公开(公告)号：EP0276940A3

公开(公告)日：1990-05-30

申请号：EP88300399.8

申请日：1988-01-19

申请人： HITACHI, LTD.

发明人： Tanimoto, Michio ,  Ozawa, Masakazu ,  Okamoto, Michio ,  Yasuda, Hajime

IPC分类号： H01L23/49 ,  H01L21/60

CPC分类号： H01L24/85 ,  H01L23/4952 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48799 ,  H01L2224/4917 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83101 ,  H01L2224/83805 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20753 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01031 ,  H01L2924/3512 ,  H01L2224/48824 ,  H01L2924/01204 ,  H01L2224/83205 ,  H01L2924/07025 ,  H01L2924/0541 ,  H01L2924/05432

摘要： A resin-encapsulated integrated circuit has a semiconductor chip (2) whose bonding pads (2A) are connected to corresponding leads (3A) by wires (4). In order to achieve the correct interconnection of pads (2A) and leads (3A) some of the wires (4) intersect and to prevent short circuits they are coated in an insulator. This permits great design versatility as the pads and leads may be positioned as desired, rather than having inter­connected pads and leads adjacent each other, as is normal. The use of insulated wires also permits one or more of the bonding pads to be central on the chip rather than at its periphery, and some of the pads may be connected to remote leads.

摘要翻译： 树脂封装集成电路具有半导体芯片（2），其接合焊盘（2A）通过导线（4）连接到相应的引线（3A）。 为了实现焊盘（2A）和引线（3A）的正确互连，一些电线（4）相交并且防止短路，它们被涂覆在绝缘体中。 这样可以很好地设计通用性，因为焊盘和引线可以根据需要进行定位，而不是正常地将互连的焊盘和引线彼此相邻。 绝缘电线的使用还允许一个或多个焊盘在芯片上而不是在其周边处是中心的，并且一些焊盘可以连接到远程引线。

公开(公告)号：EP0276940A2

公开(公告)日：1988-08-03

申请号：EP88300399.8

申请日：1988-01-19

申请人： HITACHI, LTD.

发明人： Tanimoto, Michio ,  Ozawa, Masakazu ,  Okamoto, Michio ,  Yasuda, Hajime

IPC分类号： H01L23/49 ,  H01L21/60

CPC分类号： H01L24/85 ,  H01L23/4952 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48799 ,  H01L2224/4917 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83101 ,  H01L2224/83805 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20753 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01031 ,  H01L2924/3512 ,  H01L2224/48824 ,  H01L2924/01204 ,  H01L2224/83205 ,  H01L2924/07025 ,  H01L2924/0541 ,  H01L2924/05432

摘要： A resin-encapsulated integrated circuit has a semiconductor chip (2) whose bonding pads (2A) are connected to corresponding leads (3A) by wires (4). In order to achieve the correct interconnection of pads (2A) and leads (3A) some of the wires (4) intersect and to prevent short circuits they are coated in an insulator. This permits great design versatility as the pads and leads may be positioned as desired, rather than having inter­connected pads and leads adjacent each other, as is normal.
The use of insulated wires also permits one or more of the bonding pads to be central on the chip rather than at its periphery, and some of the pads may be connected to remote leads.

摘要翻译： 一种树脂封装的集成电路具有半导体芯片（2），其接合焊盘（2A）通过导线（4）被连接到相应的导线（3A）。 为了实现焊盘（2A）和导线（3A）某些金属丝的正确互连（4）相交，并防止短路它们涂在绝缘体上。 这允许伟大的设计灵活性如所需的垫和引线可以定位，而不是相互连接的垫，并导致相邻的海誓山盟，因为是正常的。 使用绝缘线的所以允许接合焊盘中的一个或多个是中央的芯片上而不是在其周边，并且一些焊盘可以连接到远程引线。