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    TRANSPARENT ALN SINTERED BODY, AND PRODUCTION METHOD THEREFOR
    2.
    发明公开
    TRANSPARENT ALN SINTERED BODY, AND PRODUCTION METHOD THEREFOR 审中-公开

    公开(公告)号：EP3560905A1

    公开(公告)日：2019-10-30

    申请号：EP17885115.0

    申请日：2017-12-20

    申请人： NGK Insulators, Ltd.

    发明人： KOBAYASHI, Yoshimasa ,  KOBAYASHI, Hiroharu ,  IIDA, Kazuki ,  OHWADA, Iwao

    IPC分类号： C04B35/581 ,  C04B35/645

    摘要： In a first step of a method for producing a transparent AlN sintered body, first, a formed body is prepared by forming a mixture obtained by mixing a sintering aid with an AlN raw-material powder containing a plate-like AlN powder whose plate surface is a c-plane and which has an aspect ratio of 3 or more. At this time, the mixture is formed such that the plate surface of the plate-like AlN powder is disposed along a surface of the formed body. In a second step, an oriented AlN sintered body is obtained by subjecting the formed body to hot-press sintering in a non-oxidizing atmosphere while applying a pressure to the surface of the formed body. In a third step, a transparent AlN sintered body is obtained by sintering the oriented AlN sintered body at normal pressure in a non-oxidizing atmosphere to remove a component derived from the sintering aid.

    POROUS CERAMIC PARTICLES AND POROUS CERAMIC STRUCTURE
    4.
    发明公开
    POROUS CERAMIC PARTICLES AND POROUS CERAMIC STRUCTURE 审中-公开

    公开(公告)号：EP3492442A1

    公开(公告)日：2019-06-05

    申请号：EP17833870.3

    申请日：2017-06-09

    申请人： NGK Insulators, Ltd.

    发明人： ORIBE, Akinobu ,  TOMITA, Takahiro ,  KOBAYASHI, Hiroharu

    IPC分类号： C04B41/85 ,  B32B18/00 ,  C04B38/08

    摘要： A porous ceramic particle (16) includes a porous portion (61) and a dense layer (62). The porous portion (61) has a plate-like shape and a pair of main surfaces (611) in parallel with each other. The dense layer (62) has porosity lower than that of the porous portion (61) and covers at least one main surface (611) among the pair of main surfaces (611) of the porous portion (61). A portion of a surface of the porous portion (61), which is other than the pair of main surfaces (611), is exposed from the dense layer (62). It is thereby possible to provide a porous ceramic particle (16) of low thermal conductivity and low heat capacity.

    BONDED BODIES FOR OPTICAL MODULATORS, OPTICAL MODULATORS AND A METHOD OF PRODUCING BONDED BODIES FOR OPTICAL MODULATORS
    6.
    发明公开
    BONDED BODIES FOR OPTICAL MODULATORS, OPTICAL MODULATORS AND A METHOD OF PRODUCING BONDED BODIES FOR OPTICAL MODULATORS 审中-公开

    公开(公告)号：EP3800501A1

    公开(公告)日：2021-04-07

    申请号：EP20199651.9

    申请日：2020-10-01

    申请人： NGK Insulators, Ltd.

    发明人： TAI, Tomoyoshi ,  UNO, Yudai ,  KONDO, Jungo ,  KOBAYASHI, Yoshimasa ,  HISHIKI, Tatsuya ,  KOBAYASHI, Hiroharu

    IPC分类号： G02F1/035

    摘要： (Object) In an optical modulator and a bonded body for the optical modulator produced by bonding an optical waveguide material composed of lithium niobate or the like onto a supporting substrate, the object is to suppress the cracks of the optical waveguide material due to annealing and to improve the optical response characteristics of the optical modulator with respect to frequency.
    (Solution) A bonded body 6 for an optical modulator includes a supporting substrate 4, an optical waveguide material 7 provided on the supporting substrate 4 and composed of lithium niobate, lithium tantalate and lithium niobate-lithium tantalate, and an optical waveguide 8 in the optical waveguide material 7. The supporting substrate 4 is composed of a material selected from the group consisting of magnesium oxide and a magnesium-silicon composite oxide.

    ORIENTED ALN SINTERED BODY, AND PRODUCTION METHOD THEREFOR
    7.
    发明公开
    ORIENTED ALN SINTERED BODY, AND PRODUCTION METHOD THEREFOR 审中-公开

    公开(公告)号：EP3560904A1

    公开(公告)日：2019-10-30

    申请号：EP17884131.8

    申请日：2017-12-20

    申请人： NGK Insulators, Ltd.

    发明人： KOBAYASHI, Yoshimasa ,  KOBAYASHI, Hiroharu ,  IIDA, Kazuki

    IPC分类号： C04B35/581

    摘要： In a first step of a method for producing an oriented AlN sintered body, a formed body is prepared by forming a mixture obtained by mixing a sintering aid with an AlN raw-material powder containing a plate-like AlN powder whose plate surface is a c-plane and which has an aspect ratio of 3 or more and an average thickness of 0.05 to 1.8 µm, in which the mixture is formed such that the plate surface of the plate-like AlN powder is disposed along a surface of the formed body. In a second step, an oriented AlN sintered body is obtained by subjecting the formed body to hot-press sintering in a non-oxidizing atmosphere while applying a pressure to the surface of the formed body.

    HEAT-INSULATION FILM, AND HEAT-INSULATION-FILM STRUCTURE
    8.
    发明公开
    HEAT-INSULATION FILM, AND HEAT-INSULATION-FILM STRUCTURE 审中-公开
    WÄRMEISOLIERUNGSSCHICHTUNDWÄRMEISOLIERUNGSSCHICHTSTRUKTUR

    公开(公告)号：EP3073171A1

    公开(公告)日：2016-09-28

    申请号：EP14863720.0

    申请日：2014-11-04

    申请人： NGK Insulators, Ltd.

    发明人： KOBAYASHI, Hiroharu ,  TOMITA, Takahiro ,  ORIBE, Akinobu

    IPC分类号： F16L59/00 ,  B32B5/18 ,  C04B38/00 ,  F02F1/00 ,  F02F1/24 ,  F02F1/42

    CPC分类号： F02F3/12 ,  B32B9/005 ,  B32B27/20 ,  B32B2264/102 ,  B32B2307/304 ,  B32B2307/3065 ,  B32B2307/554 ,  C04B38/00 ,  F02F1/00 ,  F02F1/24 ,  F02F1/42 ,  F02F2001/249

    摘要： There are provided a heat-insulation film in which a heat insulation effect improves, and a heat-insulation-film structure. In a heat-insulation film 3, porous plate fillers 1 are dispersed in a matrix 3m to bond the porous plate fillers 1. The porous plate filler 1 includes plates having an aspect ratio of 3 or more, a minimum length of 0.1 to 50 µm and a porosity of 20 to 90%. In the heat-insulation film 3, a volume ratio between the porous plate fillers and the matrix is from 50:50 to 95:5. In the heat-insulation film 3 in which the porous plate fillers 1 are used, a length of a heat transfer path increases and a thermal conductivity can be decreased, as compared with a case where spherical or cubic fillers are used.

    摘要翻译： 提供了隔热效果提高的绝热膜和隔热膜结构。 在绝热膜3中，将多孔板填料1分散在基体3m中以结合多孔板填料1.多孔板填料1包括纵横比为3以上，最小长度为0.1〜50μm的板 孔隙率为20〜90％。 在绝热膜3中，多孔板填料与基体的体积比为50:50〜95:5。 在使用多孔板填料1的隔热膜3中，与使用球形或立方体填料的情况相比，传热路径的长度增加，导热性能降低。

    THERMAL DIODE
    9.
    发明公开
    THERMAL DIODE 审中-公开
    热敏二极管

    公开(公告)号：EP3043136A1

    公开(公告)日：2016-07-13

    申请号：EP14840639.0

    申请日：2014-09-01

    申请人： NGK Insulators, Ltd.

    发明人： TOMITA, Takahiro ,  NAGAI, Kenkichi ,  KOBAYASHI, Hiroharu

    IPC分类号： F28D15/02 ,  H01L23/373

    CPC分类号： F28F13/00 ,  F28F2013/001 ,  F28F2013/005 ,  F28F2013/008 ,  H01L23/3731 ,  H01L23/3733 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Provided is a thermal diode 3 that can be used at room temperature and that easily transfers heat in a certain direction. The thermal diode 3 is formed of a first material 1 as a ceramic material exhibiting thermal conductivity that increases in a certain temperature range of -200°C or higher but 1000°C or lower and a second material 2 exhibiting the thermal conductivity that decreases in the temperature range, the first material 1 and the second material 2 being bonded together. The first material 1 has preferably a microstructure having a characteristic length L a of 1 nm to 10 µm.

    摘要翻译： 提供了可以在室温下使用并且容易地在一定方向上传递热量的热二极管3。 热二极管3由作为陶瓷材料的第一材料1形成，该陶瓷材料具有在-200℃以上但1000℃以下的一定温度范围内增加的导热性，第二材料2的导热性降低 温度范围，第一材料1和第二材料2结合在一起。 第一材料1优选具有1nm至10μm的特征长度L a的微结构。