公开(公告)号：EP0809862B1

公开(公告)日：1999-11-24

申请号：EP96901290.5

申请日：1996-01-17

申请人： International Business Machines Corporation ,  INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： BHATT, Ashwinkumar, Chinuprasad ,  DESAI, Subahu, Dhirubhai ,  DUFFY, Thomas, Patrick ,  KNIGHT, Jeffrey, Alan

IPC分类号： H01L23/498

CPC分类号： H05K1/021 ,  H01L23/145 ,  H01L23/3677 ,  H01L23/49822 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/09127 ,  H05K2201/09981 ,  H05K2203/049 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A chip carrier (10) for wire bond-type chips is disclosed. This chip carrier employs organic dielectric materials, rather than ceramic materials, as is conventional. This chip carrier also employs at least one organic, photoimageable dielectric layer (110), having plated photo-vias (120), to electrically interconnect two (or more) layers (80, 130) of fan-out circuitry. This chip carrier further employs a single-tiered cavity (140) to contain a chip (150), rather than a multi-tiered cavity,as is conventional. Moreover, this chip carrier includes thermal via holes (170) and/or a metallic layer (230), directly beneath the chip (150), to enhance heat dissipation.

摘要翻译： 公开了一种用于引线键合型芯片的芯片载体。 这种芯片载体采用有机电介质材料，而不是常规的陶瓷材料。 该芯片载体还采用至少一个具有电镀光通孔的有机光可成像介质层，以电连接两个（或多个）扇出电路层。 该芯片载体还采用单层空腔来容纳芯片而不是多层空腔，如常规的那样。 此外，该芯片载体包括直接在芯片下方的热通孔和/或金属层，以增强散热。

公开(公告)号：EP0809862A2

公开(公告)日：1997-12-03

申请号：EP96901290.0

申请日：1996-01-17

申请人： International Business Machines Corporation ,  INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： BHATT, Ashwinkumar, Chinuprasad ,  DESAI, Subahu, Dhirubhai ,  DUFFY, Thomas, Patrick ,  KNIGHT, Jeffrey, Alan

IPC分类号： H01L23 ,  H05K1 ,  H05K7 ,  H05K3

CPC分类号： H05K1/021 ,  H01L23/145 ,  H01L23/3677 ,  H01L23/49822 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/09127 ,  H05K2201/09981 ,  H05K2203/049 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A chip carrier (10) for wire bond-type chips is disclosed. This chip carrier employs organic dielectric materials, rather than ceramic materials, as is conventional. This chip carrier also employs at least one organic, photoimageable dielectric layer (110), having plated photo-vias (120), to electrically interconnect two (or more) layers (80, 130) of fan-out circuitry. This chip carrier further employs a single-tiered cavity (140) to contain a chip (150), rather than a multi-tiered cavity,as is conventional. Moreover, this chip carrier includes thermal via holes (170) and/or a metallic layer (230), directly beneath the chip (150), to enhance heat dissipation.