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公开(公告)号：EP2906960A1
公开(公告)日：2015-08-19
申请号：EP13845360.0
申请日：2013-03-15
申请人： MC10 Inc.
CPC分类号： G06K19/025 , G01K1/022 , G06K7/10009 , G06K19/02 , G06K19/027 , G06K19/0708 , G06K19/0716 , G06K19/0717 , G06K19/0723 , G06K19/073 , G06K19/07749 , G06K19/07779 , G06K19/0779
摘要： A system is provided for integrating conformal electronics devices into apparel. The system includes a flexible substrate onto which a flexible device is disposed. The flexible device can include a stretchable coil that can be used to receive and transmit near field communications. The flexible device also includes an integrated circuit component and a memory unit. In some examples, the device also includes a sensor that is configured to record measurement of the wearer of the apparel and/or the surrounding environment.
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公开(公告)号：EP3054845A1
公开(公告)日：2016-08-17
申请号：EP14796931.5
申请日：2014-10-07
申请人： MC10, INC.
发明人： GHAFFARI, Roozbeh , KACYVENSKI, Isaiah , RAFFERTY, Conor , RAJ, Milan , CERUOLO, Melissa , HSU, Yung-Yu , KEEN, Bryan , MOREY, Briana , REILLY, Brian , WEI, Ping-Hung
IPC分类号： A61B5/11
CPC分类号： G09B19/00 , A61B5/0488 , A61B5/1118 , A61B5/1124 , A61B5/1126 , A61B5/7246 , A61B5/7275 , A61B2505/09 , G01P7/00 , G06F19/00 , G09B19/003 , G09B19/0038 , H04W4/38 , H04W4/80 , H04W80/00
摘要： Disclosed are systems, methods, and devices for sensing and analysis using conformal sensors. Aspects of this disclosure are directed to conformal sensor systems and devices for sensing and analysis of data indicative of body motion, e.g., for such applications as training and/or clinical purposes. According to the representative systems, methods, and devices disclosed in the specification, flexible electronics technology can be implemented as conformal sensors for sensing or measuring motion (including body motion and/or muscle activity), heart rate, electrical activity, and/or body temperature for such applications as medical diagnosis, medical treatment, physical activity, physical therapy and/or clinical purposes. The conformal sensors can be used for detecting and quantifying impact, and can be used for central nervous system disease monitoring.
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公开(公告)号：EP3010360A2
公开(公告)日：2016-04-27
申请号：EP14814195.5
申请日：2014-06-23
申请人： MC10, INC.
发明人： KEEN, Bryan , RAJ, Milan , HSU, Yung-Yu , KALITA, Nicholas , FENUCCIO, Jacob , GUPTA, Sanjay , RAFFERTY, Conor
IPC分类号： A41D20/00 , H05K3/00 , A61B5/0482
CPC分类号： H05K5/0217 , A61B5/01 , A61B5/021 , A61B5/024 , A61B5/04001 , A61B5/0402 , A61B5/0488 , A61B5/0531 , A61B5/11 , A61B5/1118 , A61B5/681 , A61B5/6824 , A61B2503/10 , A61B2505/09 , G08B5/36 , H01L23/3121 , H01L2924/0002 , H05K7/02 , H01L2924/00
摘要： An electronic device is disclosed that includes a band, a functional layer disposed over the band, neutral mechanical surface adjusting layers disposed over a portion of the functional layer, and encapsulating layers disposed over the neutral mechanical surface adjusting layers. The band includes a bistable structure having an extended conformation and a curved conformation. The functional layer includes a device island and a stretchable interconnect coupled to the device island at a junction region. At least one of the neutral mechanical surface adjusting layers can have a property that is spatially inhomogeneous relative to a location in the electronic device. The device island and stretchable interconnect are disposed about the band such that the device island and the junction region are disposed at areas of minimal strain of the electronic device in the curved conformation of the bistable structure.
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公开(公告)号：EP2764335A1
公开(公告)日：2014-08-13
申请号：EP12835576.5
申请日：2012-09-28
申请人： Mc10, Inc.
发明人： RAFFERTY, Conor , HSU, Yung-Yu , SCHLATKA, Ben , CALLSEN, Gilman
IPC分类号： G01J1/42
CPC分类号： A61B5/441 , A61B5/002 , A61B5/0531 , A61B5/443 , A61B5/6833 , A61B2560/0209 , A61B2560/0214 , A61B2560/0242 , A61B2562/0214 , A61B2562/125 , A61B2562/164 , A61B2562/187 , G01J1/429 , H04Q9/00 , H04Q2209/47 , H04Q2209/84
摘要： Apparatus are provided for monitoring a condition of a surface based on a measurement of a property of the surface using a sensor. In an example, the property is performed using an apparatus disposed above the tissue, where the apparatus includes at least one coil structure formed from a conductive material, at least one other component, and at least one cross-link structure physically coupling a portion of the at least one coil structure to a portion of the at least one other component, the at least one cross-link structure being formed from a flexible material. The at least one other component can be a sensor component or a processor unit.
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公开(公告)号：EP2943901A1
公开(公告)日：2015-11-18
申请号：EP14737652.9
申请日：2014-01-08
申请人： MC10, INC.
IPC分类号： G06F17/40
CPC分类号： A61B5/01 , A61B5/0008 , A61B5/0064 , A61B5/015 , A61B5/441 , A61B5/445 , A61B5/6833 , A61B5/7275 , G01J1/0219 , G01J1/429 , G01J5/00 , G01J5/0025 , G01J5/025 , G01K13/002 , G01N21/33
摘要： The systems, methods apparatus and devices are provided for monitoring a property of an object or an individual using a conformal sensor device mounted to a portion of a surface of the object or the individual. The method includes receiving data indicative of at least one measurement of at least one sensor component of a conformal sensor device that substantially conforms to contours of the surface to provide a degree of conformal contact. The method includes analyzing the data to generate at least one parameter indicative of the property of the surface and the degree of the conformal contact. The data indicative of the at least one measurement includes data indicative of the degree of the conformal contact. The property of the surface is at least one of: an amount of exposure of the surface to the electromagnetic radiation, and a temperature of the object or the individual.
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公开(公告)号：EP2907159A1
公开(公告)日：2015-08-19
申请号：EP13845644.7
申请日：2013-10-09
申请人： MC10 Inc.
发明人： RAFFERTY, Conor , DALAL, Mitul
IPC分类号： H01L23/13
CPC分类号： H01L23/4985 , H01L21/56 , H01L21/6836 , H01L23/16 , H01L23/3107 , H01L23/3121 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/82 , H01L2221/68327 , H01L2221/68381 , H01L2224/02379 , H01L2224/03436 , H01L2224/036 , H01L2224/0401 , H01L2224/04105 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05184 , H01L2224/05548 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/8203 , H01L2224/82039 , H01L2224/83132 , H01L2224/83192 , H01L2224/92244 , H01L2924/07802 , H01L2924/12042 , H01L2924/12043 , H01L2924/15153 , H05K1/0283 , H05K1/185 , H05K1/189 , H05K2203/1469 , H01L2924/00 , H01L2924/00014
摘要： Systems and methods are provided for the embedding of thin chips. A well region is generated in a substrate that includes a conductive material disposed on a flexible polymer. The standoff well region can be generated by pattern the conductive material, where the thin chip is embedded in the standoff well region. A cavity can be generated in the polymer layer to form a polymer well region, where the thin chip is embedded in the polymer well region.
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