公开(公告)号：EP0966185A1

公开(公告)日：1999-12-22

申请号：EP98900044.3

申请日：1998-01-05

Applicant: IBIDEN CO., LTD.

Inventor： TAKADA, Masaru ,  KOBAYASHI, Hiroyuki ,  CHIHARA, Kenji ,  MINOURA, Hisashi ,  TSUKADA, Kiyotaka ,  KONDO, Mitsuhiro

IPC: H05K3/00 ,  H05K3/34 ,  H05K3/24 ,  H05K3/28 ,  H05K1/11

CPC classification number: H05K3/28 ,  H01L24/32 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00011 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/15184 ,  H01L2924/15311 ,  H05K1/112 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/4602 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/068 ,  H05K2201/09527 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/107 ,  H05K2203/175 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2924/01033

Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

Abstract translation: 在具有导体电路（6）的绝缘板（7）的表面上印刷包括热固性树脂的阻焊剂。 然后将阻焊剂热固化以形成具有低热膨胀系数的绝缘膜（1）。 然后将激光束（2）施加到要形成开口的绝缘膜的部分，以烧掉用于形成开口（10）的相同部分，由此导体电路（6）暴露。 该开口可以通过在其内表面上形成金属电镀膜而形成为导电孔。 优选地，形成外部连接垫以覆盖开口。 通过使用在电镀完成后优选用激光束切断的电镀铅来形成金属涂膜。

公开(公告)号：EP1143776A1

公开(公告)日：2001-10-10

申请号：EP99931459.4

申请日：1999-07-21

Applicant: IBIDEN CO., LTD.

Inventor： TSUKADA, Kiyotaka ,  KONDO, Mitsuhiro ,  CHIHARA, Kenji ,  ISHIDA, Naoto ,  SHOUDA, Atsushi

IPC: H05K3/34 ,  H05K3/28

CPC classification number: H05K3/3452 ,  H01L23/3171 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/1148 ,  H01L2224/13021 ,  H01L2924/0002 ,  H05K3/3457 ,  H05K2201/098 ,  H05K2203/0594 ,  H01L2224/05552

Abstract: A printed circuit board 1 providing superior adhesion between a substrate 2 and a conductor pattern 3 and preventing damage of the substrate 2. The width c of the bottom surface 310 of the conductor pattern 3 is greater than the width d of the top surface 320. Accordingly, the conductor pattern 3 has a trapezoidal cross-section. The two side surfaces 315 of a lower portion 31 of the conductor pattern 3 are coated by a solder resist. The two side surfaces 325 at the upper portion 32 of the conductor pattern 3 are exposed from the solder resist 4. A solder ball 6 engages the two side surfaces 325.

公开(公告)号：EP0966185B1

公开(公告)日：2007-05-30

申请号：EP98900044.3

申请日：1998-01-05

Applicant: IBIDEN CO., LTD.

Inventor： TAKADA, Masaru ,  KOBAYASHI, Hiroyuki ,  CHIHARA, Kenji ,  MINOURA, Hisashi ,  TSUKADA, Kiyotaka ,  KONDO, Mitsuhiro

IPC: H05K3/00 ,  H05K3/34 ,  H05K3/24 ,  H05K3/28 ,  H05K1/11

CPC classification number: H05K3/28 ,  H01L24/32 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00011 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/15184 ,  H01L2924/15311 ,  H05K1/112 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/4602 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/068 ,  H05K2201/09527 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/107 ,  H05K2203/175 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2924/01033

Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

Abstract translation: 一种印刷电路板的制造方法，其中在绝缘基板（107）的表面上形成导体电路（106）。 接着，在所述绝缘基板（107）的表面上印刷由热固性树脂制成的阻焊剂。 然后通过热固化阻焊剂形成热膨胀系数等于或小于100ppm /℃的绝缘膜（101）。 接着，通过向绝缘膜（101）的开口部形成部照射激光而使该开口部形成部的绝缘膜（101）燃烧，形成开口部（110） ）。

公开(公告)号：EP1143776B1

公开(公告)日：2007-01-24

申请号：EP99931459.4

申请日：1999-07-21

Applicant: IBIDEN CO., LTD.

Inventor： TSUKADA, Kiyotaka ,  KONDO, Mitsuhiro ,  CHIHARA, Kenji ,  ISHIDA, Naoto ,  SHOUDA, Atsushi

IPC: H05K3/34 ,  H05K3/28

CPC classification number: H05K3/3452 ,  H01L23/3171 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/1148 ,  H01L2224/13021 ,  H01L2924/0002 ,  H05K3/3457 ,  H05K2201/098 ,  H05K2203/0594 ,  H01L2224/05552

Abstract: A printed-circuit board (1) has sufficient adhesion between its substrate (2) and conductor patterns (3) and protects the substrate (2) from damage. Each of the conductor patterns (3) has its bottom (310) with a width (c) greater than the width (d) of its top (320), i.e., its section is tropezoid. The conductor patterns (3) have lower parts (31) covered with solder resist (4) on both sides (315), and upper parts (32) exposed on both sides (325). Solder balls (6) are engaged with both sides (325).