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1.发明公开POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT 审中-公开正感光树脂组成，方法用于生产涂料结构和电子元件的
公开(公告)号：EP2618216A4
公开(公告)日：2015-07-01
申请号：EP11825006
申请日：2011-09-02
发明人： TANIMOTO AKITOSHI , NOBE SHIGERU , KASUYA KEI , MATSUTANI HIROSHI , UENO TAKUMI , AOKI YU , TAHARA SHINGO
IPC分类号： G03F7/075 , G03F7/004 , G03F7/023 , H01L21/027
CPC分类号： G03F7/039 , G03F7/0226 , G03F7/0751 , G03F7/40 , H01L2224/11
摘要： The positive-type photosensitive resin composition according to the present invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound that produces an acid by light, a thermal crosslinking agent, and a silane compound having at least one functional group selected from an epoxy group and a sulfide group.
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2.发明公开PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, SEMICONDUCTOR ELEMENT AND ELECTRONIC DEVICE 审中-公开感光性树脂组合物，用于生产结构化硬化膜，半导体元件和电子设备
公开(公告)号：EP2916169A4
公开(公告)日：2016-10-19
申请号：EP13850182
申请日：2013-10-09
发明人： AOKI YU , NOBE SHIGERU , MATSUTANI HIROSHI , KASUYA KEI , TANIMOTO AKITOSHI , TAHARA SHINGO
IPC分类号： G03F7/023 , G03F7/004 , H01L21/027
CPC分类号： H01L21/0274 , C08F8/12 , C08F12/22 , C08F112/14 , C08F212/14 , C08F2800/10 , C08L25/18 , C09D125/18 , G03F7/0233 , G03F7/038 , G03F7/0388 , G03F7/40 , H01L21/02118 , H01L23/293 , H01L23/3114 , H01L23/5329 , H01L24/13 , H01L2224/02125 , H01L2224/0401 , H01L2224/05008 , H01L2224/05018 , H01L2224/05022 , H01L2224/05099 , H01L2224/05124 , H01L2224/05572 , H01L2224/05599 , H01L2224/10126 , H01L2224/13022 , H01L2224/131 , H01L2224/2919 , H01L2224/73104 , H01L2924/00014 , H01L2924/014 , C08F212/08 , C08L33/08 , C08F2220/1825 , C08F220/06 , C08F2220/1883 , C08F220/20 , C08F226/06 , C08F220/34
摘要： Disclosed is a photosensitive resin composition comprising (A) an alkali-soluble resin having a structural unit represented by the following formula (1), (B) a compound that generates an acid by light, (C) a thermal crosslinking agent, and (D) an acryl resin having a structural unit represented by the following formula (2): wherein R 1 represents a hydrogen atom or a methyl group; R 2 represents an alkyl group having 1 to 10 carbon atoms, or the like; and a represents an integer of 0 to 3, b represents an integer of 1 to 3, and the total of a and b is 5 or less, and wherein R 3 represents a hydrogen atom or a methyl group; and R 4 represents a hydroxyalkyl group having 2 to 20 carbon atoms.
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3.发明公开PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED FILM, AND ELECTRONIC COMPONENT 审中-公开感光性树脂组合物，用于生产结构化固化膜和电子元件的
公开(公告)号：EP2793082A4
公开(公告)日：2015-10-28
申请号：EP12857412
申请日：2012-10-31
发明人： TANIMOTO AKITOSHI , NOBE SHIGERU , KASUYA KEI , MATSUTANI HIROSHI , KATOGI SHIGEKI , AOKI YU , TAHARA SHINGO
CPC分类号： G03F7/0755 , G03F7/0045 , G03F7/0226 , G03F7/0233 , G03F7/0236
摘要： There is provided a photosensitive resin composition containing (A) an alkali-soluble resin, (B) a compound which generates an acid when exposed to light, (C) a thermal crosslinking agent, and (D) a nitrogen-containing aromatic compound represented by the following formula (1): wherein R 1 represents a hydrogen atom or a hydrocarbon group; R 2 represents a hydrogen atom, an amino group or a phenyl group; and A and B each independently represent a nitrogen atom, or a carbon atom and a hydrogen atom bonded thereto.
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