摘要:
Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first portion formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second portion formed on the first portion and configured to cover an upper surface of the first portion including the corner portion.
摘要:
A conductive pattern film substrate and manufacturing method for combining two anisotropic materials, namely a patterned body and a film layer, without assistance from an intermediate layer. The method includes producing a thermal spraying source for performing a heating operation on a film material to prepare the film material for thermal spraying or semi-thermal spraying and thereby decompose the film material into film particles; and spraying the film particles to a pattern layer disposed on the body and having the pattern by the thermal spraying source to form the film layer having the film particle on the pattern layer, thereby enabling the body to embody electrical characteristics of the pattern.
摘要:
A method is disclosed for aligning layers in fabricating a multilayer printable electronic device. The method entails providing a transparent substrate upon which a first metal layer is deposited, providing a transparent functional layer over the first metal layer, depositing metal nano particles over the functional layer to form a second metal layer, exposing the metal nano particles to intense pulsed light via an underside of the substrate to partially sinter exposed particles to the functional layer whereby the first metal layer acts as a photo mask, and washing away unexposed particles using a solvent to leave partially sintered metal nano particles on the substrate.
摘要:
An apparatus for transmitting electrical signals is disclosed. The apparatus includes a substrate and a twisted pair of conductors located on the substrate. The twisted pair of conductors has a first layer comprising conductive material, a second layer comprising nonconductive material, and a third player comprising conductive material. The first layer has a plurality of segments separated by a plurality of gaps. The second layer is positioned in said gaps and electrically insulates a portion of the segments positioned within the gaps. The third layer is positioned over the second layer. The third layer is configured to electrically connects an end of one segment to an end of another segment. The twisted pair of conductors formed by the three dimensional structure comprises two electrically isolated conductors twisted about each other.