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公开(公告)号：EP2306512A3
公开(公告)日：2012-08-08
申请号：EP11150797.6
申请日：2006-07-05
发明人： Otoshi, Kota , Kono, Eiji , Toh, Keiji , Tanaka, Katsufumi , Furukawa, Yuichi , Yamauchi, Shinobu , Hoshino, Ryoichi , Wakabayashi, Nobuhiro , Nakagawa, Shintaro
IPC分类号： H01L23/36 , H05K1/02 , H01L23/367 , H01L23/473 , H05K3/00 , H05K3/34
CPC分类号： H05K3/0061 , H01L23/367 , H01L23/3677 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H05K1/0306 , H05K3/341 , H05K2201/0373 , H05K2201/1028 , H05K2203/0405 , Y02P70/613 , H01L2924/00
摘要： A heat radiator (20) includes an insulating substrate (3) whose first side serves as a heat-generating-element-mounting side, and a heat sink (5) fixed to a second side of the insulating substrate. Two stress relaxation members (4) formed of a high-thermal-conduction material are disposed between the insulating substrate and the heat sink and include each a plate-like body (10) and a plurality of projections (11) formed on one side of the plate-like body. A side of the plate-like body of one stress relaxation member on which the projections are not formed is metal-bonded to the insulating substrate, whereas a side of the plate-like body of the other stress relaxation member on which the projections are not formed is metal-bonded to the heat sink. The projections of one stress relaxation member are positioned in respective gaps between the projections of the other stress relaxation member, and the end faces of the projections of one stress relaxation member being metal-bonded to the plate-like body of the other stress relaxation member, and vice versa.
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公开(公告)号：EP2863425A2
公开(公告)日：2015-04-22
申请号：EP15150109.5
申请日：2006-04-06
发明人： Otoshi, Kota , Kono, Eiji , Kubo, Hidehito , Kimbara, Masahiko , Furukawa, Yuichi , Yamauchi, Shinobu , Hoshino, Ryoichi , Wakabayashi, Nobuhiro , Nakagawa, Shintaro
IPC分类号： H01L23/36 , H01L23/367 , H01L23/473 , H05K3/00 , H05K3/34 , H01L23/373 , H05K1/03 , H05K3/40
CPC分类号： H01L23/367 , H01L23/3677 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H05K1/0306 , H05K3/0061 , H05K3/341 , H05K3/4015 , H05K2201/0373 , H05K2201/09681 , H05K2201/0969 , Y02P70/613 , H01L2924/00
摘要： A heat radiator (1) includes an insulating substrate (3) whose first side serves as a heat-generating-element-mounting side, and a heat sink (5) fixed to a second side of the insulating substrate (3). A metal layer (7) is formed on a side of the insulating substrate (3) opposite the heat-generating-element-mounting side. A stress relaxation member (4) intervenes between the metal layer (7) of the insulating substrate (3) and the heat sink (5). The stress relaxation member (4) is formed of an aluminum plate (10) having a plurality of through holes (9) formed therein, and the through holes (9) serve as stress-absorbing spaces. The stress relaxation member (4) is metal-bonded to the metal layer (7) of the insulating substrate (3) and to the heat sink (5). This heat radiator (1) is low in material cost and exhibits excellent heat radiation performance.
摘要翻译： 散热器（1）包括第一侧用作发热元件安装侧的绝缘基板（3）和固定到绝缘基板（3）的第二侧的散热片（5）。 金属层（7）形成在与发热元件安装侧相对的绝缘基板（3）侧。 应力松弛部件（4）介于绝缘基板（3）的金属层（7）和散热片（5）之间。 应力松弛部件（4）由形成有多个通孔（9）的铝板（10）形成，通孔（9）作为应力吸收空间。 应力松弛部件（4）与绝缘基板（3）的金属层（7）和散热片（5）金属接合。 该散热器（1）的材料成本低，散热性能优异。
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公开(公告)号：EP2306512A2
公开(公告)日：2011-04-06
申请号：EP11150797.6
申请日：2006-07-05
发明人： Otoshi, Kota , Kono, Eiji , Toh, Keiji , Tanaka, Katsufumi , Furukawa, Yuichi , Yamauchi, Shinobu , Hoshino, Ryoichi , Wakabayashi, Nobuhiro , Nakagawa, Shintaro
IPC分类号： H01L23/36 , H05K1/02 , H01L23/367
CPC分类号： H05K3/0061 , H01L23/367 , H01L23/3677 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H05K1/0306 , H05K3/341 , H05K2201/0373 , H05K2201/1028 , H05K2203/0405 , Y02P70/613 , H01L2924/00
摘要： A heat radiator (20) includes an insulating substrate (3) whose first side serves as a heat-generating-element-mounting side, and a heat sink (5) fixed to a second side of the insulating substrate. Two stress relaxation members (4) formed of a high-thermal-conduction material are disposed between the insulating substrate and the heat sink and include each a plate-like body (10) and a plurality of projections (11) formed on one side of the plate-like body. A side of the plate-like body of one stress relaxation member on which the projections are not formed is metal-bonded to the insulating substrate, whereas a side of the plate-like body of the other stress relaxation member on which the projections are not formed is metal-bonded to the heat sink. The projections of one stress relaxation member are positioned in respective gaps between the projections of the other stress relaxation member, and the end faces of the projections of one stress relaxation member being metal-bonded to the plate-like body of the other stress relaxation member, and vice versa.
摘要翻译： 散热器（20）包括第一侧用作发热元件安装侧的绝缘基板（3）和固定在绝缘基板的第二面上的散热片（5）。 在绝热基板和散热器之间设置由高导热材料形成的两个应力松弛部件（4），并且包括：板状体（10）和形成在该散热片的一侧的多个突起（11） 板状体。 没有形成有突起的一个应力松弛部件的板状体的一侧金属接合到绝缘基板，而另一个应力松弛部件的板状体的不具有突起的侧面 形成的金属结合到散热器。 一个应力缓和构件的突起位于另一个应力松弛构件的突起之间的相应间隙中，并且一个应力松弛构件的突起的端面金属接合到另一个应力松弛构件的板状体 ，反之亦然。
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公开(公告)号：EP2863425A3
公开(公告)日：2015-08-19
申请号：EP15150109.5
申请日：2006-04-06
发明人： Otoshi, Kota , Kono, Eiji , Kubo, Hidehito , Kimbara, Masahiko , Furukawa, Yuichi , Yamauchi, Shinobu , Hoshino, Ryoichi , Wakabayashi, Nobuhiro , Nakagawa, Shintaro
IPC分类号： H01L23/36 , H01L23/367 , H01L23/473 , H05K3/00 , H05K3/34 , H01L23/373 , H05K1/03 , H05K3/40
CPC分类号： H01L23/367 , H01L23/3677 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H05K1/0306 , H05K3/0061 , H05K3/341 , H05K3/4015 , H05K2201/0373 , H05K2201/09681 , H05K2201/0969 , Y02P70/613 , H01L2924/00
摘要： A heat radiator (1) includes an insulating substrate (3) whose first side serves as a heat-generating-element-mounting side, and a heat sink (5) fixed to a second side of the insulating substrate (3). A metal layer (7) is formed on a side of the insulating substrate (3) opposite the heat-generating-element-mounting side. A stress relaxation member (4) intervenes between the metal layer (7) of the insulating substrate (3) and the heat sink (5). The stress relaxation member (4) is formed of an aluminum plate (10) having a plurality of through holes (9) formed therein, and the through holes (9) serve as stress-absorbing spaces. The stress relaxation member (4) is metal-bonded to the metal layer (7) of the insulating substrate (3) and to the heat sink (5). This heat radiator (1) is low in material cost and exhibits excellent heat radiation performance.
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公开(公告)号：EP2306512B1
公开(公告)日：2014-09-03
申请号：EP11150797.6
申请日：2006-07-05
发明人： Otoshi, Kota , Kono, Eiji , Toh, Keiji , Tanaka, Katsufumi , Furukawa, Yuichi , Yamauchi, Shinobu , Hoshino, Ryoichi , Wakabayashi, Nobuhiro , Nakagawa, Shintaro
IPC分类号： H01L23/36 , H01L23/367 , H01L23/373 , H01L23/473 , H05K1/02 , H05K3/34 , H05K3/00 , H05K1/03
CPC分类号： H05K3/0061 , H01L23/367 , H01L23/3677 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H05K1/0306 , H05K3/341 , H05K2201/0373 , H05K2201/1028 , H05K2203/0405 , Y02P70/613 , H01L2924/00
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