公开(公告)号：EP2752873A2

公开(公告)日：2014-07-09

申请号：EP14162557.4

申请日：2013-02-28

申请人： J-Devices Corporation

发明人： Umeki, Akihiro ,  Hiruta, Yoichi

IPC分类号： H01L25/03 ,  H01L25/065 ,  H01L21/66

CPC分类号： H01L23/28 ,  H01L21/56 ,  H01L22/32 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/34 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32155 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor module, having a semiconductor package, which is obtained by mounting and resin-sealing a semiconductor bare chip on a first package substrate; a semiconductor bare chip; and a second package substrate; wherein the semiconductor package is mounted on the second package substrate and the semiconductor bare chip is mounted on the semiconductor package, wherein the semiconductor package is bonded to the second package substrate at the resin surface and electrically connected to the second package substrate by wire bonding.

摘要翻译： 一种半导体模块，其具有半导体封装，该半导体封装通过在第一封装基板上安装并树脂密封半导体裸芯片而获得; 半导体裸芯片; 和第二封装衬底; 其中所述半导体封装件安装在所述第二封装件衬底上，并且所述半导体裸芯片安装在所述半导体封装件上，其中所述半导体封装件在所述树脂表面处接合到所述第二封装件衬底并且通过引线接合电连接到所述第二封装件衬底。

公开(公告)号：EP2720267A1

公开(公告)日：2014-04-16

申请号：EP13188322.5

申请日：2013-10-11

申请人： J-Devices Corporation

发明人： Itakura, Satoru ,  Katsumata, Akio ,  Umeki, Akihiro ,  Shiraishi, Yasushi ,  Abe, Junichiro

IPC分类号： H01L25/10 ,  H01L25/065 ,  H01L25/18 ,  G06F3/00

CPC分类号： G11C16/30 ,  G06F3/00 ,  G11C5/02 ,  G11C5/025 ,  G11C5/06 ,  G11C5/063 ,  G11C7/10 ,  G11C7/1069 ,  G11C11/4096 ,  H01L22/10 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/19105

摘要： A semiconductor storage device (100) includes a controller package (110) having a BGA terminal on a bottom surface thereof; and one or a plurality of memory packages (120) each including a plurality of semiconductor storage elements and mounted on the controller package. The controller package includes a bottom substrate having the BGA terminal on a bottom surface thereof; a power supply IC, mounted on the bottom substrate, for supplying a plurality of power supplies; and a controller mounted on the bottom substrate and operable by the plurality of power supplies supplied from the power supply IC. The controller provides an interface with an external system via the BGA terminal and controls a read operation from the semiconductor storage elements and a write operation to the semiconductor storage elements.

摘要翻译： 半导体存储装置（100）包括在其底面上具有BGA端子的控制器封装（110） 以及一个或多个存储器封装（120），每个存储器封装（120）包括多个半导体存储元件并且安装在所述控制器封装上。 所述控制器封装包括在其底表面上具有所述BGA端子的底部基板; 电源IC，安装在底部基板上，用于供给多个电源; 以及控制器，其安装在所述底部基板上并且可由所述电源IC提供的所述多个电源操作。 控制器通过BGA终端提供与外部系统的接口，并控制来自半导体存储元件的读取操作和对半导体存储元件的写入操作。

公开(公告)号：EP2752873A3

公开(公告)日：2014-09-24

申请号：EP14162557.4

申请日：2013-02-28

申请人： J-Devices Corporation

发明人： Umeki, Akihiro ,  Hiruta, Yoichi

IPC分类号： H01L25/03 ,  H01L25/065 ,  H01L21/66

CPC分类号： H01L23/28 ,  H01L21/56 ,  H01L22/32 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/34 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32155 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor module, having a semiconductor package, which is obtained by mounting and resin-sealing a semiconductor bare chip on a first package substrate; a semiconductor bare chip; and a second package substrate; wherein the semiconductor package is mounted on the second package substrate and the semiconductor bare chip is mounted on the semiconductor package, wherein the semiconductor package is bonded to the second package substrate at the resin surface and electrically connected to the second package substrate by wire bonding.

公开(公告)号：EP2645417A1

公开(公告)日：2013-10-02

申请号：EP13157205.9

申请日：2013-02-28

申请人： J-Devices Corporation

发明人： Umeki, Akihiro ,  Hiruta, Yoichi

IPC分类号： H01L25/03 ,  H01L25/065

CPC分类号： H01L23/28 ,  H01L21/56 ,  H01L22/32 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/34 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32155 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In the semiconductor module comprising a package substrate, a first semiconductor package, and a semiconductor bare chip, such problems as the occurrence of a wire short caused by warpage of the first semiconductor package and non-filling and the like at the time of resin sealing can be solved.
A semiconductor module (10), having: a semiconductor package (6), which is obtained by mounting and resin-sealing a semiconductor bare chip (1) on a first package substrate (4); a semiconductor bare chip 2; and a second package substrate (12), the semiconductor module being characterized in that the semiconductor package (6) is mounted on the second package substrate (12) and the semiconductor bare chip (2) is mounted on the semiconductor package (6).

摘要翻译： 在包括封装基板，第一半导体封装和半导体裸芯片的半导体模块中，在树脂密封时出现由第一半导体封装的翘曲引起的引线短路等的问题 可以解决 一种半导体模块（10），具有：半导体封装（6），其通过将半导体裸芯片（1）安装并树脂密封在第一封装基板（4）上而获得; 半导体裸芯片2; 和第二封装基板（12），所述半导体模块的特征在于，所述半导体封装（6）安装在所述第二封装基板（12）上，所述半导体裸芯片（2）安装在所述半导体封装（6）上。