VERFAHREN ZUR PLASMABEHANDLUNG VON WERKSTÜCKEN SOWIE WERKSTÜCK MIT GASBARRIERESCHICHT
    3.
    发明公开
    VERFAHREN ZUR PLASMABEHANDLUNG VON WERKSTÜCKEN SOWIE WERKSTÜCK MIT GASBARRIERESCHICHT 有权
    VERFAHREN ZUR PLASMABEHANDLUNG VONWERKSTÜCKEN

    公开(公告)号:EP2721192A1

    公开(公告)日:2014-04-23

    申请号:EP12731299.9

    申请日:2012-06-15

    摘要: The method serves for the plasma treatment of container-like workpieces. The workpiece is inserted into an at least partially evacuable chamber of a treatment station. The plasma chamber is bounded by a chamber base, a chamber cover and a lateral chamber wall. The plasma treatment causes a coating to be deposited on the workpiece. The plasma is ignited by microwave energy. The coating consists at least of a gas barrier layer and a bonding layer arranged between the workpiece and the gas barrier layer. The gas barrier layer contains SiOx and the bonding layer contains carbon. The gas barrier layer is produced from a gas that contains at least one silicon compound and argon.

    摘要翻译: 该方法用于容器状工件的等离子体处理。 工件被插入到处理台的至少部分可抽空的室中。 等离子体室由腔室基座,腔室盖和侧壁室限定。 等离子体处理导致涂层沉积在工件上。 等离子体被微波能量点燃。 该涂层至少包括阻气层和布置在工件和阻气层之间的粘合层。 阻气层含有SiO x,结合层含有碳。 阻气层由含有至少一种硅化合物和氩的气体制成。

    VERFAHREN UND VORRICHTUNG ZUR PLASMABEHANDLUNG VON WERKSTÜCKEN
    9.
    发明公开
    VERFAHREN UND VORRICHTUNG ZUR PLASMABEHANDLUNG VON WERKSTÜCKEN 审中-公开
    VERFAHREN UND VORRICHTUNG ZUR PLASMABEHANDLUNG VONWERKSTÜCKEN

    公开(公告)号:EP2630273A1

    公开(公告)日:2013-08-28

    申请号:EP11788021.1

    申请日:2011-09-01

    摘要: The method and the device are used to plasma-treat workpieces. The workpiece is inserted into a chamber of a treatment station that can be at least partially evacuated. The plasma chamber is bounded by a chamber bottom, a chamber cover, and a lateral chamber wall. A coating is deposited on the workpiece by means of the plasma treatment. The plasma is ignited by pulsed microwave energy. Switch-on phases and switch-off phases of a microwave input are specified by a controller. The relation between the duration of the switch-on phases and the duration of the switch-off phases is changed during the execution of the treatment process for a workpiece.

    摘要翻译: 该方法和装置用于等离子体处理工件。 工件被插入可至​​少部分抽空的处理站的腔室中。 等离子体腔室由腔室底部,腔室盖和侧室壁限定。 通过等离子体处理将涂层沉积在工件上。 等离子体被脉冲微波能量点燃。 微波输入的接通和断开阶段由控制器指定。 在执行工件的处理过程中,接通阶段的持续时间和关闭阶段的持续时间之间的关系被改变。