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1.HIGH DENSITY CONNECTING SYSTEM AND METHOD FOR SEMI-CONDUCTOR DEVICES 失效
Title translation: 高密度连接系统和半导体器件的方法公开(公告)号:EP0059337A3
公开(公告)日:1983-08-17
申请号:EP82100843
申请日:1982-02-05
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: ECKER, MARIO ENRIQUE , OLSON, LEONARD THEODORE
IPC: H01L23/32 , H01L21/48 , H01L23/12 , H01L23/498 , H01L23/52 , H01L23/538 , H05K1/02 , H05K1/11 , H05K1/14 , H05K3/30 , H05K3/34 , H05K3/36 , H01L23/50 , H01L21/60
CPC classification number: H05K3/303 , H01L21/486 , H01L23/4985 , H01L23/5384 , H01L2224/16 , H01L2224/16225 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01322 , H01L2924/16152 , H05K1/0206 , H05K1/113 , H05K1/141 , H05K3/308 , H05K3/3447 , H05K3/3452 , H05K3/3457 , H05K3/363 , H05K2201/09472 , H05K2201/09509 , H05K2201/09572 , H05K2201/10659 , H05K2201/10666 , H05K2201/10681 , H05K2201/10727 , H05K2201/10878 , H05K2201/2036 , H05K2203/043 , Y02P70/613