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1.发明公开Glass-ceramic composition, circuit substrate using the same and manufacture method thereof 有权Glaskeramische Zusammensetzung，aus diesem材料entstandenes Schaltkreissubstrat sowie dessen Herstellung
公开(公告)号：EP1074524A1
公开(公告)日：2001-02-07
申请号：EP99114996.4
申请日：1999-07-31
CPC分类号： H01L24/97 , C03C3/108 , C03C8/14 , C03C14/004 , C03C2214/04 , H01L23/15 , H01L23/49805 , H01L24/48 , H01L2224/48091 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H05K1/0306 , Y10T29/49117 , Y10T29/49126 , Y10T29/49149 , Y10T428/24917 , H01L2224/85 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： In the glass-ceramic composition, a weight ratio of a glass and a ceramic is 40 to 60:60 to 40. The glass is composed of 40 to 60 wt% of SiO 2 , 5 to 9 wt% of Al 2 O 3 , 1 to 10 wt% of B 2 O 3 , 3 to 5 wt% of Na 2 O+K 2 O, 3 to 15 wt% of CaO+MgO+ZnO, and 15 to 40 wt% of PbO, and does not contain Li 2 O. A softening point of the glass is 650 to 780°C. The circuit substrate includes a laminate substrate formed by laminating insulating substrates, and a conductor circuit formed on a surface of each insulating substrate. The insulating substrate is formed of the glass-ceramic composition. A wiring layer and a via hole conductor are provided inside the laminate substrate.
摘要翻译： 在玻璃 - 陶瓷组合物中，玻璃和陶瓷的重量比为40〜60:60〜40。玻璃由40〜60重量％的SiO 2，5〜9重量％的Al 2 O 3，1〜10重量％ B 2 O 3，3〜5重量％的Na 2 O + K 2 O，3〜15重量％的CaO + MgO + ZnO，15〜40重量％的PbO，不含有Li 2 O。 玻璃的软化点为650〜780℃。电路基板包括通过层压绝缘基板形成的层压基板和形成在每个绝缘基板的表面上的导体电路。 绝缘基板由玻璃 - 陶瓷组合物形成。 布线层和通孔导体设置在层叠基板的内部。
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2.发明授权Glass-ceramic composition, circuit substrate using the same and manufacture method thereof 有权玻璃质陶瓷组合物从这些材料中电路基板和其制造过程产生的
公开(公告)号：EP1074524B1
公开(公告)日：2005-06-15
申请号：EP99114996.4
申请日：1999-07-31
CPC分类号： H01L24/97 , C03C3/108 , C03C8/14 , C03C14/004 , C03C2214/04 , H01L23/15 , H01L23/49805 , H01L24/48 , H01L2224/48091 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H05K1/0306 , Y10T29/49117 , Y10T29/49126 , Y10T29/49149 , Y10T428/24917 , H01L2224/85 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
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