公开(公告)号：EP1083600A2

公开(公告)日：2001-03-14

申请号：EP00124369.0

申请日：1995-07-27

申请人： Hitachi, Ltd.

发明人： Tanei, Hirayoshi ,  Iwanaga, Shoichi ,  Okamoto, Masahide ,  Nakamura, Masato ,  Morita, Kousaku ,  Ishihara, Shousaku ,  Kobayashi, Fumiyuki ,  Tagami, Fumikazu ,  Sengoku, Norio ,  Fujita, Tsuyoshi

IPC分类号： H01L23/15

CPC分类号： C03C14/004 ,  C03C3/089 ,  C03C8/16 ,  C03C17/06 ,  C03C2217/253 ,  H01L21/4807 ,  H01L23/15 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K3/4629 ,  Y10S428/901

摘要： The present invention provides ceramic circuit substrate which is sintered at 900 to 1,050°C and have low relative dielectric constant, thermal expansion coefficient comparable to that of silicon, and high bending strength, and a method of manufacturing the same.
A glass is employed as row material, of which softening point is 850 to 1,100°C, that is, a glass having a composition included in an area in Fig. 1 (triangular composition diagram of SiO 2 -B 2 O 3 -R 2 O, a composition is represented by the position of a small circle, the number in a small circle represents the composition number) defined with lines connecting points representing the first, third, tenth, eleventh, and fourth compositions respectively.

摘要翻译： 本发明提供陶瓷电路基板，该陶瓷电路基板在900〜1050℃下烧结，相对介电常数低，与硅相当的热膨胀系数和高的弯曲强度，及其制造方法。 使用玻璃作为行材料，其软化点为850〜1100℃，即具有图1中的区域中的组成的玻璃。 图1（SiO 2 -B 2 O 3 -R 2 O的三角形组成图，组成由小圆的位置表示，小圆数表示组成数），用连接表示第一，第三，第十，第十一， 和第四组合物。

公开(公告)号：EP0697725A2

公开(公告)日：1996-02-21

申请号：EP95111855.3

申请日：1995-07-27

申请人： HITACHI, LTD.

发明人： Tanei, Hirayoshi ,  Iwanaga, Shoichi ,  Okamoto, Masahide ,  Nakamura, Masato ,  Morita, Kousaku ,  Ishihara, Shousaku ,  Kobayashi, Fumiyuki ,  Tagami, Fumikazu ,  Sengoku, Norio ,  Fujita, Tsuyoshi

IPC分类号： H01L23/15

CPC分类号： C03C14/004 ,  C03C3/089 ,  C03C8/16 ,  C03C17/06 ,  C03C2217/253 ,  H01L21/4807 ,  H01L23/15 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K3/4629 ,  Y10S428/901

摘要： The present invention provides ceramic circuit substrate which is sintered at 900 to 1,050°C and have low relative dielectric constant, thermal expansion coefficient comparable to that of silicon, and high bending strength, and a method of manufacturing the same.
A glass is employed as row material, of which softening point is 850 to 1,100°C, that is, a glass having a composition included in an area in Fig. 1 (triangular composition diagram of SiO₂-B₂O₃-R₂O, a composition is represented by the position of a small circle, the number in a small circle represents the composition number) defined with lines connecting points representing the first, third, tenth, eleventh, and fourth compositions respectively.

摘要翻译： 本发明提供陶瓷电路基板，该陶瓷电路基板在900〜1050℃下烧结，相对介电常数低，与硅相当的热膨胀系数和高的弯曲强度，及其制造方法。 使用玻璃作为行材料，其软化点为850〜1100℃，即具有图1中的区域的组成的玻璃。 图1（SiO 2 -B 2 O 3 -R 2 O的三角形组成图，组成由小圆的位置表示，小圆圈中的数字表示组成数），用连接表示第一，第三，第十，第十一， 和第四组合物。 $$

公开(公告)号：EP0169530A3

公开(公告)日：1987-01-14

申请号：EP85109136

申请日：1985-07-22

申请人： HITACHI, LTD.

发明人： Sengoku, Norio ,  Kozai, Hiroshi ,  Kobayashi, Fumiyuki

IPC分类号： H05K01/00

CPC分类号： H05K1/116 ,  H05K3/429 ,  H05K2201/093 ,  H05K2201/09718

摘要： In a multilayer printed circuit board including a signal layer (3'), a power supply layer (3), and through-holes (1A, 1B), the shape of each of clearances (2A, 2B) formed on a power supply layer (3) for the purpose of attaining insulation from through-holes (1A. 1B) is nearly a quadrangle having tour circular corners. Thereby, the area of the power supply layer (3) left between adjacent clearances (2A, 2B) is increased to suppress increase in electrical resistance at that portion.

公开(公告)号：EP1083600B1

公开(公告)日：2007-02-14

申请号：EP00124369.0

申请日：1995-07-27

申请人： Hitachi, Ltd.

发明人： Tanei, Hirayoshi ,  Iwanaga, Shoichi ,  Okamoto, Masahide ,  Nakamura, Masato ,  Morita, Kousaku ,  Ishihara, Shousaku ,  Kobayashi, Fumiyuki ,  Tagami, Fumikazu ,  Sengoku, Norio ,  Fujita, Tsuyoshi

IPC分类号： H01L23/15

CPC分类号： C03C14/004 ,  C03C3/089 ,  C03C8/16 ,  C03C17/06 ,  C03C2217/253 ,  H01L21/4807 ,  H01L23/15 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K3/4629 ,  Y10S428/901

公开(公告)号：EP1083600A3

公开(公告)日：2005-05-25

申请号：EP00124369.0

申请日：1995-07-27

申请人： Hitachi, Ltd.

发明人： Tanei, Hirayoshi ,  Iwanaga, Shoichi ,  Okamoto, Masahide ,  Nakamura, Masato ,  Morita, Kousaku ,  Ishihara, Shousaku ,  Kobayashi, Fumiyuki ,  Tagami, Fumikazu ,  Sengoku, Norio ,  Fujita, Tsuyoshi

IPC分类号： H01L23/15

CPC分类号： C03C14/004 ,  C03C3/089 ,  C03C8/16 ,  C03C17/06 ,  C03C2217/253 ,  H01L21/4807 ,  H01L23/15 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K3/4629 ,  Y10S428/901

摘要： The present invention provides ceramic circuit substrate which is sintered at 900 to 1,050°C and have low relative dielectric constant, thermal expansion coefficient comparable to that of silicon, and high bending strength, and a method of manufacturing the same. A glass is employed as row material, of which softening point is 850 to 1,100°C, that is, a glass having a composition included in an area in Fig. 1 (triangular composition diagram of SiO 2 -B 2 O 3 -R 2 O, a composition is represented by the position of a small circle, the number in a small circle represents the composition number) defined with lines connecting points representing the first, third, tenth, eleventh, and fourth compositions respectively.

公开(公告)号：EP0264105A2

公开(公告)日：1988-04-20

申请号：EP87114945.6

申请日：1987-10-13

申请人： HITACHI, LTD.

发明人： Imahashi, Fumio ,  Shirasawa, Hisato ,  Kawaguchi, Masami ,  Sengoku, Norio ,  Imai, Tsutomu

IPC分类号： H05K3/46 ,  H05K3/44

CPC分类号： H05K3/445 ,  H05K3/0052 ,  H05K3/4641 ,  H05K2201/0969 ,  H05K2203/143

摘要： Disclosed is a method of producing a multilayer printed-wiring board containing at least a metal plate (1) as an inner layer plate. The method comprises the steps of: forming as the metal plate a metal plate having a peripheral portion (3) which is a non-product portion, and a product portion (2) surrounded by the non-product portion, the peripheral portion (3) and the product portion (2) being partially connected; filling an insulating material (10) in non-­connecting portions (16) formed between the peripheral portion and the product portion; laminating the metal plate (1) with another inner layer plates to form a multilayer body (20); and separating the peripheral portion from the product portion within the regions (16) in which the insulating material (10) is filled.

摘要翻译： 公开了至少含有作为内层板的金属板（1）的多层印刷电路板的制造方法。 该方法包括以下步骤：将具有作为非产品部分的周边部分（3）和由非产品部分包围的产品部分（2）形成为金属板，周边部分（3） ）和产品部分（2）部分连接; 在形成在周边部分和产品部分之间的非连接部分（16）中填充绝缘材料（10）; 将金属板（1）与另一内层板层叠以形成多层体（20）; 以及在填充有所述绝缘材料（10）的区域（16）内分离所述产品部分的周边部分。

公开(公告)号：EP0697725B1

公开(公告)日：2002-11-20

申请号：EP95111855.3

申请日：1995-07-27

申请人： Hitachi, Ltd.

发明人： Tanei, Hirayoshi ,  Iwanaga, Shoichi ,  Okamoto, Masahide ,  Nakamura, Masato ,  Morita, Kousaku ,  Ishihara, Shousaku ,  Kobayashi, Fumiyuki ,  Tagami, Fumikazu ,  Sengoku, Norio ,  Fujita, Tsuyoshi

IPC分类号： H01L23/15

CPC分类号： C03C14/004 ,  C03C3/089 ,  C03C8/16 ,  C03C17/06 ,  C03C2217/253 ,  H01L21/4807 ,  H01L23/15 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K3/4629 ,  Y10S428/901

公开(公告)号：EP0697725A3

公开(公告)日：1997-02-19

申请号：EP95111855.3

申请日：1995-07-27

申请人： HITACHI, LTD.

发明人： Tanei, Hirayoshi ,  Iwanaga, Shoichi ,  Okamoto, Masahide ,  Nakamura, Masato ,  Morita, Kousaku ,  Ishihara, Shousaku ,  Kobayashi, Fumiyuki ,  Tagami, Fumikazu ,  Sengoku, Norio ,  Fujita, Tsuyoshi

IPC分类号： H01L23/15

CPC分类号： C03C14/004 ,  C03C3/089 ,  C03C8/16 ,  C03C17/06 ,  C03C2217/253 ,  H01L21/4807 ,  H01L23/15 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K3/4629 ,  Y10S428/901

摘要： The present invention provides ceramic circuit substrate which is sintered at 900 to 1,050°C and have low relative dielectric constant, thermal expansion coefficient comparable to that of silicon, and high bending strength, and a method of manufacturing the same. A glass is employed as row material, of which softening point is 850 to 1,100°C, that is, a glass having a composition included in an area in Fig. 1 (triangular composition diagram of SiO₂-B₂O₃-R₂O, a composition is represented by the position of a small circle, the number in a small circle represents the composition number) defined with lines connecting points representing the first, third, tenth, eleventh, and fourth compositions respectively.

公开(公告)号：EP0264105A3

公开(公告)日：1988-07-27

申请号：EP87114945

申请日：1987-10-13

申请人： HITACHI, LTD.

发明人： Imahashi, Fumio ,  Shirasawa, Hisato ,  Kawaguchi, Masami ,  Sengoku, Norio ,  Imai, Tsutomu

IPC分类号： H05K03/46 ,  H05K03/44

CPC分类号： H05K3/445 ,  H05K3/0052 ,  H05K3/4641 ,  H05K2201/0969 ,  H05K2203/143

摘要： Disclosed is a method of producing a multilayer printed-wiring board containing at least a metal plate (1) as an inner layer plate. The method comprises the steps of: forming as the metal plate a metal plate having a peripheral portion (3) which is a non-product portion, and a product portion (2) surrounded by the non-product portion, the peripheral portion (3) and the product portion (2) being partially connected; filling an insulating material (10) in non-­connecting portions (16) formed between the peripheral portion and the product portion; laminating the metal plate (1) with another inner layer plates to form a multilayer body (20); and separating the peripheral portion from the product portion within the regions (16) in which the insulating material (10) is filled.

公开(公告)号：EP0169530A2

公开(公告)日：1986-01-29

申请号：EP85109136.3

申请日：1985-07-22

申请人： HITACHI, LTD.

发明人： Sengoku, Norio ,  Kozai, Hiroshi ,  Kobayashi, Fumiyuki

IPC分类号： H05K1/00

CPC分类号： H05K1/116 ,  H05K3/429 ,  H05K2201/093 ,  H05K2201/09718

摘要： In a multilayer printed circuit board including a signal layer (3'), a power supply layer (3), and through-holes (1A, 1B), the shape of each of clearances (2A, 2B) formed on a power supply layer (3) for the purpose of attaining insulation from through-holes (1A. 1B) is nearly a quadrangle having tour circular corners. Thereby, the area of the power supply layer (3) left between adjacent clearances (2A, 2B) is increased to suppress increase in electrical resistance at that portion.