , G03F7/322 , H05K1/02 , H05K1/0274 , H05K1/0353 , H05K3/282 , H05K3/287 , H05K3/3452 , H05K2201/0166 , H05K2201/068
摘要： A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first ±-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25°C, and a second ±-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25°C.
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公开(公告)号：EP3232269B1
公开(公告)日：2019-05-15
申请号：EP14907950.1
申请日：2014-12-10
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公开(公告)号：EP3054350B1
公开(公告)日：2018-04-11
申请号：EP14866816.3
申请日：2014-12-10
CPC分类号： G03F7/031 , G03F7/0042 , G03F7/0043 , G03F7/029 , G03F7/038 , G03F7/0385 , G03F7/0388 , G03F7/20 , G03F7/2006 , G03F7/26 , G03F7/322 , H05K1/02 , H05K1/0274 , H05K1/0353 , H05K3/282 , H05K3/287 , H05K3/3452 , H05K2201/0166 , H05K2201/068
摘要： A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first ±-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25°C, and a second ±-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25°C.
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公开(公告)号：EP3264176A1
公开(公告)日：2018-01-03
申请号：EP16894285.2
申请日：2016-10-12
发明人： SAKAI, Yoshio
摘要： The present invention aims to provide a liquid solder resist composition in which a solder resist layer formed with the liquid solder resist composition can have a matte surface due to resin components in the composition. A liquid solder resist composition according to the present invention contains a carboxyl group-containing resin (A), a thermosetting component (B), a photopolymerizable component (C), a photopolymerization initiator (D), and a coloring agent (E). The thermosetting component (B) contains a powdery epoxy compound (B11) represented by following formula (1). An amount of the epoxy compound (B11) with respect to a total amount of the carboxyl group-containing resin (A), the thermosetting component (B), and the photopolymerizable component (C) is within a range of 15 to 40 weight%
摘要翻译： 本发明的目的在于提供一种液体阻焊剂组合物，其中由液体阻焊剂组合物形成的阻焊剂层由于组合物中的树脂组分而具有无光泽表面。 根据本发明的液体阻焊剂组合物含有含羧基的树脂（A），热固性组分（B），光聚合性组分（C），光聚合引发剂（D）和着色剂（E）。 热固性成分（B）含有下述式（1）所示的粉末状环氧化合物（B11）。 相对于含羧基树脂（A），热固化性成分（B）和光聚合性成分（C）的总量，环氧化合物（B11）的含量为15〜40重量％
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公开(公告)号：EP2781530B1
公开(公告)日：2020-07-08
申请号：EP12849529.8
申请日：2012-11-13
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公开(公告)号：EP3232267B1
公开(公告)日：2019-11-27
申请号：EP15868034.8
申请日：2015-08-17
发明人： SAKAI, Yoshio , HIGUCHI, Michiya
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公开(公告)号：EP3232268B1
公开(公告)日：2019-05-08
申请号：EP14907967.5
申请日：2014-12-10
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公开(公告)号：EP3422101A1
公开(公告)日：2019-01-02
申请号：EP16894284.5
申请日：2016-10-12
发明人： SAKAI, Yoshio
CPC分类号： G03F7/033 , G03F7/0047 , G03F7/029 , G03F7/031 , G03F7/038 , G03F7/0385 , G03F7/0388 , H05K1/0274 , H05K3/28 , H05K3/285 , H05K2201/2054
摘要： The present invention aims to provide a liquid solder resist composition which can be formed into a solder resist layer which is glossy and has a highly smooth surface despite containing a powdery hydroquinone epoxy compound. A liquid solder resist composition according to the present invention contains a carboxyl group-containing resin (A), a thermosetting component (B), a photopolymerizable component (C), and a photopolymerization initiator (D). The thermosetting component (B) contains a powdery epoxy compound (B11) represented by following formula (1).
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公开(公告)号：EP3232268A1
公开(公告)日：2017-10-18
申请号：EP14907967.5
申请日：2014-12-10
CPC分类号： G03F7/029 , G03F7/004 , G03F7/031 , G03F7/038 , G03F7/16 , G03F7/168 , G03F7/2004 , G03F7/322 , G03F7/40 , H05K1/0353 , H05K3/285 , H05K2201/2081
摘要： A solder resist composition includes: a carboxyl group-containing resin; a photopolymerizable compound; a photopolymerization initiator containing a bisacylphosphine oxide-based photopolymerization initiator and an α-hydroxy allcylphenone-based photopolymerization initiator; and a phosphorescent dye. The bisacylphosphine oxide-based photopolymerization initiator contains bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide. The α-hydroxy alkylphenone-based photopolymerization initiator contains 2-hydroxy-2-methyl-1-phenyl-propane-1-one. A mass ratio of the bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide to the 2-hydroxy-2-methyl-1-phenyl-propane-1-one is 2:1 to 1:10.
摘要翻译： 阻焊剂组合物包含：含羧基的树脂; 可光聚合的化合物; 含有双酰基氧化膦系光聚合引发剂和α-羟基十六烷基苯甲酮系光聚合引发剂的光聚合引发剂， 和磷光染料。 双酰基氧化膦系光聚合引发剂含有双（2,4,6-三甲基苯甲酰基）苯基氧化膦。 α-羟基烷基苯基酮系光聚合引发剂含有2-羟基-2-甲基-1-苯基丙烷-1-酮。 双 - （2,4,6-三甲基苯甲酰基） - 苯基氧化膦与2-羟基-2-甲基-1-苯基 - 丙烷-1-酮的质量比为2:1至1:10。
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