摘要:
A semiconductor light-emitting device with a double hetero structure, including: an active layer made of Ga 1-x In x N (0 ≤ x ≤ 0.3) doped with a p-type impurity and an n-type impurity; and first and second cladding layers provided so as to sandwich the active layer.
摘要:
A semiconductor light emitting element includes a p-type electrode which in turn includes a contact electrode layer including at least a Pt layer. Particularly, the semiconductor light emitting element further includes a layered structure including at least an n-type cladding layer, an active layer, and a p-type cladding layer; and a p-type contact layer formed above the layered structure, and the contact electrode layer is formed on the p-type contact layer.
摘要:
Method for producing a semiconductor light-emitting device comprising the step of forming a semiconductor structure having a projected portion and a concave portion and mounting the semiconductor structure on a heat sink.
摘要:
The method of fabricating a nitride semiconductor of this invention includes the steps of forming, on a substrate, a first nitride semiconductor layer of Al u Ga v In w N, wherein 0 ≦ u, v, w ≦ 1 and u + v + w = 1; forming, in an upper portion of the first nitride semiconductor layer, plural convexes extending at intervals along a substrate surface direction; forming a mask film for covering bottoms of recesses formed between the convexes adjacent to each other; and growing, on the first nitride semiconductor layer, a second nitride semiconductor layer of Al x Ga y In z N, wherein 0 ≦ x, y, z ≦ 1 and x + y + z = 1, by using, as a seed crystal, C planes corresponding to top faces of the convexes exposed from the mask film.
摘要翻译:制造本发明的氮化物半导体的方法包括以下步骤:在衬底上形成AluGavInwN的第一氮化物半导体层,其中0≤v,w 1,u + v + w = 1 ; 在所述第一氮化物半导体层的上部形成沿着基板表面方向间隔地延伸的多个凸部; 形成用于覆盖形成在彼此相邻的凸起之间的凹部的底部的掩模膜; 并且在第一氮化物半导体层上生长Al x Ga y In z N的第二氮化物半导体层,其中0≤x,y,z 1,x + y + z = 1,通过使用晶种C 对应于从掩模膜暴露的凸起的顶面的平面。
摘要:
A GaN buffer layer (12) and an Si-doped n-type GaN contact layer (13) are formed in this order on a sapphire substrate (11). An n-type Al 0.3 Ga 0.7 N cladding layer (14), an n-type Al 0.25 Ga 0.75 N optical guide layer (15), a multi-quantum well active layer (16), in which Al 0.2 Ga 0.8 N well layers and Al 0.25 Ga 0.75 N barrier layers are alternately stacked, an Mg-doped p-type Al 0.25 Ga 0.75 N optical guide layer (17), a p-type Al 0.4 Ga 0.6 N 0.98 P 0.02 cladding layer (18) and a p-type GaN contact layer (19) are stacked in this order on an active region on the upper surface of the n-type contact layer.
摘要翻译:在蓝宝石衬底(11)上依次形成GaN缓冲层(12)和Si掺杂的n型GaN接触层(13)。 一种n型Al0.3Ga0.7N包层(14),n型Al0.25Ga0.75N光导层(15),多量子阱有源层(16),其中Al0.2Ga0.8N阱 Mg掺杂的p型Al 0.25 Ga 0.75 N光导层17,p型Al 0.4 Ga 0.6 N 0.98 P 0.02包层(18)和Al 0.25 Ga 0.75 N阻挡层交替堆叠, 和p型GaN接触层(19)以此顺序堆叠在n型接触层的上表面上的有源区上。
摘要:
A semiconductor laser including a semiconductor substrate and a multilayer structure formed upon the semiconductor substrate, the multilayer structure including an active layer, a pair of cladding layers between which the active layer is interposed, and a current confinement layer for injecting a current into a stripe-shaped predetermined region of the active layer. The current confinement layer comprises a first current blocking layer formed in regions thereof excluding a region corresponding to the predetermined region of the active layer. The first current blocking layer has a refractive index higher than a refractive index of the pair of cladding layers and an energy band gap larger than an energy band gap of the active layer.
摘要:
The present invention provides a manufacturing method that makes it possible to manufacture a substrate that is formed of high-quality Group III nitride crystals alone and has less warping. A Group III nitride layer (a seed layer 12 and a selective growth layer 15) including gaps is formed on a substrate (a sapphire substrate 11). In an atmosphere containing nitrogen, the surface of the Group III nitride layer is brought into contact with a melt containing alkali metal and at least one Group III element selected from gallium, aluminum, and indium, and thereby the at least one Group III element and the nitrogen are made to react with each other to grow Group III nitride crystals (GaN crystals 16) on the Group III nitride layer. Thereafter, a part including the substrate and a part including the Group III nitride crystals are separated from each other in the vicinities of the gaps.
摘要:
A GaN buffer layer (12) and an Si-doped n-type GaN contact layer (13) are formed in this order on a sapphire substrate (11). An n-type Al 0.3 Ga 0.7 N cladding layer (14), an n-type Al 0.25 Ga 0.75 N optical guide layer (15), a multi-quantum well active layer (16), in which Al 0.2 Ga 0.8 N well layers and Al 0.25 Ga 0.75 N barrier layers are alternately stacked, an Mg-doped p-type Al 0.25 Ga 0.75 N optical guide layer (17), a p-type Al 0.4 Ga 0.6 N 0.98 P 0.02 cladding layer (18) and a p-type GaN contact layer (19) are stacked in this order on an active region on the upper surface of the n-type contact layer.
摘要:
The present invention provides a manufacturing method that makes it possible to manufacture a substrate that is formed of high-quality Group III nitride crystals alone and has less warping. A Group III nitride layer (a seed layer 12 and a selective growth layer 15) including gaps is formed on a substrate (a sapphire substrate 11). In an atmosphere containing nitrogen, the surface of the Group III nitride layer is brought into contact with a melt containing alkali metal and at least one Group III element selected from gallium, aluminum, and indium, and thereby the at least one Group III element and the nitrogen are made to react with each other to grow Group III nitride crystals (GaN crystals 16) on the Group III nitride layer. Thereafter, a part including the substrate and a part including the Group III nitride crystals are separated from each other in the vicinities of the gaps.