Glass for encapsulating semiconductor and overcoat tube for encapsulating semiconductor using the same
    3.
    发明公开
    Glass for encapsulating semiconductor and overcoat tube for encapsulating semiconductor using the same 无效
    像玻璃用于封装半导体和套管用于封装半导体,与使用

    公开(公告)号:EP1219572A1

    公开(公告)日:2002-07-03

    申请号:EP01130663.6

    申请日:2001-12-21

    摘要: The present invention provides a glass for encapsulating a semiconductor comprising: SiO 2 in an amount of from 20 to 50% by weight; Al 2 O 3 in an amount of from 1 to 12% by weight; B 2 O 3 in an amount of from 6 to 25% by weight; PbO in an amount of from 30 to 55% by weight; Cs 2 O in an amount of from 0.5 to 12% by weight; and Li 2 O, Na 2 O and K 2 O in a total amount of lower than 90 ppm, each based on the total weight of the glass.

    摘要翻译: 本发明提供了用于封装半导体包含玻璃:以重量为20〜50%的量的SiO 2; AL2O3重量在1至12%的量; B2O3重量在6至25%的量; 的PbO重量在从30至55%的量; 重量的Cs 2 O中在从0.5至12%的量; 和的Li2O,Na2O和K2O中低于90 ppm的总量,各自基于玻璃的总重量计。