公开(公告)号：EP1764833A4

公开(公告)日：2009-09-23

申请号：EP05777107

申请日：2005-08-30

Applicant: IBIDEN CO LTD ,  TIBC CO LTD

Inventor： KAWADE MASANORI ,  TSURUGA HIROYUKI ,  EBINA MAKOTO

IPC: H01L23/50 ,  H05K3/34

CPC classification number: H01L24/81 ,  H01L23/49811 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15312 ,  H05K3/3426 ,  H05K2201/10318 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2224/05599

公开(公告)号：EP1150551A4

公开(公告)日：2004-03-10

申请号：EP99973449

申请日：1999-11-17

Applicant: IBIDEN CO LTD

Inventor： HIROSE NAOHIRO ,  ITO HITOSHI ,  IWATA YOSHIYUKI ,  KAWADE MASANORI ,  YAZU HAJIME

IPC: H01L23/498 ,  H05K1/11 ,  H05K3/28 ,  H05K3/32 ,  H05K3/34 ,  H05K3/38 ,  H05K3/46

CPC classification number: H01L23/49811 ,  H01L2224/05001 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01322 ,  H01L2924/15312 ,  H05K1/111 ,  H05K1/112 ,  H05K3/28 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/09381 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/0979 ,  H05K2201/10318 ,  Y10T428/239

Abstract: On the board provided with a conductive layer (5), a pad (16) is formed to fix a conductive connecting pin (100) on a package board (310). The conduction connecting pin (100) serves as electrical connection to a motherboard. The pad (16) is coated with an organic-resin insulating layer (15) having an opening section (18) from which the pad (16) is partially exposed. The conductive connecting pin (100) is fixed to the pad exposed from the opening section using a conductive adhesive (17), preventing the conductive connecting pin (100) from separating off the board at the time of mounting.