摘要:
The whole surface of a polycrystalline or amorphous semiconductor film (5) disposed so as to continuously cover the surface of a single-crystal substrate (3) and an insulating film (4) is irradiated with a laser beam or electron beam, thereby to selectively melt only those parts (5') of the polycrystalline or amorphous semiconductor film which overlie the insulating film. Thus, a single-crystal semiconductor film is formed on only the Insular inslating film (4) formed on the single-crystal substrate (3).
摘要:
A region (17) containing a high concentration of impurity and a desired region (18) adjacent thereto arefused by irradiation with a laser beam (10), to diffuse the impurity in the lateral direction into the desired region (18) and to render the desired region (18) a low resistance. Since this method can execute only the lateral diffusion of the impurity without affecting other portions, it is very useful for forming a high breakdown voltage MIS-FET, a resistor etc.
摘要:
At least one layer of insulator film (61-63) and single-crystal film (71-73) are alternately stacked and deposited on a surface of a semiconductor substrate (50), and an impurity-doped region (104-113) formed in each semiconductor film (71-73) is used as a gate, source or drain of a MOS transistor. Thus, a three-dimensional semiconductor device is constructed in which MOS transistors are arranged, not only in the direction of the semiconductor substrate surface, but also in a direction perpendicular thereto.
摘要:
A region (17) containing a high concentration of impurity and a desired region (18) adjacent thereto arefused by irradiation with a laser beam (10), to diffuse the impurity in the lateral direction into the desired region (18) and to render the desired region (18) a low resistance. Since this method can execute only the lateral diffusion of the impurity without affecting other portions, it is very useful for forming a high breakdown voltage MIS-FET, a resistor etc.
摘要:
An amorphous or polycrystalline film (3) which continuously covers the exposed surface (4) of a single crystal substrate (1) and an insulating film (2), is deposited in ultra-high vacuum and then heat-treated. The film is subjected to solid phase epitaxial growth at a temperature far lower than in prior art methods, whereby a single crystal film is formed.
摘要:
The whole surface of a polycrystalline or amorphous semiconductor film (5) disposed so as to continuously cover the surface of a single-crystal substrate (3) and an insulating film (4) is irradiated with a laser beam or electron beam, thereby to selectively melt only those parts (5') of the polycrystalline or amorphous semiconductor film which overlie the insulating film. Thus, a single-crystal semiconductor film is formed on only the Insular inslating film (4) formed on the single-crystal substrate (3).