摘要:
Laser light emitted from the wavelength-locked GaN semiconductor laser is collimated through a collimation lens, led through a polarization beam splitter and a 1/4 wavelength plate, and converged by a focus lens so as to be radiated on pits formed in an optical disk medium. The signal light from the optical disk medium is collimated by the focus lens, and has its polarization direction turned by the 1/4 wavelength plate by 90° relative to its polarization direction before being returned from the optical disk medium. As a result, the signal light is reflected from the polarization beam splitter so as to be converged on the optical detector by the focus lens.
摘要:
The method for fabricating a semiconductor includes the steps of: (1) growing a first semiconductor layer made of Al x Ga 1-x N (0≦x≦1) on a substrate at a temperature higher than room temperature; and (2) growing a second semiconductor layer made of Al u Ga v In w N (0
摘要翻译:用于制造半导体的方法,包括以下步骤:(1)生长由Al制成的第一半导体层X镓1-X N(0‰‰| X | 1)在高于室温的温度的基板; 和(2)生长由AlÙ镓V的W N的第二半导体层(0
摘要:
A GaN buffer layer (12) and an Si-doped n-type GaN contact layer (13) are formed in this order on a sapphire substrate (11). An n-type Al 0.3 Ga 0.7 N cladding layer (14), an n-type Al 0.25 Ga 0.75 N optical guide layer (15), a multi-quantum well active layer (16), in which Al 0.2 Ga 0.8 N well layers and Al 0.25 Ga 0.75 N barrier layers are alternately stacked, an Mg-doped p-type Al 0.25 Ga 0.75 N optical guide layer (17), a p-type Al 0.4 Ga 0.6 N 0.98 P 0.02 cladding layer (18) and a p-type GaN contact layer (19) are stacked in this order on an active region on the upper surface of the n-type contact layer.
摘要:
The method of fabricating a nitride semiconductor of this invention includes the steps of forming, on a substrate, a first nitride semiconductor layer of Al u Ga v In w N, wherein 0 ≦ u, v, w ≦ 1 and u + v + w = 1; forming, in an upper portion of the first nitride semiconductor layer, plural convexes extending at intervals along a substrate surface direction; forming a mask film for covering bottoms of recesses formed between the convexes adjacent to each other; and growing, on the first nitride semiconductor layer, a second nitride semiconductor layer of Al x Ga y In z N, wherein 0 ≦ x, y, z ≦ 1 and x + y + z = 1, by using, as a seed crystal, C planes corresponding to top faces of the convexes exposed from the mask film.
摘要:
The method for fabricating a nitride semiconductor of the present invention includes the steps of: (1) growing a first semiconductor layer made of a first group III nitride over a substrate by supplying a first group III source and a group V source containing nitrogen; and (2) growing a second semiconductor layer made of a second group III nitride on the first semiconductor layer by supplying a second group III source and a group V source containing nitrogen. At least one of the steps (1) and (2) includes the step of supplying a p-type dopant over the substrate, and an area near the interface between the first semiconductor layer and the second semiconductor layer is grown so that the density of the p-type dopant locally increases.
摘要:
Laser light emitted from the wavelength-locked GaN semiconductor laser is collimated through a collimation lens, led through a polarization beam splitter and a 1/4 wavelength plate, and converged by a focus lens so as to be radiated on pits formed in an optical disk medium. The signal light from the optical disk medium is collimated by the focus lens, and has its polarization direction turned by the 1/4 wavelength plate by 90° relative to its polarization direction before being returned from the optical disk medium. As a result, the signal light is reflected from the polarization beam splitter so as to be converged on the optical detector by the focus lens.
摘要:
Between a semiconductor laser diode (12) and an optical disk (11), a collimator lens (13) for collimating a laser beam output from the semiconductor laser diode, a liquid crystal optical shutter (14) for attenuating the collimated beam having passed through the collimator lens, and a beam splitter (15) for splitting reflected light from the optical disk are disposed. In addition, a collecting lens for collecting the collimated beam obtained by the collimator lens on a data holding surface of the optical disk (11) is further disposed.